CN202178365U - Aluminium nitride ceramic substrate 150W load sheet with wide bonding pad - Google Patents
Aluminium nitride ceramic substrate 150W load sheet with wide bonding pad Download PDFInfo
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- CN202178365U CN202178365U CN 201120324904 CN201120324904U CN202178365U CN 202178365 U CN202178365 U CN 202178365U CN 201120324904 CN201120324904 CN 201120324904 CN 201120324904 U CN201120324904 U CN 201120324904U CN 202178365 U CN202178365 U CN 202178365U
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- aluminium nitride
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Abstract
The utility model discloses an aluminium nitride ceramic substrate 150W load sheet with a wide bonding pad. The aluminium nitride ceramic substrate 150W load sheet with a wide bonding pad comprises a 9.55*6.35*1MM aluminium nitride substrate. A back guide layer is printed on the backside of the aluminium nitride substrate. A resistor and a lead are printed on the right side of the aluminium nitride substrate. The lead is connected with the resistor to form a load circuit. The grounding terminal of the load circuit is electrically connected with the back guide layer. A glass protection film is printed on the resistor. The aluminium nitride ceramic substrate 150W load sheet with a wide bonding pad exhibits a fine VSWR performance, the power on the 9.55*6.35*1MM aluminium nitride substrate reaches 150W, and the aluminium nitride ceramic substrate exhibits a 3G characteristic, such that the aluminium nitride ceramic substrate with the above dimension has a wide application range and can be better mated with devices.
Description
Technical field
The utility model relates to a kind of aluminium nitride ceramics substrate carrier sheet, particularly a kind of wide pad aluminium nitride ceramics substrate 150 tile load sheets.
Background technology
Aluminium nitride ceramics substrate carrier sheet is mainly used in the power that in communication base station, absorbs reverse input in the communication component, if can not bear the power of requirement, load will burn out.In the actual use of aluminium nitride ceramics substrate carrier sheet; All need wire bonds to the pad of carrier sheet; Adopt the design technology of little pad in the market mostly; Because can directly have influence on the return loss of product after pad amplifies, make return loss increase, if but adopt little pad then can cause adverse influence to the convenience of welding and the fastness of welding.
The utility model content
To the deficiency of above-mentioned prior art, the technical problem that the utility model will solve provides the 150W aluminium nitride ceramics substrate carrier sheet of a kind of convenient welding and firm welding.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of wide pad aluminium nitride ceramics substrate 150 tile load sheets; It comprises the aluminium nitride substrate of a 9.55*6.35*1.0mm; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with resistance and lead, and said lead connects said resistance and forms load circuit; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, is printed with glass protection film on the said resistance.Said load circuit is provided with the pad of wide size.
Preferably, the upper surface of said lead and glass protection film also is printed with one deck black protective film.
Preferably, said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Technique scheme has following beneficial effect: the wide pad aluminium nitride ceramics substrate 150 tile load sheets of this structure have good VSWR performance; Make things convenient for the welding of carrier sheet and lead-in wire; Because bonding area increases, weld strength also must arrive raising, effectively the fastness of proof load sheet and wire bonds; Improve the bearing capacity of carrying tablet, reduce return loss.
Above-mentioned explanation only is the general introduction of the utility model technical scheme, in order more to know the technological means of understanding the utility model, and can implement according to the content of specification, below with the preferred embodiment of the utility model and conjunction with figs. specify as after.The embodiment of the utility model is provided by following examples and accompanying drawing thereof in detail.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment.
Embodiment
Describe in detail below in conjunction with the preferred embodiment of accompanying drawing to the utility model.
As shown in Figure 1; These wide pad aluminium nitride ceramics substrate 150 tile load sheets comprise the aluminium nitride substrate 1 of a 9.55*6.35*1.0mm; The back up of aluminium nitride substrate 1 has back of the body conducting shell, and the front of aluminium nitride substrate 1 is printed with resistance 3 and lead 2, and lead 2 connects resistance 3 and forms load circuit; The earth terminal of load circuit is electrically connected through the silver slurry with back of the body conducting shell, thereby makes the load circuit earth-continuity.Back of the body conducting shell and lead 2 are formed by the conductive silver paste printing, and resistance 3 is formed by the resistance slurry printing.Be printed with glass protection film 4 on the resistance 3.The upper surface of lead 2 and glass protection film 4 also is printed with the blue diaphragm 5 of one deck.
This structure has increased the area of pad on the basis of original design, through the optimal design of circuit, guaranteed good performance simultaneously.The wide pad aluminium nitride ceramics substrate 150 tile load sheets of this structure have good VSWR performance, can be used in 3G and 3G with interior communication network demand, and the power on the aluminium nitride ceramics substrate of 9.55*6.35*1.0mm reaches 150W; Make things convenient for the welding of carrier sheet and lead-in wire simultaneously; Because bonding area increases, weld strength also must arrive raising, effectively the fastness of proof load sheet and wire bonds; Improve the bearing capacity of carrying tablet, reduce return loss.Power according to this aluminium nitride ceramics substrate carrier sheet of detection can be born is highly stable, can reach the requirement that communication period absorbs required power fully,
More than a kind of wide pad aluminium nitride ceramics substrate 150 tile load sheets that the utility model embodiment is provided carried out detailed introduction; For one of ordinary skill in the art; According to the thought of the utility model embodiment, the part that on embodiment and range of application, all can change, in sum; This description should not be construed as the restriction to the utility model, and all any changes of being made according to the utility model design philosophy are all within the protection range of the utility model.
Claims (3)
1. one kind wide pad aluminium nitride ceramics substrate 150 tile load sheets; It is characterized in that: it comprises the aluminium nitride substrate of a 9.55*6.35*1MM; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with resistance and lead, and said lead connects said resistance and forms load circuit; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, is printed with glass protection film on the said resistance.
2. wide pad aluminium nitride ceramics substrate 150 tile load sheets according to claim 1, it is characterized in that: the upper surface of said lead and glass protection film also is printed with one deck black protective film.
3. wide pad aluminium nitride ceramics substrate 150 tile load sheets according to claim 1, it is characterized in that: said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120324904 CN202178365U (en) | 2011-09-01 | 2011-09-01 | Aluminium nitride ceramic substrate 150W load sheet with wide bonding pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120324904 CN202178365U (en) | 2011-09-01 | 2011-09-01 | Aluminium nitride ceramic substrate 150W load sheet with wide bonding pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202178365U true CN202178365U (en) | 2012-03-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120324904 Expired - Fee Related CN202178365U (en) | 2011-09-01 | 2011-09-01 | Aluminium nitride ceramic substrate 150W load sheet with wide bonding pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202178365U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102324608A (en) * | 2011-09-01 | 2012-01-18 | 苏州市新诚氏电子有限公司 | Wide pad aluminium nitride ceramic substrate 150 watts load chip |
-
2011
- 2011-09-01 CN CN 201120324904 patent/CN202178365U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102324608A (en) * | 2011-09-01 | 2012-01-18 | 苏州市新诚氏电子有限公司 | Wide pad aluminium nitride ceramic substrate 150 watts load chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120328 Termination date: 20120901 |