CN202259629U - 50W loading sheet of aluminum nitride ceramic substrate - Google Patents
50W loading sheet of aluminum nitride ceramic substrate Download PDFInfo
- Publication number
- CN202259629U CN202259629U CN2011203354635U CN201120335463U CN202259629U CN 202259629 U CN202259629 U CN 202259629U CN 2011203354635 U CN2011203354635 U CN 2011203354635U CN 201120335463 U CN201120335463 U CN 201120335463U CN 202259629 U CN202259629 U CN 202259629U
- Authority
- CN
- China
- Prior art keywords
- substrate
- aluminum nitride
- aluminium nitride
- load circuit
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Ceramic Products (AREA)
Abstract
The utility model discloses a 50W loading sheet of an aluminum nitride ceramic substrate. The 50W loading sheet of the aluminum nitride ceramic substrate comprises an aluminum nitride substrate of 4*4*1mm, wherein the back surface of the aluminum nitride substrate is printed with a back guide layer and the front surface of the aluminum nitride substrate is printed with a guide line and a plurality of resistors; the plurality of resistors are connected in parallel by the guide line to form a load circuit; the grounding end of the load circuit is electrically connected with the back guide layer; and a bonding pad is arranged on the loading circuit. In the loading sheet, the aluminum nitride substrate of 4*4*1mm is taken as a substrate, and the load circuit adopts a design technology of parallel resistors rather than a traditional single resistor, therefore, the area of the resistors can be effectively enlarged, so that the capacity of power endurance of the loading sheet is further fastened; meanwhile, the location configuration of the guide line breaks through the limit of the original traditional design by adopting the design technology, so that the bonding pad is enlarged as well as can obtain excellent performance of return loss; and the augmentation of the bonding pad can ensure welding to be more convenient and firmer.
Description
Technical field
The utility model relates to a kind of aluminium nitride ceramics substrate carrier sheet, particularly a kind of aluminium nitride ceramics substrate 50W carrier sheet.
Background technology
Aluminium nitride ceramics substrate carrier sheet is mainly used in the power that in communication base station, absorbs reverse input in the communication component, if can not bear the power of requirement, load will burn out, and possibly cause entire equipment to burn out.In the actual use of aluminium nitride ceramics substrate carrier sheet; All need wire bonds to the pad of carrier sheet; Adopt the design technology of little pad in the market mostly; Because can directly have influence on the return loss of product after pad amplifies, make return loss increase, if but adopt little pad then the convenience that can many welding and the fastness of welding cause adverse influence.
Because the aluminium nitride ceramics carrier sheet also belongs to novel industry; Exist the phenomenon of concentrating relatively of carrier sheet dimensions; The diversification production that does not present customer orientation; Cause generally using on the market high gauge grade to substitute the demand of low specification, when needing the carrier sheet of 50W, just used the 100W carrier sheet of main flow.On substrate size, also generally select for use more single size to accomplish different separately designs and manufacture enterprise simultaneously, this disadvantage of bringing is exactly the relative weakening of price advantage and the relative unicity that product is selected.Limited the design of client's product simultaneously, because the size of the carrier sheet putting position back of the body has limited, however along with continuous development, the diversity of customer requirement self product design, the dimensions that this will the negate slide glass need present the diversity development.
The utility model content
To the deficiency of above-mentioned prior art, the technical problem that the utility model will solve provides a kind of large bonding pad that is provided with, and is of a size of the aluminium nitride ceramics substrate 50 tile load sheets of 4*4*1mm.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of aluminium nitride ceramics substrate 50 tile load sheets; It comprises the aluminium nitride substrate of a 4*4*1MM; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with lead and several resistance, and said several resistance form load circuit through said lead parallel connection; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, and said load circuit is provided with pad.
Preferably, said pad is of a size of 0.8*2mm.
Preferably, be printed with glass protection film on the said resistance, the upper surface of said lead and glass protection film also is printed with one deck black protective film.
Preferably, said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Preferably, said circuit has adopted two resistive arrangement schemes, increases resistor area.
Technique scheme has following beneficial effect: this carrier sheet with the aluminium nitride substrate of 4*4*1MM as substrate; Load circuit adopts the design technology of parallel resistance; And do not adopt the design technology of traditional single resistance; Can effectively increase the area of resistance like this, the ability that makes carrier sheet bear power is further consolidated, and adopts this design technology to make walking of lead arrange simultaneously and breaks through the restriction of original traditional design; Make pad when increasing, access good return loss characteristic, and the increase of pad can make welding more convenient and firm.
Enriched the aluminium nitride product specification, realized the linking of different capacity between the aluminium nitride product, and reduced cost, made the client have more selection to obtain the higher product of cost performance through the dimension shrinks of substrate.
Above-mentioned explanation only is the general introduction of the utility model technical scheme, in order more to know the technological means of understanding the utility model, and can implement according to the content of specification, below with the preferred embodiment of the utility model and conjunction with figs. specify as after.The embodiment of the utility model is provided by following examples and accompanying drawing thereof in detail.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment.
Embodiment
Describe in detail below in conjunction with the preferred embodiment of accompanying drawing to the utility model.
As shown in Figure 1; These aluminium nitride ceramics substrate 50 tile load sheets comprise the aluminium nitride substrate 1 of a 4*4*1MM; The back up of aluminium nitride substrate 1 has back of the body conducting shell, and the front of aluminium nitride substrate is printed with lead 2 and several resistance 3, and several resistance 3 form load circuit through lead 2 parallel connections; The earth terminal of load circuit is electrically connected through the silver slurry with back of the body conducting shell, can make load circuit ground connection form the loop like this.Load circuit is provided with pad, and pad is of a size of 0.8*2mm.Back of the body conducting shell and lead 2 are formed by the conductive silver paste printing, and resistance is formed by the resistance slurry printing.Be printed with glass protection film 4 on the resistance 3, the upper surface of lead 2 and glass protection film 4 also is printed with one deck black protective film 5, can do further protection to resistance 3, lead 2 and glass protection film 4 like this.
This carrier sheet with the aluminium nitride substrate of 4*4*1MM as substrate; Load circuit adopts the design technology of parallel resistance; And do not adopt the design technology of traditional single resistance, and can effectively increase the area of resistance like this, the ability that makes carrier sheet bear power is further consolidated.Adopt the carrier sheet of this structure can make the bearing power of the aluminium nitride substrate of above-mentioned dimensions arrive 50W; And satisfy impedance 50 ± 1.5 Ω; Return loss can satisfy the actual production requirement at 3G and 3G frequency range with interior; Adopt this design technology to make walking of lead arrange simultaneously and break through the restriction of original traditional design, make pad when increasing, access good return loss characteristic, and the increase of pad can make welding more convenient and firm.
Enriched the aluminium nitride product specification, realized the linking of different capacity between the aluminium nitride product, and reduced cost, made the client have more selection to obtain the higher product of cost performance through the dimension shrinks of substrate.
More than a kind of aluminium nitride ceramics substrate 150 tile load sheets that the utility model embodiment is provided carried out detailed introduction; For one of ordinary skill in the art; According to the thought of the utility model embodiment, the part that on embodiment and range of application, all can change, in sum; This description should not be construed as the restriction to the utility model, and all any changes of being made according to the utility model design philosophy are all within the protection range of the utility model.
Claims (4)
1. aluminium nitride ceramics substrate 50 tile load sheets; It is characterized in that: it comprises the aluminium nitride substrate of a 4*4*1MM; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with lead and several resistance, and said several resistance form load circuit through said lead parallel connection; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, and said load circuit is provided with pad.
2. aluminium nitride ceramics substrate 50 tile load sheets according to claim 1, it is characterized in that: said pad is of a size of 0.8*2mm.
3. aluminium nitride ceramics substrate 50 tile load sheets according to claim 1, it is characterized in that: be printed with glass protection film on the said resistance, the upper surface of said lead and glass protection film also is printed with one deck black protective film.
4. aluminium nitride ceramics substrate 50 tile load sheets according to claim 1, it is characterized in that: said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203354635U CN202259629U (en) | 2011-09-08 | 2011-09-08 | 50W loading sheet of aluminum nitride ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203354635U CN202259629U (en) | 2011-09-08 | 2011-09-08 | 50W loading sheet of aluminum nitride ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202259629U true CN202259629U (en) | 2012-05-30 |
Family
ID=46120822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203354635U Expired - Fee Related CN202259629U (en) | 2011-09-08 | 2011-09-08 | 50W loading sheet of aluminum nitride ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202259629U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102361130A (en) * | 2011-09-08 | 2012-02-22 | 苏州市新诚氏电子有限公司 | Aluminium nitride ceramic substrate 50 watts load chip |
-
2011
- 2011-09-08 CN CN2011203354635U patent/CN202259629U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102361130A (en) * | 2011-09-08 | 2012-02-22 | 苏州市新诚氏电子有限公司 | Aluminium nitride ceramic substrate 50 watts load chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202259629U (en) | 50W loading sheet of aluminum nitride ceramic substrate | |
| CN202259625U (en) | 100W aluminium nitride ceramic substrate load sheet with wide pad and impedance of 50 ohms | |
| CN202121046U (en) | 150 tile load sheet of high power aluminum nitride ceramic substrate | |
| CN202259628U (en) | 60W loading sheet of aluminum nitride ceramic substrate with impedance of 50Ohm | |
| CN202259635U (en) | High-power aluminum nitride ceramic substrate 200W load piece with impedance of 500 ohm | |
| CN102332625A (en) | 150W load sheet of high-power aluminum nitride ceramic substrate | |
| CN102361130A (en) | Aluminium nitride ceramic substrate 50 watts load chip | |
| CN202178365U (en) | Aluminium nitride ceramic substrate 150W load sheet with wide bonding pad | |
| CN202308246U (en) | 16-watt surface-mounted load sheet of aluminum nitride ceramic substrate with 50-omega impedance | |
| CN202259627U (en) | High power aluminium nitride ceramic substrate 150W load sheet | |
| CN202178367U (en) | Narrow edge-grounded 150W load sheet of high-power aluminum nitride ceramic substrate | |
| CN202259634U (en) | Aluminium nitride ceramic substrate 125W load sheet with impedance of 50 ohms | |
| CN202178364U (en) | 100 watt loading sheet of aluminium nitride ceramic substrate with impedance of 50 ohm | |
| CN202259624U (en) | 20-watt load chip with 50omega impedance of aluminum nitride ceramic substrate | |
| CN202259637U (en) | 20-watt load plate with impedance of 50 Omega and with thin aluminum nitride ceramic substrate | |
| CN202121042U (en) | High-power aluminium nitride ceramic substrate 100W-20dB attenuator | |
| CN202308245U (en) | 40W aluminum oxide ceramics substrate load sheet with impedance of 50 omega | |
| CN202189873U (en) | Aluminum nitride ceramic substrate 150-wattage load sheet easy to weld | |
| CN102315505A (en) | 60-watt loading sheet of aluminium nitride ceramic substrate with 50 omegas of impedance | |
| CN203085302U (en) | Power type chip resistor | |
| CN102437401A (en) | 150W easily-welded loading sheet with aluminium nitride ceramic substrate | |
| CN202259632U (en) | 250Watt loading plate of high-power aluminum nitride ceramic substrate | |
| CN202373398U (en) | High-power thick-film chip resistor | |
| CN202259633U (en) | 100W-9dB high-power aluminum nitride ceramic substrate attenuation sheet | |
| CN202178361U (en) | Load sheet of large power aluminium nitride ceramic substrate with impedance of 50 Omega and capable of loading 150 watt |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20120908 |