CN202308246U - 16-watt surface-mounted load sheet of aluminum nitride ceramic substrate with 50-omega impedance - Google Patents
16-watt surface-mounted load sheet of aluminum nitride ceramic substrate with 50-omega impedance Download PDFInfo
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- CN202308246U CN202308246U CN 201120350831 CN201120350831U CN202308246U CN 202308246 U CN202308246 U CN 202308246U CN 201120350831 CN201120350831 CN 201120350831 CN 201120350831 U CN201120350831 U CN 201120350831U CN 202308246 U CN202308246 U CN 202308246U
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- aluminum nitride
- aluminium nitride
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- impedance
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Abstract
The utility model discloses a 16-watt surface-mounted load sheet of an aluminum nitride ceramic substrate with 50-omega impedance. The load sheet comprises the aluminum nitride substrate with specifications of 5*2.5*1mm, wherein a back conducting layer is printed on the back face of the aluminum nitride substrate; a resistor and a lead are printed on the front face of the aluminum nitride substrate; the lead is connected with the resistor to form a load circuit; the grounding end of the load circuit is electrically connected with the back conducting layer; and a glass protecting film is printed on the resistor. The 16-watt surface-mounted load sheet of the aluminum nitride ceramic substrate with 50-omega impedance is formed by optimizing the design of a 10-watt surface-mounted load sheet, wherein the aluminum nitride ceramics with the same area keep good heat dissipation performance and meet the requirement of required power, and the average output power on the aluminum nitride substrate with the specifications of 5*2.5*1mm is up to 16W. At the same time, the 16-watt surface-mounted load sheet has good characteristic indexes and meets the requirement of market.
Description
Technical field
The utility model relates to a kind of aluminium nitride ceramics substrate carrier sheet; Being particularly related to a kind of impedance is 50 Ω aluminium nitride ceramics substrates, 16 tile load sheets; In the carrier sheet design of 10 watts of patch-type aluminium nitride ceramics substrates, be optimized; Through more reasonably lead direction and distribution, make on the substrate of same size to reach more high-power radiating effect, guaranteed the lifting of power.And can be used in the SMT field, and make client realize the high speed paster, quicken processing procedure.
Background technology
Aluminium nitride ceramics substrate carrier sheet is mainly used in the power that in communication base station, absorbs reverse input in the communication component, if can not bear the power of requirement, load will burn out, and possibly cause entire equipment to burn out.Based on the small-sized diversified development in present domestic microwave communication industry base station; Requirement to aluminium nitride power termination sheet more embodies diversity, and is littler for volume, the power capacity specification is bigger, and style is more or the like; Most carrier sheet are that manual welding or the reflow soldering process that adopts is welded to carrier sheet on client's the product; Again wire bonds to the pad of carrier sheet, the carrier sheet of this technology back of the body conducting shell all is an integral body, be welded on client's the product after; The whole back side and product fit like a glove, good heat dispersion performance.Present some client has adopted the SMT paster technique, and carrier sheet back of the body conducting shell just need be reserved the slit like this, and after paster was accomplished, back of the body conducting shell can not have the product contact fully, and heat-sinking capability meeting variation is so most SMD carrier sheet can be selected the relatively large substrate of size.
The utility model content
To above-mentioned situation, the technical problem that the utility model will solve provides a kind of miniaturization can be born 16W power on the aluminium nitride ceramics substrate of area 5*2.5*1mm SMD carrier sheet, and performance can reach the 3G instructions for use.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of impedance is 16 watts of SMD carrier sheet of 50 Ω aluminium nitride ceramics substrates; It comprises the aluminium nitride substrate of a 5*2.5*1mm; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with resistance and lead, and said lead connects said resistance and forms load circuit; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, is printed with glass protection film on the said resistance.
Preferably, the upper surface of said lead and glass protection film also is printed with one deck black protective film.
Preferably, said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Preferably, said back of the body conducting shell and lead need pass through the two-terminal-grounding conducting.
Technique scheme has following beneficial effect: the impedance of this structure is that 16 watts of SMD carrier sheet of 50 Ω aluminium nitride ceramics substrates have good VSWR performance; On the aluminium nitride ceramics substrate of 5*2.5*1mm, stablize power output and reach 16W; Through the optimization on original design basis; More reasonably arrange the layout of lead, given full play to the high characteristic of thermal conductivity of aluminium nitride ceramics, keep the requirement that good thermal diffusivity reaches power demand.Moreover the design of SMD carrier sheet, can make it be applied to the SMT field and carry out mechanization production, changed original manual welding mode, improved the stability and the efficient of producing.
Above-mentioned explanation only is the general introduction of the utility model technical scheme, in order more to know the technological means of understanding the utility model, and can implement according to the content of specification, below with the preferred embodiment of the utility model and conjunction with figs. specify as after.The embodiment of the utility model is provided by following examples and accompanying drawing thereof in detail.
Description of drawings
Fig. 1, Fig. 2, Fig. 3 are respectively the structural representation of the utility model embodiment.
Embodiment
Describe in detail below in conjunction with the preferred embodiment of accompanying drawing to the utility model.
As shown in Figure 1; This impedance is the aluminium nitride substrate 1 that 16 watts of SMD carrier sheet of 50 Ω aluminium nitride ceramics substrates comprise a 5*2.5*1mm; The separative back of the body conducting shell 6 of the back up of aluminium nitride substrate 1 (Fig. 2), the front of aluminium nitride substrate 1 are printed with resistance 3 and lead 2, and lead 2 connects resistance 3 and forms load circuit; The two-terminal-grounding 7 (Fig. 3) of load circuit is electrically connected through the silver slurry with back of the body conducting shell, thereby makes the load circuit earth-continuity.Back of the body conducting shell and lead 2 are formed by the conductive silver paste printing, and resistance 3 is formed by the resistance slurry printing.Be printed with glass protection film 4 on the resistance 3.The upper surface of lead 2 and glass protection film 4 also is printed with one deck black protective film 5.
The impedance of this structure is 16 watts of SMD carrier sheet of 50 Ω aluminium nitride ceramics substrates can be born 16 watts of stable power outputs on the aluminium nitride ceramics substrate of area 5*2.5*1mm a SMD carrier sheet; Through the optimization on original design basis; More reasonably arrange the layout of lead; Given full play to the high characteristic of thermal conductivity of aluminium nitride ceramics; Keep the requirement that good thermal diffusivity reaches power demand, both complied with that market is littler to the volume of aluminium nitride power termination sheet, the power capacity specification is bigger.Original main unfavorable factor of leaning on the processing procedure mode of manual welding to miniaturization power termination sheet has been eliminated in the requirement that reliability is higher again.Furthermore carry out mechanization production, improved the stability and the efficient of producing, reduced total production cost applicable to the SMT field.
Power according to this aluminium nitride ceramics substrate carrier sheet of detection can be born is highly stable, can reach the requirement that communication period absorbs required power fully,
More than a kind of impedance that the utility model embodiment is provided be that 16 watts of SMD carrier sheet of 50 Ω aluminium nitride ceramics substrates have been carried out detailed introduction; For one of ordinary skill in the art; According to the thought of the utility model embodiment, the part that on embodiment and range of application, all can change, in sum; This description should not be construed as the restriction to the utility model, and all any changes of being made according to the utility model design philosophy are all within the protection range of the utility model.
Claims (4)
1. an impedance is 16 watts of SMD carrier sheet of 50 Ω aluminium nitride ceramics substrates; It is characterized in that: it comprises the aluminium nitride substrate of a 5*2.5*1mm; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with resistance and lead, and said lead connects said resistance and forms load circuit; The both sides earth terminal of said load circuit is electrically connected with said back of the body conducting shell, is printed with glass protection film on the said resistance.
2. said impedance is 16 watts of SMD carrier sheet of 50 Ω aluminium nitride ceramics substrates according to claim 1, it is characterized in that: said back of the body conducting shell is not an integral body, and it needs the conducting of two-terminal-grounding slurry and connects.
3. impedance according to claim 1 is 16 watts of SMD carrier sheet of 50 Ω aluminium nitride ceramics substrates, and it is characterized in that: the upper surface of said lead and glass protection film also is printed with one deck black protective film.
4. impedance according to claim 1 is 16 watts of SMD carrier sheet of 50 Ω aluminium nitride ceramics substrates, and it is characterized in that: said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120350831 CN202308246U (en) | 2011-09-16 | 2011-09-16 | 16-watt surface-mounted load sheet of aluminum nitride ceramic substrate with 50-omega impedance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120350831 CN202308246U (en) | 2011-09-16 | 2011-09-16 | 16-watt surface-mounted load sheet of aluminum nitride ceramic substrate with 50-omega impedance |
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| CN202308246U true CN202308246U (en) | 2012-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201120350831 Expired - Fee Related CN202308246U (en) | 2011-09-16 | 2011-09-16 | 16-watt surface-mounted load sheet of aluminum nitride ceramic substrate with 50-omega impedance |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427155A (en) * | 2011-09-16 | 2012-04-25 | 苏州市新诚氏电子有限公司 | 16W aluminum nitride ceramic substrate SMD (Surface Mounted Device) loading chip with 50 Ohms impedance |
-
2011
- 2011-09-16 CN CN 201120350831 patent/CN202308246U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427155A (en) * | 2011-09-16 | 2012-04-25 | 苏州市新诚氏电子有限公司 | 16W aluminum nitride ceramic substrate SMD (Surface Mounted Device) loading chip with 50 Ohms impedance |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20120916 |