CN102332625A - 150W load sheet of high-power aluminum nitride ceramic substrate - Google Patents
150W load sheet of high-power aluminum nitride ceramic substrate Download PDFInfo
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- CN102332625A CN102332625A CN201110205621A CN201110205621A CN102332625A CN 102332625 A CN102332625 A CN 102332625A CN 201110205621 A CN201110205621 A CN 201110205621A CN 201110205621 A CN201110205621 A CN 201110205621A CN 102332625 A CN102332625 A CN 102332625A
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Abstract
The invention discloses a 150W load sheet of a high-power aluminum nitride ceramic substrate, which comprises a 9.55*6.35*1mm aluminum nitride substrate, wherein a back conduction layer is printed on the back surface of the aluminum nitride substrate, a plurality of resistors and a lead are printed on the front face of the aluminum nitride substrate, the resistors are connected in parallel through the lead to form a load circuit, the grounding end of the load circuit is electrically connected with the back conduction layer, and a welding pad is arranged on the load circuit. The 9.55*6.35*1mm aluminum nitride substrate is adopted as a substrate of the 150W load sheet of the aluminum nitride ceramic substrate, the load circuit adopts a design process of connecting the resistors in parallel without adopting the traditional design process of the single resistor, therefore, the area of the resistors can be effectively increased to ensure that the capacity of the load sheet bearing the power is further enhanced; meanwhile, the design process ensures that the misplacement distribution of the lead breaks through the limit of the traditional design, therefore, the welding pad has excellent return loss characteristic while enlarging, and more convenient and firm welding is realized due to the enlarging of the welding pad.
Description
Technical field
The present invention relates to a kind of aluminium nitride ceramics substrate carrier sheet, particularly a kind of powerful aluminium nitride ceramics substrate 150W carrier sheet.
Background technology
Aluminium nitride ceramics substrate carrier sheet is mainly used in the power that in communication base station, absorbs reverse input in the communication component, if can not bear the power of requirement, load will burn out, and possibly cause entire equipment to burn out.In the actual use of aluminium nitride ceramics substrate carrier sheet; All need wire bonds to the pad of carrier sheet; Adopt the design technology of little pad in the market mostly; Because can directly have influence on the return loss of product after pad amplifies, make return loss increase, if but adopt little pad then the convenience that can many welding and the fastness of welding cause adverse influence.
Summary of the invention
To the deficiency of above-mentioned prior art, the technical problem that the present invention will solve provides a kind of high-power aluminium nitride ceramics substrate 150 tile load sheets that are provided with large bonding pad.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of high-power aluminium nitride ceramics substrate 150 tile load sheets; It comprises the aluminium nitride substrate of a 9.55*6.35**1MM; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with lead and several resistance, and said several resistance form load circuit through said lead parallel connection; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, and said load circuit is provided with pad.Load circuit can adopt two resistive arrangement schemes to increase resistor area.
Preferably, said pad is of a size of 1.2*3mm.
Preferably, be printed with glass protection film on the said resistance, the upper surface of said lead and glass protection film also is printed with one deck black protective film.
Preferably, said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Technique scheme has following beneficial effect: this carrier sheet with the aluminium nitride substrate of 9.55*6.35**1MM as substrate; Load circuit adopts the design technology of parallel resistance; And do not adopt the design technology of traditional single resistance; Can effectively increase the area of resistance like this, the ability that makes carrier sheet bear power is further consolidated, and adopts this design technology to make walking of lead arrange simultaneously and breaks through the restriction of original traditional design; Make pad when increasing, access good return loss characteristic, and the increase of pad can make welding more convenient and firm.
Above-mentioned explanation only is the general introduction of technical scheme of the present invention, understands technological means of the present invention in order can more to know, and can implement according to the content of specification, below with preferred embodiment of the present invention and conjunction with figs. specify as after.Embodiment of the present invention is provided by following examples and accompanying drawing thereof in detail.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing the preferred embodiments of the present invention are described in detail.
As shown in Figure 1; These high-power aluminium nitride ceramics substrate 150 tile load sheets comprise the aluminium nitride substrate 1 of a 9.55*6.35**1MM; The back up of aluminium nitride substrate 1 has back of the body conducting shell, and the front of aluminium nitride substrate is printed with lead 2 and several resistance 3, and several resistance 3 form load circuit through lead 2 parallel connections; The earth terminal of load circuit is electrically connected through the silver slurry with back of the body conducting shell, can make load circuit ground connection form the loop like this.Load circuit is provided with pad, and pad is of a size of 1.2*3mm.Back of the body conducting shell and lead 2 are formed by the conductive silver paste printing, and resistance is formed by the resistance slurry printing.Be printed with glass protection film 4 on the resistance 3, the upper surface of lead 2 and glass protection film 4 also is printed with one deck black protective film 5, can do further protection to resistance 3, lead 2 and glass protection film 4 like this.
This carrier sheet with the aluminium nitride substrate of 9.55*6.35**1MM as substrate; Load circuit adopts the design technology of parallel resistance; And do not adopt the design technology of traditional single resistance, and can effectively increase the area of resistance like this, the ability that makes carrier sheet bear power is further consolidated.Adopt the carrier sheet of this structure can make the bearing power of the aluminium nitride substrate of above-mentioned dimensions arrive 150W; And satisfy impedance 50 ± 1.5 Ω; Return loss can satisfy the actual production requirement at 3G and 3G frequency range with interior; Adopt this design technology to make walking of lead arrange simultaneously and break through the restriction of original traditional design, make pad when increasing, access good return loss characteristic, and the increase of pad can make welding more convenient and firm.
More than a kind of high-power aluminium nitride ceramics substrate 150 tile load sheets that the embodiment of the invention provided have been carried out detailed introduction; For one of ordinary skill in the art; According to the thought of the embodiment of the invention, the part that on embodiment and range of application, all can change, in sum; This description should not be construed as limitation of the present invention, and all any changes of making according to design philosophy of the present invention are all within protection scope of the present invention.
Claims (4)
1. high-power aluminium nitride ceramics substrate 150 tile load sheets; It is characterized in that: it comprises the aluminium nitride substrate of a 9.55*6.35**1MM; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with lead and several resistance, and said several resistance form load circuit through said lead parallel connection; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, and said load circuit is provided with pad.
2. high-power aluminium nitride ceramics substrate 150 tile load sheets according to claim 1, it is characterized in that: said pad is of a size of 1.2*3mm.
3. high-power aluminium nitride ceramics substrate 150 tile load sheets according to claim 1, it is characterized in that: be printed with glass protection film on the said resistance, the upper surface of said lead and glass protection film also is printed with one deck black protective film.
4. high-power aluminium nitride ceramics substrate 150 tile load sheets according to claim 1, it is characterized in that: said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110205621A CN102332625A (en) | 2011-07-22 | 2011-07-22 | 150W load sheet of high-power aluminum nitride ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110205621A CN102332625A (en) | 2011-07-22 | 2011-07-22 | 150W load sheet of high-power aluminum nitride ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
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| CN102332625A true CN102332625A (en) | 2012-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110205621A Pending CN102332625A (en) | 2011-07-22 | 2011-07-22 | 150W load sheet of high-power aluminum nitride ceramic substrate |
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| CN (1) | CN102332625A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104241762A (en) * | 2014-05-28 | 2014-12-24 | 苏州市新诚氏电子有限公司 | Novel optimized 150 W loading piece with aluminum nitride ceramic substrate |
| CN105972570A (en) * | 2016-06-29 | 2016-09-28 | 苏州范王式机电科技有限公司 | Vapor generator and vapor device |
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| US5332981A (en) * | 1992-07-31 | 1994-07-26 | Emc Technology, Inc. | Temperature variable attenuator |
| CN101075490A (en) * | 2007-05-01 | 2007-11-21 | 北海银河开关设备有限公司 | 12kV fixed-sealed resistant voltage divider |
| CN101853620A (en) * | 2009-11-19 | 2010-10-06 | 广州市地下铁道总公司 | Manufacture method of long-afterglow self-luminous ground marks |
| CN101923928A (en) * | 2010-03-25 | 2010-12-22 | 四平市吉华高新技术有限公司 | High-frequency patch resistor and manufacturing method thereof |
| CN202121046U (en) * | 2011-07-22 | 2012-01-18 | 苏州市新诚氏电子有限公司 | 150 tile load sheet of high power aluminum nitride ceramic substrate |
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2011
- 2011-07-22 CN CN201110205621A patent/CN102332625A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5332981A (en) * | 1992-07-31 | 1994-07-26 | Emc Technology, Inc. | Temperature variable attenuator |
| CN101075490A (en) * | 2007-05-01 | 2007-11-21 | 北海银河开关设备有限公司 | 12kV fixed-sealed resistant voltage divider |
| CN101853620A (en) * | 2009-11-19 | 2010-10-06 | 广州市地下铁道总公司 | Manufacture method of long-afterglow self-luminous ground marks |
| CN101923928A (en) * | 2010-03-25 | 2010-12-22 | 四平市吉华高新技术有限公司 | High-frequency patch resistor and manufacturing method thereof |
| CN202121046U (en) * | 2011-07-22 | 2012-01-18 | 苏州市新诚氏电子有限公司 | 150 tile load sheet of high power aluminum nitride ceramic substrate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104241762A (en) * | 2014-05-28 | 2014-12-24 | 苏州市新诚氏电子有限公司 | Novel optimized 150 W loading piece with aluminum nitride ceramic substrate |
| CN105972570A (en) * | 2016-06-29 | 2016-09-28 | 苏州范王式机电科技有限公司 | Vapor generator and vapor device |
| CN105972570B (en) * | 2016-06-29 | 2019-01-25 | 苏州范王式机电科技有限公司 | Steam generator and steaming plant |
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Application publication date: 20120125 |