CN102233311A - 半导体装置制造装置 - Google Patents

半导体装置制造装置 Download PDF

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Publication number
CN102233311A
CN102233311A CN2011101046333A CN201110104633A CN102233311A CN 102233311 A CN102233311 A CN 102233311A CN 2011101046333 A CN2011101046333 A CN 2011101046333A CN 201110104633 A CN201110104633 A CN 201110104633A CN 102233311 A CN102233311 A CN 102233311A
Authority
CN
China
Prior art keywords
wafer
unit
adhesive
coating
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011101046333A
Other languages
English (en)
Chinese (zh)
Inventor
原晓
玉井真吾
重山昭宏
小川路夫
青柳均
田中裕之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Engineering Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Engineering Works Co Ltd filed Critical Shibaura Engineering Works Co Ltd
Publication of CN102233311A publication Critical patent/CN102233311A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
  • Dicing (AREA)
CN2011101046333A 2010-04-23 2011-04-22 半导体装置制造装置 Pending CN102233311A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-100037 2010-04-23
JP2010100037A JP5606780B2 (ja) 2010-04-23 2010-04-23 半導体装置の製造装置

Publications (1)

Publication Number Publication Date
CN102233311A true CN102233311A (zh) 2011-11-09

Family

ID=44884711

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011101046333A Pending CN102233311A (zh) 2010-04-23 2011-04-22 半导体装置制造装置

Country Status (4)

Country Link
JP (1) JP5606780B2 (https=)
KR (1) KR101257569B1 (https=)
CN (1) CN102233311A (https=)
TW (1) TW201201265A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105032711A (zh) * 2015-07-09 2015-11-11 北京中电科电子装备有限公司 一种点胶装置
WO2018171148A1 (zh) * 2017-03-24 2018-09-27 北京工业大学 一种判别并记录硅片位置的检测装置及方法
CN115593910A (zh) * 2022-10-19 2023-01-13 苏州广年科技有限公司（Cn） 防刮伤式晶圆转运方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102247118B1 (ko) * 2013-09-26 2021-04-30 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 토출 검사 장치
JP6161489B2 (ja) * 2013-09-26 2017-07-12 株式会社Ｓｃｒｅｅｎホールディングス 吐出検査装置および基板処理装置
JP6610026B2 (ja) * 2015-06-23 2019-11-27 三星ダイヤモンド工業株式会社 スクライブ装置
JP2017092313A (ja) * 2015-11-12 2017-05-25 株式会社東芝 半導体製造装置。
JP2019027623A (ja) * 2017-07-26 2019-02-21 株式会社Ｓｃｒｅｅｎホールディングス 加熱装置および加熱方法
CN113093473A (zh) * 2021-03-26 2021-07-09 硅芯崟科技(苏州)有限公司 一种mems芯片喷匀胶设备及其工艺方法

Citations (7)

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Publication number Priority date Publication date Assignee Title
KR19990033693U (ko) * 1999-05-13 1999-08-16 백명열 볼그리드어레이반도체칩제조용핀타입접착제도포장치
CN1367407A (zh) * 2000-12-26 2002-09-04 株式会社东芝 衬底处理装置和处理方法
US7090328B2 (en) * 2003-01-23 2006-08-15 Samsung Electronics Co., Ltd. Wet-type wiping apparatus of inkjet printer and maintenance apparatus having the same
CN1820951A (zh) * 2005-02-14 2006-08-23 精工爱普生株式会社 液滴喷出装置及液滴喷头的维护方法
CN1830672A (zh) * 2005-03-11 2006-09-13 芝浦机械电子装置股份有限公司 喷墨涂敷装置及喷墨头的清洁方法
CN1974027A (zh) * 2005-10-20 2007-06-06 芝浦机械电子株式会社 溶液涂敷装置及溶液供给量的计量方法、溶液的供给方法
JP2008270282A (ja) * 2007-04-16 2008-11-06 Toshiba Corp 半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0148968B1 (ko) * 1995-04-29 1998-12-15 배순훈 비젼 시스템을 이용한 도포량 자동조절장치 및 그 제어방법
JP4752822B2 (ja) * 2004-02-13 2011-08-17 セイコーエプソン株式会社 液滴吐出装置および電気光学装置の製造方法
JP2006013427A (ja) * 2004-05-25 2006-01-12 Ricoh Co Ltd 微小接着剤ノズルおよび接着剤塗布装置
JP2009090211A (ja) * 2007-10-09 2009-04-30 Seiko Epson Corp 液滴吐出ヘッドの液滴吐出量検出方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990033693U (ko) * 1999-05-13 1999-08-16 백명열 볼그리드어레이반도체칩제조용핀타입접착제도포장치
CN1367407A (zh) * 2000-12-26 2002-09-04 株式会社东芝 衬底处理装置和处理方法
US7090328B2 (en) * 2003-01-23 2006-08-15 Samsung Electronics Co., Ltd. Wet-type wiping apparatus of inkjet printer and maintenance apparatus having the same
CN1820951A (zh) * 2005-02-14 2006-08-23 精工爱普生株式会社 液滴喷出装置及液滴喷头的维护方法
CN1830672A (zh) * 2005-03-11 2006-09-13 芝浦机械电子装置股份有限公司 喷墨涂敷装置及喷墨头的清洁方法
CN1974027A (zh) * 2005-10-20 2007-06-06 芝浦机械电子株式会社 溶液涂敷装置及溶液供给量的计量方法、溶液的供给方法
JP2008270282A (ja) * 2007-04-16 2008-11-06 Toshiba Corp 半導体装置の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105032711A (zh) * 2015-07-09 2015-11-11 北京中电科电子装备有限公司 一种点胶装置
WO2018171148A1 (zh) * 2017-03-24 2018-09-27 北京工业大学 一种判别并记录硅片位置的检测装置及方法
CN115593910A (zh) * 2022-10-19 2023-01-13 苏州广年科技有限公司（Cn） 防刮伤式晶圆转运方法
CN115593910B (zh) * 2022-10-19 2024-08-06 苏州广年科技有限公司 防刮伤式晶圆转运方法

Also Published As

Publication number Publication date
TW201201265A (en) 2012-01-01
JP2011230010A (ja) 2011-11-17
KR20110118576A (ko) 2011-10-31
JP5606780B2 (ja) 2014-10-15
KR101257569B1 (ko) 2013-04-23

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Application publication date: 20111109