CN102361130A - Aluminium nitride ceramic substrate 50 watts load chip - Google Patents
Aluminium nitride ceramic substrate 50 watts load chip Download PDFInfo
- Publication number
- CN102361130A CN102361130A CN2011102648941A CN201110264894A CN102361130A CN 102361130 A CN102361130 A CN 102361130A CN 2011102648941 A CN2011102648941 A CN 2011102648941A CN 201110264894 A CN201110264894 A CN 201110264894A CN 102361130 A CN102361130 A CN 102361130A
- Authority
- CN
- China
- Prior art keywords
- aluminium nitride
- substrate
- lead
- load circuit
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Ceramic Products (AREA)
Abstract
The invention discloses an aluminium nitride ceramic substrate 50 watts load chip which comprises a 4*4*1 mm aluminium nitride substrate. A back side of the aluminium nitride substrate is printed with a back guide layer, and a right side of the aluminium nitride substrate is printed with a lead and a plurality of resistors. The resistors are in parallel connection through the lead to form a load circuit. A grounding terminal of the load circuit is electrically connected with the back guide layer. The load circuit is provided with a pad. According to the load chip, the 4*4*1 mm aluminium nitride substrate is taken as a substrate, parallel resistor design technology instead of traditional single resistor design technology is employed by the load circuit, areas of resistors are effectively increased, power bearing capability of the load chip is reinforced further, simultaneously, by employing the design technology, wiring arrangement of the lead breaks through restriction of an original traditional design, the pad obtains an excellent return loss characteristic while being enlarged, and enlargement of the pad enables convenient and firm welding.
Description
Technical field
The present invention relates to a kind of aluminium nitride ceramics substrate carrier sheet, particularly a kind of aluminium nitride ceramics substrate 50W carrier sheet.
Background technology
Aluminium nitride ceramics substrate carrier sheet is mainly used in the power that in communication base station, absorbs reverse input in the communication component, if can not bear the power of requirement, load will burn out, and possibly cause entire equipment to burn out.In the actual use of aluminium nitride ceramics substrate carrier sheet; All need wire bonds to the pad of carrier sheet; Adopt the design technology of little pad in the market mostly; Because can directly have influence on the return loss of product after pad amplifies, make return loss increase, if but adopt little pad then the convenience that can many welding and the fastness of welding cause adverse influence.
Because the aluminium nitride ceramics carrier sheet also belongs to novel industry; Exist the phenomenon of concentrating relatively of carrier sheet dimensions; The diversification production that does not present customer orientation; Cause generally using on the market high gauge grade to substitute the demand of low specification, when needing the carrier sheet of 50W, just used the 100W carrier sheet of main flow.On substrate size, also generally select for use more single size to accomplish different separately designs and manufacture enterprise simultaneously, this disadvantage of bringing is exactly the relative weakening of price advantage and the relative unicity that product is selected.Limited the design of client's product simultaneously, because the size of the carrier sheet putting position back of the body has limited, however along with continuous development, the diversity of customer requirement self product design, the dimensions that this will the negate slide glass need present the diversity development.
Summary of the invention
To the deficiency of above-mentioned prior art, the technical problem that the present invention will solve provides a kind of large bonding pad that is provided with, and is of a size of the aluminium nitride ceramics substrate 50 tile load sheets of 4*4*1mm.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of aluminium nitride ceramics substrate 50 tile load sheets; It comprises the aluminium nitride substrate of a 4*4*1MM; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with lead and several resistance, and said several resistance form load circuit through said lead parallel connection; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, and said load circuit is provided with pad.
Preferably, said pad is of a size of 0.8*2mm.
Preferably, be printed with glass protection film on the said resistance, the upper surface of said lead and glass protection film also is printed with one deck black protective film.
Preferably, said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Preferably, said circuit has adopted two resistive arrangement schemes, increases resistor area.
Technique scheme has following beneficial effect: this carrier sheet with the aluminium nitride substrate of 4*4*1MM as substrate; Load circuit adopts the design technology of parallel resistance; And do not adopt the design technology of traditional single resistance; Can effectively increase the area of resistance like this, the ability that makes carrier sheet bear power is further consolidated, and adopts this design technology to make walking of lead arrange simultaneously and breaks through the restriction of original traditional design; Make pad when increasing, access good return loss characteristic, and the increase of pad can make welding more convenient and firm.
Enriched the aluminium nitride product specification, realized the linking of different capacity between the aluminium nitride product, and reduced cost, made the client have more selection to obtain the higher product of cost performance through the dimension shrinks of substrate.
Above-mentioned explanation only is the general introduction of technical scheme of the present invention, understands technological means of the present invention in order can more to know, and can implement according to the content of specification, below with preferred embodiment of the present invention and conjunction with figs. specify as after.Embodiment of the present invention is provided by following examples and accompanying drawing thereof in detail.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing the preferred embodiments of the present invention are described in detail.
As shown in Figure 1; These aluminium nitride ceramics substrate 50 tile load sheets comprise the aluminium nitride substrate 1 of a 4*4*1MM; The back up of aluminium nitride substrate 1 has back of the body conducting shell, and the front of aluminium nitride substrate is printed with lead 2 and several resistance 3, and several resistance 3 form load circuit through lead 2 parallel connections; The earth terminal of load circuit is electrically connected through the silver slurry with back of the body conducting shell, can make load circuit ground connection form the loop like this.Load circuit is provided with pad, and pad is of a size of 0.8*2mm.Back of the body conducting shell and lead 2 are formed by the conductive silver paste printing, and resistance is formed by the resistance slurry printing.Be printed with glass protection film 4 on the resistance 3, the upper surface of lead 2 and glass protection film 4 also is printed with one deck black protective film 5, can do further protection to resistance 3, lead 2 and glass protection film 4 like this.
This carrier sheet with the aluminium nitride substrate of 4*4*1MM as substrate; Load circuit adopts the design technology of parallel resistance; And do not adopt the design technology of traditional single resistance, and can effectively increase the area of resistance like this, the ability that makes carrier sheet bear power is further consolidated.Adopt the carrier sheet of this structure can make the bearing power of the aluminium nitride substrate of above-mentioned dimensions arrive 50W; And satisfy impedance 50 ± 1.5 Ω; Return loss can satisfy the actual production requirement at 3G and 3G frequency range with interior; Adopt this design technology to make walking of lead arrange simultaneously and break through the restriction of original traditional design, make pad when increasing, access good return loss characteristic, and the increase of pad can make welding more convenient and firm.
Enriched the aluminium nitride product specification, realized the linking of different capacity between the aluminium nitride product, and reduced cost, made the client have more selection to obtain the higher product of cost performance through the dimension shrinks of substrate.
More than a kind of aluminium nitride ceramics substrate 150 tile load sheets that the embodiment of the invention provided have been carried out detailed introduction; For one of ordinary skill in the art; According to the thought of the embodiment of the invention, the part that on embodiment and range of application, all can change, in sum; This description should not be construed as limitation of the present invention, and all any changes of making according to design philosophy of the present invention are all within protection scope of the present invention.
Claims (4)
1. aluminium nitride ceramics substrate 50 tile load sheets; It is characterized in that: it comprises the aluminium nitride substrate of a 4*4*1MM; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with lead and several resistance, and said several resistance form load circuit through said lead parallel connection; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, and said load circuit is provided with pad.
2. aluminium nitride ceramics substrate 50 tile load sheets according to claim 1, it is characterized in that: said pad is of a size of 0.8*2mm.
3. aluminium nitride ceramics substrate 50 tile load sheets according to claim 1, it is characterized in that: be printed with glass protection film on the said resistance, the upper surface of said lead and glass protection film also is printed with one deck black protective film.
4. aluminium nitride ceramics substrate 50 tile load sheets according to claim 1, it is characterized in that: said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102648941A CN102361130A (en) | 2011-09-08 | 2011-09-08 | Aluminium nitride ceramic substrate 50 watts load chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102648941A CN102361130A (en) | 2011-09-08 | 2011-09-08 | Aluminium nitride ceramic substrate 50 watts load chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102361130A true CN102361130A (en) | 2012-02-22 |
Family
ID=45586402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102648941A Pending CN102361130A (en) | 2011-09-08 | 2011-09-08 | Aluminium nitride ceramic substrate 50 watts load chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102361130A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101075490A (en) * | 2007-05-01 | 2007-11-21 | 北海银河开关设备有限公司 | 12kV fixed-sealed resistant voltage divider |
| CN101699650A (en) * | 2009-10-16 | 2010-04-28 | 电子科技大学 | High-frequency large-power microwave thin film resistor |
| CN201478027U (en) * | 2009-07-02 | 2010-05-19 | 深圳市禹龙通电子有限公司 | Aluminum nitride radio-frequency resistance |
| CN102259629A (en) * | 2011-04-06 | 2011-11-30 | 浙江吉利汽车研究院有限公司 | Vehicle-mounted child leaving reminding device and detection method |
| CN202259629U (en) * | 2011-09-08 | 2012-05-30 | 苏州市新诚氏电子有限公司 | 50W loading sheet of aluminum nitride ceramic substrate |
-
2011
- 2011-09-08 CN CN2011102648941A patent/CN102361130A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101075490A (en) * | 2007-05-01 | 2007-11-21 | 北海银河开关设备有限公司 | 12kV fixed-sealed resistant voltage divider |
| CN201478027U (en) * | 2009-07-02 | 2010-05-19 | 深圳市禹龙通电子有限公司 | Aluminum nitride radio-frequency resistance |
| CN101699650A (en) * | 2009-10-16 | 2010-04-28 | 电子科技大学 | High-frequency large-power microwave thin film resistor |
| CN102259629A (en) * | 2011-04-06 | 2011-11-30 | 浙江吉利汽车研究院有限公司 | Vehicle-mounted child leaving reminding device and detection method |
| CN202259629U (en) * | 2011-09-08 | 2012-05-30 | 苏州市新诚氏电子有限公司 | 50W loading sheet of aluminum nitride ceramic substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102361127A (en) | SMT (Surface Mount Technology) type load sheet (30W) using alumina ceramic substrate | |
| CN202259629U (en) | 50W loading sheet of aluminum nitride ceramic substrate | |
| CN202121046U (en) | 150 tile load sheet of high power aluminum nitride ceramic substrate | |
| CN202259635U (en) | High-power aluminum nitride ceramic substrate 200W load piece with impedance of 500 ohm | |
| CN202259625U (en) | 100W aluminium nitride ceramic substrate load sheet with wide pad and impedance of 50 ohms | |
| CN102332625A (en) | 150W load sheet of high-power aluminum nitride ceramic substrate | |
| CN102361130A (en) | Aluminium nitride ceramic substrate 50 watts load chip | |
| CN202259628U (en) | 60W loading sheet of aluminum nitride ceramic substrate with impedance of 50Ohm | |
| CN102361126A (en) | 40W loading piece of aluminium oxide ceramic substrate with impedance being 50 omega | |
| CN202308246U (en) | 16-watt surface-mounted load sheet of aluminum nitride ceramic substrate with 50-omega impedance | |
| CN202178365U (en) | Aluminium nitride ceramic substrate 150W load sheet with wide bonding pad | |
| CN202178367U (en) | Narrow edge-grounded 150W load sheet of high-power aluminum nitride ceramic substrate | |
| CN202308245U (en) | 40W aluminum oxide ceramics substrate load sheet with impedance of 50 omega | |
| CN202189872U (en) | 30-watt load chip with 50-ohm impedance aluminum nitrate ceramic substrate | |
| CN202259624U (en) | 20-watt load chip with 50omega impedance of aluminum nitride ceramic substrate | |
| CN202178366U (en) | 70W load wafer of aluminium nitride ceramic substrate with impedance of 50 omegas | |
| CN202259634U (en) | Aluminium nitride ceramic substrate 125W load sheet with impedance of 50 ohms | |
| CN202259627U (en) | High power aluminium nitride ceramic substrate 150W load sheet | |
| CN102427154A (en) | 200W large-power aluminum nitride ceramic substrate loading chip with 50 Ohms impedance | |
| CN202259637U (en) | 20-watt load plate with impedance of 50 Omega and with thin aluminum nitride ceramic substrate | |
| CN102315505A (en) | 60-watt loading sheet of aluminium nitride ceramic substrate with 50 omegas of impedance | |
| CN202178363U (en) | Aluminum-nitride ceramic base-plate 80W load sheet with impedance of 50 omega | |
| CN102361138A (en) | 120 W loading sheet of large-power aluminum nitride ceramic substrate with impedance of 50 ohms | |
| CN102437401A (en) | 150W easily-welded loading sheet with aluminium nitride ceramic substrate | |
| CN202189873U (en) | Aluminum nitride ceramic substrate 150-wattage load sheet easy to weld |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120222 |