CN102222690B - 氮化物系半导体晶片以及氮化物系半导体装置 - Google Patents
氮化物系半导体晶片以及氮化物系半导体装置 Download PDFInfo
- Publication number
- CN102222690B CN102222690B CN201110097172.1A CN201110097172A CN102222690B CN 102222690 B CN102222690 B CN 102222690B CN 201110097172 A CN201110097172 A CN 201110097172A CN 102222690 B CN102222690 B CN 102222690B
- Authority
- CN
- China
- Prior art keywords
- nitride semiconductor
- layer
- nitride
- resistivity
- semiconductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 134
- 150000004767 nitrides Chemical class 0.000 title claims abstract description 130
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 238000009413 insulation Methods 0.000 claims description 77
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 41
- 229910002601 GaN Inorganic materials 0.000 claims description 38
- 239000013078 crystal Substances 0.000 claims description 15
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- 239000004411 aluminium Substances 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052733 gallium Inorganic materials 0.000 claims description 9
- 229910052738 indium Inorganic materials 0.000 claims description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 7
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- 238000001556 precipitation Methods 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- NWAIGJYBQQYSPW-UHFFFAOYSA-N azanylidyneindigane Chemical compound [In]#N NWAIGJYBQQYSPW-UHFFFAOYSA-N 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 description 25
- 238000005755 formation reaction Methods 0.000 description 25
- 238000000034 method Methods 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 11
- 230000009467 reduction Effects 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 239000012535 impurity Substances 0.000 description 8
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 230000005611 electricity Effects 0.000 description 6
- 238000001947 vapour-phase growth Methods 0.000 description 6
- 229910002704 AlGaN Inorganic materials 0.000 description 5
- 230000033228 biological regulation Effects 0.000 description 5
- 125000002524 organometallic group Chemical group 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 238000003723 Smelting Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000002068 genetic effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 238000000407 epitaxy Methods 0.000 description 3
- 230000005669 field effect Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 2
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-096248 | 2010-04-19 | ||
JP2010096248A JP2011228442A (ja) | 2010-04-19 | 2010-04-19 | 窒化物系半導体ウエハ及び窒化物系半導体デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102222690A CN102222690A (zh) | 2011-10-19 |
CN102222690B true CN102222690B (zh) | 2017-05-24 |
Family
ID=44779195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110097172.1A Active CN102222690B (zh) | 2010-04-19 | 2011-04-15 | 氮化物系半导体晶片以及氮化物系半导体装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20110254014A1 (zh) |
JP (1) | JP2011228442A (zh) |
CN (1) | CN102222690B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8723222B2 (en) * | 2011-07-19 | 2014-05-13 | Electronics And Telecommunications Research Institute | Nitride electronic device and method for manufacturing the same |
JP2013206976A (ja) | 2012-03-27 | 2013-10-07 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
WO2014196466A1 (ja) * | 2013-06-06 | 2014-12-11 | 日本碍子株式会社 | 13族窒化物複合基板、半導体素子、および13族窒化物複合基板の製造方法 |
TWI648858B (zh) | 2016-06-14 | 2019-01-21 | 黃知澍 | Ga-face III族/氮化物磊晶結構及其主動元件與其製作方法 |
CN107546261A (zh) * | 2016-06-29 | 2018-01-05 | 江西省昌大光电科技有限公司 | 半绝缘GaN薄膜及高电子迁移率晶体管外延结构 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1965400A (zh) * | 2004-06-10 | 2007-05-16 | 丰田合成株式会社 | 场效应晶体管、半导体器件、其制造方法和半导体晶体生长方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG135924A1 (en) * | 2003-04-02 | 2007-10-29 | Sumitomo Electric Industries | Nitride-based semiconductor epitaxial substrate, method of manufacturing the same, and hemt substrate |
WO2005122234A1 (en) * | 2004-06-10 | 2005-12-22 | Toyoda Gosei Co., Ltd. | Field-effect transistor, semiconductor device, a method for manufacturing them, and a method of semiconductor crystal growth |
KR100616619B1 (ko) * | 2004-09-08 | 2006-08-28 | 삼성전기주식회사 | 질화물계 이종접합 전계효과 트랜지스터 |
US7626217B2 (en) * | 2005-04-11 | 2009-12-01 | Cree, Inc. | Composite substrates of conductive and insulating or semi-insulating group III-nitrides for group III-nitride devices |
US7615774B2 (en) * | 2005-04-29 | 2009-11-10 | Cree.Inc. | Aluminum free group III-nitride based high electron mobility transistors |
JP2007142003A (ja) * | 2005-11-16 | 2007-06-07 | Ngk Insulators Ltd | Iii族窒化物結晶の作製方法、エピタキシャル基板における反り低減方法、エピタキシャル基板、および半導体素子 |
WO2008048303A2 (en) * | 2005-12-12 | 2008-04-24 | Kyma Technologies, Inc. | Group iii nitride articles and methods for making same |
US20080067549A1 (en) * | 2006-06-26 | 2008-03-20 | Armin Dadgar | Semiconductor component |
JP2008277655A (ja) * | 2007-05-02 | 2008-11-13 | Hitachi Cable Ltd | 半導体エピタキシャルウェハ及び電界効果トランジスタ |
CN100555692C (zh) * | 2007-09-11 | 2009-10-28 | 南京大学 | 提高掺氧硅基氮化物薄膜电致发光器件发光效率的方法 |
US20100117118A1 (en) * | 2008-08-07 | 2010-05-13 | Dabiran Amir M | High electron mobility heterojunction device |
-
2010
- 2010-04-19 JP JP2010096248A patent/JP2011228442A/ja active Pending
-
2011
- 2011-03-14 US US13/046,874 patent/US20110254014A1/en not_active Abandoned
- 2011-04-15 CN CN201110097172.1A patent/CN102222690B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1965400A (zh) * | 2004-06-10 | 2007-05-16 | 丰田合成株式会社 | 场效应晶体管、半导体器件、其制造方法和半导体晶体生长方法 |
Also Published As
Publication number | Publication date |
---|---|
US20110254014A1 (en) | 2011-10-20 |
JP2011228442A (ja) | 2011-11-10 |
CN102222690A (zh) | 2011-10-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5099008B2 (ja) | SiC基板を用いた化合物半導体装置とその製造方法 | |
JP2009507362A (ja) | ネイティブ基板を含む高電子移動度電子デバイス構造およびそれらを製造するための方法 | |
US8125001B2 (en) | Method for manufacturing gallium oxide based substrate, light emitting device, and method for manufacturing the light emitting device | |
JP2012076984A (ja) | 窒化物半導体結晶層の製造方法 | |
WO2009119357A1 (ja) | 半導体素子用エピタキシャル基板、半導体素子、および半導体素子用エピタキシャル基板の作製方法 | |
KR20100018050A (ko) | Ⅲ족 질화물 반도체 에피택셜 기판 | |
WO2007116517A1 (ja) | 化合物半導体構造とその製造方法 | |
KR20100092932A (ko) | 반도체 기판 및 반도체 기판의 제조 방법 | |
US20160079370A1 (en) | Semiconductor device, semiconductor wafer, and semiconductor device manufacturing method | |
CN102222690B (zh) | 氮化物系半导体晶片以及氮化物系半导体装置 | |
CN103003931A (zh) | 半导体元件用外延基板、半导体元件、pn接合二极管元件以及半导体元件用外延基板的制造方法 | |
JP4468744B2 (ja) | 窒化物半導体薄膜の作製方法 | |
CN113555431B (zh) | 基于P型GaN漏电隔离层的同质外延氮化镓高电子迁移率晶体管及制作方法 | |
JP2009021279A (ja) | 半導体エピタキシャルウエハ | |
JP2010062168A (ja) | 高周波用半導体素子、高周波用半導体素子形成用のエピタキシャル基板、および高周波用半導体素子形成用エピタキシャル基板の作製方法 | |
JP2006114652A (ja) | 半導体エピタキシャルウェハ及び電界効果トランジスタ | |
CN110600547B (zh) | 氮化镓基半导体器件及其制作方法 | |
CN112951910A (zh) | BAlN/GaN高电子迁移率晶体管及其制作方法 | |
CN116247506B (zh) | 一种高性能氮化镓基激光器及其N型GaN层和生长方法 | |
JP5460751B2 (ja) | 半導体装置 | |
JP2003178976A (ja) | 半導体装置およびその製造方法 | |
JP5399021B2 (ja) | 高周波用半導体素子形成用のエピタキシャル基板および高周波用半導体素子形成用エピタキシャル基板の作製方法 | |
JP2006032524A (ja) | 窒化物半導体ヘテロ構造電界効果トランジスタ構造とその作製法 | |
JP2004296701A (ja) | エピタキシャル基板ならびに半導体装置および窒化物系半導体の結晶成長方法 | |
JP2007258258A (ja) | 窒化物半導体素子ならびにその構造および作製方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: HITACHI METALS, LTD. Free format text: FORMER OWNER: HITACHI CABLE CO., LTD. Effective date: 20140306 |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20140306 Address after: Tokyo, Japan, Japan Applicant after: Hitachi Metals Co., Ltd. Address before: Tokyo, Japan, Japan Applicant before: Hitachi Cable Co., Ltd. |
|
TA01 | Transfer of patent application right | ||
ASS | Succession or assignment of patent right |
Owner name: SCIOCS COMPANY LIMITED Free format text: FORMER OWNER: HITACHI METALS, LTD. Effective date: 20150819 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20150819 Address after: Ibaraki Applicant after: Hitachi Cable Address before: Tokyo, Japan, Japan Applicant before: Hitachi Metals Co., Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160223 Address after: Tokyo, Japan, Japan Applicant after: Sumitomo Chemical Co., Ltd. Address before: Ibaraki Applicant before: Hitachi Cable |
|
GR01 | Patent grant | ||
GR01 | Patent grant |