CN202189872U - 30-watt load chip with 50-ohm impedance aluminum nitrate ceramic substrate - Google Patents
30-watt load chip with 50-ohm impedance aluminum nitrate ceramic substrate Download PDFInfo
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- CN202189872U CN202189872U CN 201120259869 CN201120259869U CN202189872U CN 202189872 U CN202189872 U CN 202189872U CN 201120259869 CN201120259869 CN 201120259869 CN 201120259869 U CN201120259869 U CN 201120259869U CN 202189872 U CN202189872 U CN 202189872U
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- aluminum nitrate
- aluminium nitride
- ceramic substrate
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Abstract
The utility model discloses a 30-watt load chip with a 50-ohm impedance aluminum nitrate ceramic substrate, which comprises the 4*4*1mm aluminum nitrate substrate. A back conducting layer is printed at the back of the aluminum nitrate substrate, resistors and leads are printed in the front of the aluminum nitrate substrate, the leads are connected with the resistors to form a load circuit, a ground end of the load circuit is connected with the back conducting layer electrically, and a glass protective film is printed on the resistors. The 30-watt load chip with the 50-ohm impedance aluminum nitrate ceramic substrate has fine VSWR (voltage standing wave ratio) property, the power reaches 30W on the 4*4*1mm aluminum nitrate ceramic substrate, the characteristic of the 30-watt load chip breaks through 3G (third generation telecommunication) and reaches 6G, the load chip of the size is applicable to both the civil communication field and the military communication field, and the aluminum nitrate ceramic substrate of the size is wider in application range and can be matched with equipment better.
Description
Technical field
The utility model relates to a kind of aluminium nitride ceramics substrate carrier sheet, and particularly a kind of impedance is 50 Ω aluminium nitride ceramics substrates, 30 tile load sheets.
Background technology
Aluminium nitride ceramics substrate carrier sheet is mainly used in the power that in communication base station, absorbs reverse input in the communication component, if can not bear the power of requirement, load will burn out, and possibly cause entire equipment to burn out.Domestic aluminium nitride ceramics substrate carrier sheet all is the commercial communication field that is applied at present, and the commercial communication frequency requirement is in 3G and the 3G.For carrier sheet, can reach the requirement of application, the one, need to satisfy the requirement of power; The one, characteristics of product just VSWR (standing-wave ratio) is more little good more; The existing market basis needs to satisfy in 1.25: 1. and along with increasing of frequency range, the VSWR of product also will be high more, so very bad with regard to what become in the above standing-wave ratio of 3G frequency range; Do not reach adaptable requirement; And military industry field, frequency range requires basically all more than 3G, so domestic aluminium nitride ceramics substrate carrier sheet has all satisfied not requirement at present.
The utility model content
To the deficiency of above-mentioned prior art, the technical problem that the utility model will solve provides a kind of power that can bear 30W, and standing wave needs to satisfy present 6G and 6G with the standing-wave ratio of the interior frequency range aluminium nitride ceramics substrate carrier sheet less than 1.25: 1.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of impedance is 50 Ω aluminium nitride ceramics substrates, 30 tile load sheets; It comprises the aluminium nitride substrate of a 4*4*1mm; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with resistance and lead, and said lead connects said resistance and forms load circuit; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, is printed with glass protection film on the said resistance.
Preferably, the upper surface of said lead and glass protection film also is printed with one deck black protective film.
Preferably, said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Technique scheme has following beneficial effect: the impedance of this structure is that 50 Ω aluminium nitride ceramics substrates, 30 tile load sheets have good VSWR performance; Power on the aluminium nitride ceramics substrate of 4*4*1mm reaches 30W; Make its characteristic break through 3G simultaneously; Reach 6G, made the aluminium nitride ceramics substrate carrier sheet of this size not only can be used in the commercial communication field, also can be applicable to the military project communications field; Make the aluminium nitride ceramics substrate scope of application of this size wider, also can carry out good coupling with equipment more.
Above-mentioned explanation only is the general introduction of the utility model technical scheme, in order more to know the technological means of understanding the utility model, and can implement according to the content of specification, below with the preferred embodiment of the utility model and conjunction with figs. specify as after.The embodiment of the utility model is provided by following examples and accompanying drawing thereof in detail.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment.
Embodiment
Describe in detail below in conjunction with the preferred embodiment of accompanying drawing to the utility model.
As shown in Figure 1; This impedance is the aluminium nitride substrate 1 that 50 Ω aluminium nitride ceramics substrates, 30 tile load sheets comprise a 4*4*1mm; The back up of aluminium nitride substrate 1 has back of the body conducting shell, and the front of aluminium nitride substrate 1 is printed with resistance 3 and lead 2, and lead 2 connects resistance 3 and forms load circuit; The earth terminal of load circuit is electrically connected through the silver slurry with back of the body conducting shell, thereby makes the load circuit earth-continuity.Back of the body conducting shell and lead 2 are formed by the conductive silver paste printing, and resistance 3 is formed by the resistance slurry printing.Be printed with glass protection film 4 on the resistance 3.The upper surface of lead 2 and glass protection film 4 also is printed with one deck black protective film 5.
The impedance of this structure is that 50 Ω aluminium nitride ceramics substrates, 30 tile load sheets have good VSWR performance; Power on the aluminium nitride ceramics substrate of 4*4*1mm reaches 30W, makes its characteristic break through 3G simultaneously, has reached 6G; Make the aluminium nitride ceramics substrate carrier sheet of this size not only can be used in the commercial communication field; Also can be applicable to the military project communications field, make the aluminium nitride ceramics substrate scope of application of this size wider, also can carry out good coupling with equipment more.Power according to this aluminium nitride ceramics substrate carrier sheet of detection can be born is highly stable, can reach the requirement that communication period absorbs required power fully,
More than a kind of impedance that the utility model embodiment is provided be that 50 Ω aluminium nitride ceramics substrates, 30 tile load sheets have carried out detailed introduction; For one of ordinary skill in the art; According to the thought of the utility model embodiment, the part that on embodiment and range of application, all can change, in sum; This description should not be construed as the restriction to the utility model, and all any changes of being made according to the utility model design philosophy are all within the protection range of the utility model.
Claims (3)
1. an impedance is 50 Ω aluminium nitride ceramics substrates, 30 tile load sheets; It is characterized in that: it comprises the aluminium nitride substrate of a 4*4*1mm; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with resistance and lead, and said lead connects said resistance and forms load circuit; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, is printed with glass protection film on the said resistance.
2. impedance according to claim 1 is 50 Ω aluminium nitride ceramics substrates, 30 tile load sheets, and it is characterized in that: the upper surface of said lead and glass protection film also is printed with one deck black protective film.
3. impedance according to claim 1 is 50 Ω aluminium nitride ceramics substrates, 30 tile load sheets, and it is characterized in that: said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120259869 CN202189872U (en) | 2011-07-22 | 2011-07-22 | 30-watt load chip with 50-ohm impedance aluminum nitrate ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120259869 CN202189872U (en) | 2011-07-22 | 2011-07-22 | 30-watt load chip with 50-ohm impedance aluminum nitrate ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202189872U true CN202189872U (en) | 2012-04-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120259869 Expired - Fee Related CN202189872U (en) | 2011-07-22 | 2011-07-22 | 30-watt load chip with 50-ohm impedance aluminum nitrate ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202189872U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102332624A (en) * | 2011-07-22 | 2012-01-25 | 苏州市新诚氏电子有限公司 | 30W load sheet of aluminum nitride ceramic substrate with impedance of 50 omegas |
-
2011
- 2011-07-22 CN CN 201120259869 patent/CN202189872U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102332624A (en) * | 2011-07-22 | 2012-01-25 | 苏州市新诚氏电子有限公司 | 30W load sheet of aluminum nitride ceramic substrate with impedance of 50 omegas |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120411 Termination date: 20120722 |