CN102282693A - 用于在衬底上沉积至少一个导电膜的方法 - Google Patents
用于在衬底上沉积至少一个导电膜的方法 Download PDFInfo
- Publication number
- CN102282693A CN102282693A CN201080004658XA CN201080004658A CN102282693A CN 102282693 A CN102282693 A CN 102282693A CN 201080004658X A CN201080004658X A CN 201080004658XA CN 201080004658 A CN201080004658 A CN 201080004658A CN 102282693 A CN102282693 A CN 102282693A
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- CN
- China
- Prior art keywords
- layer
- substrate
- laser
- mask
- groove
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/162—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using laser ablation
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Toxicology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
- Laser Beam Processing (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09150520 | 2009-01-14 | ||
EP09150520.6 | 2009-01-14 | ||
EP091505206 | 2009-01-14 | ||
PCT/IB2010/050083 WO2010082151A1 (en) | 2009-01-14 | 2010-01-11 | A method for deposition of at least one electrically conducting film on a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102282693A true CN102282693A (zh) | 2011-12-14 |
CN102282693B CN102282693B (zh) | 2013-10-23 |
Family
ID=42025751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080004658XA Active CN102282693B (zh) | 2009-01-14 | 2010-01-11 | 用于在衬底上沉积至少一个导电膜的方法和系统 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8809192B2 (zh) |
EP (1) | EP2387803B1 (zh) |
JP (1) | JP5731400B2 (zh) |
KR (1) | KR101639786B1 (zh) |
CN (1) | CN102282693B (zh) |
TW (1) | TWI538277B (zh) |
WO (1) | WO2010082151A1 (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012212283A1 (de) | 2012-07-13 | 2014-01-16 | Robert Bosch Gmbh | Verfahren zum Ausbilden einer elektrisch leitenden Schicht auf einem Trägerelement und Verwendung des Verfahrens |
DE102012212279A1 (de) | 2012-07-13 | 2014-01-16 | Robert Bosch Gmbh | Verfahren zum Ausbilden einer elektrisch leitenden Schicht auf einem Trägerelement und Verwendung des Verfahrens |
DE102012219063A1 (de) | 2012-10-19 | 2014-04-24 | Robert Bosch Gmbh | Verfahren und Vorrichtung zur Erzeugung einer Metallschicht auf einem Substrat |
US9437756B2 (en) | 2013-09-27 | 2016-09-06 | Sunpower Corporation | Metallization of solar cells using metal foils |
US9653638B2 (en) | 2013-12-20 | 2017-05-16 | Sunpower Corporation | Contacts for solar cells formed by directing a laser beam with a particular shape on a metal foil over a dielectric region |
US9178104B2 (en) | 2013-12-20 | 2015-11-03 | Sunpower Corporation | Single-step metal bond and contact formation for solar cells |
US9231129B2 (en) | 2014-03-28 | 2016-01-05 | Sunpower Corporation | Foil-based metallization of solar cells |
US9947812B2 (en) | 2014-03-28 | 2018-04-17 | Sunpower Corporation | Metallization of solar cells |
US9620661B2 (en) | 2014-12-19 | 2017-04-11 | Sunpower Corporation | Laser beam shaping for foil-based metallization of solar cells |
US20160380127A1 (en) | 2015-06-26 | 2016-12-29 | Richard Hamilton SEWELL | Leave-In Etch Mask for Foil-Based Metallization of Solar Cells |
US9620655B1 (en) | 2015-10-29 | 2017-04-11 | Sunpower Corporation | Laser foil trim approaches for foil-based metallization for solar cells |
US11424373B2 (en) | 2016-04-01 | 2022-08-23 | Sunpower Corporation | Thermocompression bonding approaches for foil-based metallization of non-metal surfaces of solar cells |
US10290763B2 (en) | 2016-05-13 | 2019-05-14 | Sunpower Corporation | Roll-to-roll metallization of solar cells |
US9882071B2 (en) | 2016-07-01 | 2018-01-30 | Sunpower Corporation | Laser techniques for foil-based metallization of solar cells |
US10115855B2 (en) | 2016-09-30 | 2018-10-30 | Sunpower Corporation | Conductive foil based metallization of solar cells |
WO2018106784A2 (en) | 2016-12-07 | 2018-06-14 | Djg Holdings, Llc | Preparation of large area signage stack |
US11908958B2 (en) | 2016-12-30 | 2024-02-20 | Maxeon Solar Pte. Ltd. | Metallization structures for solar cells |
CN112119508A (zh) | 2018-04-06 | 2020-12-22 | 太阳能公司 | 用于太阳能电池串接的激光辅助金属化工艺 |
WO2019195804A1 (en) | 2018-04-06 | 2019-10-10 | Sunpower Corporation | Laser assisted metallization process for solar cell circuit formation |
US11664472B2 (en) | 2018-04-06 | 2023-05-30 | Maxeon Solar Pte. Ltd. | Laser assisted metallization process for solar cell stringing |
WO2019195806A2 (en) | 2018-04-06 | 2019-10-10 | Sunpower Corporation | Local patterning and metallization of semiconductor structures using a laser beam |
US11276785B2 (en) | 2018-04-06 | 2022-03-15 | Sunpower Corporation | Laser assisted metallization process for solar cell fabrication |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04118986A (ja) * | 1990-09-10 | 1992-04-20 | Sharp Corp | 基板の回路パターン形成方法 |
JPH06299339A (ja) * | 1993-04-12 | 1994-10-25 | Tokyo Name Plate Kogyo Kyodo Kumiai | レーザ光照射による金属薄膜蒸着法 |
JPH1022237A (ja) * | 1996-07-03 | 1998-01-23 | Mitsubishi Electric Corp | 半導体装置およびレーザスクライビング法 |
CN1789006A (zh) * | 2004-10-15 | 2006-06-21 | 三星Sdi株式会社 | 激光转写设备及使用该设备制造有机发光显示器的方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5845811B2 (ja) * | 1976-08-18 | 1983-10-12 | 三菱電機株式会社 | 半導体素子チツプ面への微小導電領域の形成法 |
JPS62142369A (ja) | 1985-12-17 | 1987-06-25 | Fuji Electric Co Ltd | 太陽電池の製造方法 |
JPH0435981A (ja) * | 1990-05-31 | 1992-02-06 | Toppan Printing Co Ltd | 基板に非印刷細線部を形成する方法 |
JPH06181260A (ja) * | 1992-12-15 | 1994-06-28 | Hitachi Ltd | 微細配線の修正方法および修正装置 |
US5685995A (en) * | 1994-11-22 | 1997-11-11 | Electro Scientific Industries, Inc. | Method for laser functional trimming of films and devices |
US6159832A (en) | 1998-03-18 | 2000-12-12 | Mayer; Frederick J. | Precision laser metallization |
JP2000031013A (ja) * | 1998-07-10 | 2000-01-28 | Omron Corp | 回路パターンの修復方法及び装置、並びに、回路パターン修復用転写板 |
JP4505112B2 (ja) * | 2000-07-24 | 2010-07-21 | 独立行政法人産業技術総合研究所 | クラスター銃 |
US6717650B2 (en) | 2002-05-01 | 2004-04-06 | Anvik Corporation | Maskless lithography with sub-pixel resolution |
US7384530B2 (en) | 2002-05-07 | 2008-06-10 | Microfabrica Inc. | Methods for electrochemically fabricating multi-layer structures including regions incorporating maskless, patterned, multiple layer thickness depositions of selected materials |
KR100667069B1 (ko) | 2004-10-19 | 2007-01-10 | 삼성에스디아이 주식회사 | 도너 기판 및 그를 사용한 유기전계발광표시장치의 제조방법 |
US20060086321A1 (en) | 2004-10-22 | 2006-04-27 | Advantech Global, Ltd | Substrate-to-mask alignment and securing system with temperature control for use in an automated shadow mask vacuum deposition process |
US7279409B2 (en) | 2005-10-31 | 2007-10-09 | Freescale Semiconductor, Inc | Method for forming multi-layer bumps on a substrate |
JP4449890B2 (ja) * | 2005-11-21 | 2010-04-14 | ソニー株式会社 | 転写用基板および転写方法ならびに表示装置の製造方法 |
JP2007180123A (ja) * | 2005-12-27 | 2007-07-12 | Sanyo Electric Co Ltd | 回路装置、回路モジュールおよび回路装置の製造方法 |
JP2007294863A (ja) * | 2006-03-31 | 2007-11-08 | Sanyo Electric Co Ltd | 回路装置 |
KR20090041314A (ko) * | 2007-10-23 | 2009-04-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 증착용 기판 및 발광장치의 제조방법 |
-
2010
- 2010-01-11 CN CN201080004658XA patent/CN102282693B/zh active Active
- 2010-01-11 WO PCT/IB2010/050083 patent/WO2010082151A1/en active Application Filing
- 2010-01-11 KR KR1020117018957A patent/KR101639786B1/ko active IP Right Grant
- 2010-01-11 JP JP2011544961A patent/JP5731400B2/ja active Active
- 2010-01-11 US US13/143,940 patent/US8809192B2/en active Active
- 2010-01-11 TW TW099100601A patent/TWI538277B/zh active
- 2010-01-11 EP EP10701733.7A patent/EP2387803B1/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04118986A (ja) * | 1990-09-10 | 1992-04-20 | Sharp Corp | 基板の回路パターン形成方法 |
JPH06299339A (ja) * | 1993-04-12 | 1994-10-25 | Tokyo Name Plate Kogyo Kyodo Kumiai | レーザ光照射による金属薄膜蒸着法 |
JPH1022237A (ja) * | 1996-07-03 | 1998-01-23 | Mitsubishi Electric Corp | 半導体装置およびレーザスクライビング法 |
CN1789006A (zh) * | 2004-10-15 | 2006-06-21 | 三星Sdi株式会社 | 激光转写设备及使用该设备制造有机发光显示器的方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2012515256A (ja) | 2012-07-05 |
EP2387803B1 (en) | 2016-07-13 |
US8809192B2 (en) | 2014-08-19 |
JP5731400B2 (ja) | 2015-06-10 |
WO2010082151A1 (en) | 2010-07-22 |
TWI538277B (zh) | 2016-06-11 |
KR101639786B1 (ko) | 2016-07-15 |
KR20110114666A (ko) | 2011-10-19 |
US20110318924A1 (en) | 2011-12-29 |
EP2387803A1 (en) | 2011-11-23 |
CN102282693B (zh) | 2013-10-23 |
TW201036228A (en) | 2010-10-01 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Holland Ian Deho Finn Patentee after: KONINKLIJKE PHILIPS N.V. Address before: Holland Ian Deho Finn Patentee before: Koninklijke Philips Electronics N.V. |
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CP03 | Change of name, title or address | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170314 Address after: Eindhoven Patentee after: KONINKLIJKE PHILIPS N.V. Address before: Holland Ian Deho Finn Patentee before: KONINKLIJKE PHILIPS N.V. |
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TR01 | Transfer of patent right | ||
CP01 | Change in the name or title of a patent holder |
Address after: Eindhoven Patentee after: Signify Holdings Ltd. Address before: Eindhoven Patentee before: KONINKLIJKE PHILIPS N.V. |
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CP01 | Change in the name or title of a patent holder |