CN102332626A - 150-watt load sheet of large power aluminium nitride ceramic substrate with impedance of 50 ohms - Google Patents
150-watt load sheet of large power aluminium nitride ceramic substrate with impedance of 50 ohms Download PDFInfo
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- CN102332626A CN102332626A CN201110205631A CN201110205631A CN102332626A CN 102332626 A CN102332626 A CN 102332626A CN 201110205631 A CN201110205631 A CN 201110205631A CN 201110205631 A CN201110205631 A CN 201110205631A CN 102332626 A CN102332626 A CN 102332626A
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Abstract
The invention discloses a 150-watt load sheet of a large power aluminium nitride ceramic substrate with an impedance of 50 ohms. The load sheet comprises an aluminium nitride substrate with a size of 8.7 * 5.9 * 1 square millimeters; a back conductive layer is printed on a right side of the aluminium nitride substrate; and a resistance and a lead are printed at the right side of the aluminium nitride substrate; the lead is connected with the resistance to form a load circuit; and a grounding terminal of the load circuit is electrically connected with the back conductive layer and the resistance is arranged transversely. According to the 150-watt load sheet of the large power aluminium nitride ceramic substrate with the impedance of 50 ohms provided in the invention, a resistance is arranged transversely and the resistance can be stretched during the design, so that an area of the resistance is increased and a circuit design can be optimized; and a substrate with the size of 8.7 * 5.9 * 1 square millimeters can bear a power of 150 watts, wherein the substrate with the size of 8.7 * 5.9 * 1 square millimeters can only bear 100 watts originally. Meanwhile, the load sheet can meet requirements on practical application in respect of characteristics, so that the load sheet has good VSWR performances and can be well matched with equipment.
Description
Technical field
The present invention relates to a kind of aluminium nitride ceramics substrate carrier sheet, and particularly a kind of impedance is the high-power aluminium nitride ceramics substrate 150 tile load sheets of 50 Ω.
Background technology
Aluminium nitride ceramics substrate carrier sheet is mainly used in the power that in communication base station, absorbs reverse input in the communication component, if can not bear the power of requirement, load will burn out, and possibly cause entire equipment to burn out.Present most of communication base station all is that utilizing high power pottery carrier sheet absorbs reverse input power in the communication component, requires basic size more and more littler, and needs power absorbed increasing.
At present to reach 150 tile load sheets a kind of be to select the BeO material for use to state's internal power, and this material is poisonous, is easy in process of production environment is polluted, and producers healthy brought certain harm.Another kind is to use the aluminium nitride substrate (substrate size is 9.55*6.35*1mm) of large-size, and this large-sized aluminium nitride substrate does not satisfy the requirement of current base station miniaturization.Present domestic aluminium nitride substrate can only be made the carrier sheet that can bear 100W power on the size of 8.7*5.9*1mm.
Summary of the invention
To the deficiency of above-mentioned prior art, the technical problem that the present invention will solve provides a kind of carrier sheet that can on the 8.7*5.9*1mm substrate, carry 150W power.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of impedance is the high-power aluminium nitride ceramics substrate 150 tile load sheets of 50 Ω; It comprises the aluminium nitride substrate of a 8.7*5.9*1mm; The front of said aluminium nitride substrate is printed with back of the body conducting shell, and the front of said aluminium nitride substrate is printed with resistance and lead, and said lead connects said resistance and forms load circuit; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, said resistance transverse arrangement of turbo.
Preferably, the pad of said load circuit is provided with Gold plated Layer.
Preferably, be printed with glass protection film on the said resistance, the upper surface of said lead and glass protection film also is printed with one deck black protective film.
Preferably, said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Technique scheme has following beneficial effect: this impedance is the resistance transverse arrangement of turbo of the high-power aluminium nitride ceramics substrate 150 tile load sheets of 50 Ω; When design, can elongate like this resistance; Thereby increase the area of resistance; Optimize the design of circuit, make and to bear 100 watts originally and be of a size of and bear 150 watts power on the 8.7*5.9*1mm substrate, also can make carrier sheet aspect characteristic, satisfy requirement of actual application simultaneously; Make it have good VSWR performance, can be better and equipment mate.
Above-mentioned explanation only is the general introduction of technical scheme of the present invention, understands technological means of the present invention in order can more to know, and can implement according to the content of specification, below with preferred embodiment of the present invention and conjunction with figs. specify as after.Embodiment of the present invention is provided by following examples and accompanying drawing thereof in detail.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing the preferred embodiments of the present invention are described in detail.
As shown in Figure 1; This impedance is the aluminium nitride substrate 1 that the high-power aluminium nitride ceramics substrate 150 tile load sheets of 50 Ω comprise a 8.7*5.9*1mm; The back up of aluminium nitride substrate 1 has back of the body conducting shell, and the front of aluminium nitride substrate is printed with lead 2 and resistance 3, resistance 3 transverse arrangement of turbo. and resistance 3 is connected to form load circuit through lead 2; The earth terminal of load circuit is electrically connected through the silver slurry with back of the body conducting shell, can make load circuit ground connection form the loop like this.Be printed with glass protection film 4 on the resistance 3, the upper surface of lead 2 and glass protection film 4 also is printed with one deck black protective film 5, can form effectively protection to lead 2, resistance 3 and glass protection film 4 like this.Back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.Load circuit is provided with the pad with wire bonds, and pad is provided with Gold plated Layer.
This impedance is the resistance transverse arrangement of turbo of the high-power aluminium nitride ceramics substrate 150 tile load sheets of 50 Ω; When design, can elongate like this, thereby the area of increase resistance is optimized the design of circuit resistance; Make and to bear 100 watts originally and be of a size of and bear 150 watts power on the 8.7*5.9*1mm substrate; Simultaneously also can make carrier sheet aspect characteristic, satisfy requirement of actual application, make it have good VSWR performance, can be better and equipment mate.Pad is provided with Gold plated Layer, can guarantee like this in reflow soldering process, with the alkalescent cleaning agent carrier sheet not to be cleaned and can cause adverse effect to welding effect.
More than be that the high-power aluminium nitride ceramics substrate 150 tile load sheets of 50 Ω have carried out detailed introduction to a kind of impedance that the embodiment of the invention provided; For one of ordinary skill in the art; According to the thought of the embodiment of the invention, the part that on embodiment and range of application, all can change, in sum; This description should not be construed as limitation of the present invention, and all any changes of making according to design philosophy of the present invention are all within protection scope of the present invention.
Claims (4)
1. an impedance is the high-power aluminium nitride ceramics substrate 150 tile load sheets of 50 Ω; It is characterized in that: it comprises the aluminium nitride substrate of a 8.7*5.9*1mm; The front of said aluminium nitride substrate is printed with back of the body conducting shell, and the front of said aluminium nitride substrate is printed with resistance and lead, and said lead connects said resistance and forms load circuit; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, said resistance transverse arrangement of turbo.
2. impedance according to claim 1 is the high-power aluminium nitride ceramics substrate 150 tile load sheets of 50 Ω, and it is characterized in that: the pad of said load circuit is provided with Gold plated Layer.
3. impedance according to claim 1 is the high-power aluminium nitride ceramics substrate 150 tile load sheets of 50 Ω, and it is characterized in that: be printed with glass protection film on the said resistance, the upper surface of said lead and glass protection film also is printed with one deck black protective film.
4. impedance according to claim 1 is the high-power aluminium nitride ceramics substrate 150 tile load sheets of 50 Ω, and it is characterized in that: said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110205631A CN102332626A (en) | 2011-07-22 | 2011-07-22 | 150-watt load sheet of large power aluminium nitride ceramic substrate with impedance of 50 ohms |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110205631A CN102332626A (en) | 2011-07-22 | 2011-07-22 | 150-watt load sheet of large power aluminium nitride ceramic substrate with impedance of 50 ohms |
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| CN102332626A true CN102332626A (en) | 2012-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110205631A Pending CN102332626A (en) | 2011-07-22 | 2011-07-22 | 150-watt load sheet of large power aluminium nitride ceramic substrate with impedance of 50 ohms |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104241762A (en) * | 2014-05-28 | 2014-12-24 | 苏州市新诚氏电子有限公司 | Novel optimized 150 W loading piece with aluminum nitride ceramic substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5332981A (en) * | 1992-07-31 | 1994-07-26 | Emc Technology, Inc. | Temperature variable attenuator |
| CN101075490A (en) * | 2007-05-01 | 2007-11-21 | 北海银河开关设备有限公司 | 12kV fixed-sealed resistant voltage divider |
| CN101859620A (en) * | 2009-04-08 | 2010-10-13 | 深圳市信特科技有限公司 | Manufacturing method of high-frequency high-power resistor |
| CN101923928A (en) * | 2010-03-25 | 2010-12-22 | 四平市吉华高新技术有限公司 | High-frequency patch resistor and manufacturing method thereof |
| CN202178361U (en) * | 2011-07-22 | 2012-03-28 | 苏州市新诚氏电子有限公司 | Load sheet of large power aluminium nitride ceramic substrate with impedance of 50 Omega and capable of loading 150 watt |
-
2011
- 2011-07-22 CN CN201110205631A patent/CN102332626A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5332981A (en) * | 1992-07-31 | 1994-07-26 | Emc Technology, Inc. | Temperature variable attenuator |
| CN101075490A (en) * | 2007-05-01 | 2007-11-21 | 北海银河开关设备有限公司 | 12kV fixed-sealed resistant voltage divider |
| CN101859620A (en) * | 2009-04-08 | 2010-10-13 | 深圳市信特科技有限公司 | Manufacturing method of high-frequency high-power resistor |
| CN101923928A (en) * | 2010-03-25 | 2010-12-22 | 四平市吉华高新技术有限公司 | High-frequency patch resistor and manufacturing method thereof |
| CN202178361U (en) * | 2011-07-22 | 2012-03-28 | 苏州市新诚氏电子有限公司 | Load sheet of large power aluminium nitride ceramic substrate with impedance of 50 Omega and capable of loading 150 watt |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104241762A (en) * | 2014-05-28 | 2014-12-24 | 苏州市新诚氏电子有限公司 | Novel optimized 150 W loading piece with aluminum nitride ceramic substrate |
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Application publication date: 20120125 |