CN102194471A - 具有电连接到不锈钢表面上的金涂层的微驱动器的悬挂组合件 - Google Patents
具有电连接到不锈钢表面上的金涂层的微驱动器的悬挂组合件 Download PDFInfo
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Abstract
本发明公开具有电连接到不锈钢表面上的金镀膜的微驱动器的悬挂组合件。一种新型悬挂组合件包括悬挂组合件安装板、从悬挂组合件安装板伸出的微驱动器安装结构、从微驱动器安装结构伸出的负载梁以及附连到负载梁的层压挠曲件。层压挠曲件包括具有读取磁头接合表面的舌状件。悬挂组合件包括具有金涂层的不锈钢表面以及附连到微驱动器安装结构并且电连接到金涂层的压电微驱动器。
Description
技术领域
本发明一般涉及信息存储装置的领域，更具体地涉及用于定位信息存储装置中的读取磁头的微驱动器和悬挂组合件。
背景技术
信息存储装置用于在计算机和其它消费电子装置中获取和/或存储数据。磁性硬盘驱动器是包括能够读和写的一个或更多个磁头的信息存储装置的示例，但是其它信息存储装置也包括磁头——这些磁头有时包括不能写的磁头。为了方便，所有能够读的磁头在此被称为“读取磁头”，而不考虑其它装置和读取磁头还可以执行的功能(例如写入，浮动高度控制、触地检测、重叠控制等)。
在现代的磁性硬盘驱动器装置中，每个读取磁头是磁头悬架(或万向架)组合件(HGA)的子部件。读取磁头通常包括滑块和读/写换能器。读/写换能器通常包括磁阻读取元件(例如所谓的巨磁阻读取元件，或者穿隧磁阻读取元件)和电感写入结构，电感写入结构包括通过光刻沉积的平坦线圈和具有面向磁盘介质的磁极尖的轭状结构。
HGA通常还包括悬挂组合件，悬挂组合件包括安装板、负载梁以及层压挠曲件以承载往来读取磁头的电信号。读取磁头通常接合到层压挠曲件的舌状部件。HGA依次是磁头堆组合件(HSA)的子部件，HSA通常包括多个HGA、转动驱动器以及柔性缆线。每个悬挂组合件的安装板被附连到转动驱动器的臂上(例如通过锻造)，并且每个层压挠曲件包括电连接到HSA的柔性缆线(例如通过焊接)的挠曲尾。
现代的层压挠曲件通常包括通过聚酰亚胺电介质层与不锈钢支撑层隔离的导电铜迹线。使得往来磁头的信号能够到达驱动器主体上的柔性缆线，每个HGA挠曲件包括从磁头沿着驱动臂伸出并且最终附连到和驱动器主体相邻的柔性缆线的挠曲尾。也就是，挠曲件包括导电迹线，导电迹线电连接到磁头上的多个导电接合焊盘并且从相邻的磁头伸出以终止于处于挠曲尾的电连接点。
HSA相对于磁盘驱动器中的旋转盘的位置，以及因此读取磁头相对于磁盘上的数据轨道的位置被通常由音圈电机(VCM)驱动的旋转驱动器有效控制。具体地，通过VCM的线圈的电流施加扭矩到转动驱动器，使得读取磁头能够寻找和跟随旋转磁盘上的期望的数据轨道。
然而，增加空间数据密度的业界趋势使急剧减少磁盘上数据轨道之间的空间成为必要。另外，磁盘驱动器性能要求，特别是关于存取期望数据所需时间的要求不允许磁盘的转动速度降低。实际上，对于很多磁盘驱动器应用，转动速度已经明显提高。这些趋势的结果是相对于旋转磁盘上数据轨道的读取磁头位置的伺服控制要求增加的带宽。
本领域已经提出的增加磁盘驱动伺服带宽的一个方案是双阶段驱动。在双阶段驱动概念中，被VCM驱动的转动驱动器被用作为粗驱动器(用于HSA位置相对于磁盘的大调整)，而具有更高带宽但是更少来回动作的所谓的“微驱动器”被用作细驱动器(用于读取磁头位置的更小调整)。在本领域中已经提出各种微驱动器设计用于磁盘驱动器应用中双阶段驱动的目的。这些设计中的一些利用固定到悬挂组合件的不锈钢部件(例如安装板或者其延伸、和/或负载梁或者其延伸、和/或将安装板连接到负载梁的中间不锈钢部件)的一个或者更多个压电微驱动器。
然而，如果微驱动器被电连接到悬挂组合件的不锈钢表面(例如为了接地)，则电化学反应可能造成在连接位置处的不锈钢上形成氧化层。氧化层可能是绝缘的并且干扰期望的导电性，并且可能由于热和湿状态而恶化。随着时间，微驱动器对施加的信号的期望响应可能变得减弱，导致信息存储装置的性能降低或者削弱和/或数据损失。
因此，信息存储装置领域中需要能够改善与微驱动器(例如压电微驱动器)的集成的悬挂组合件设计。
发明内容
一种新型悬挂组合件包括悬挂组合件安装板、从悬挂组合件安装板伸出的微驱动器安装结构、从微驱动器安装结构伸出的负载梁以及附连到负载梁的层压挠曲件。层压挠曲件包括具有读取磁头接合表面的舌状件。悬挂组合件包括具有金涂层的不锈钢表面以及附连到微驱动器安装结构并且电连接到金涂层的微驱动器。
附图说明
图1是能够包括本发明的实施例的磁盘驱动器的俯视图。
图2是能够包括本发明的实施例的磁头悬架组合件(HGA)的底部立体图。
图3是图2中标记3的区域的展开图。
图4是根据本发明的实施例的悬挂组合件的俯视立体图，在放置微驱动器之后但在电连接微驱动器之前。
图5是图4中标记5的区域的展开图。
图6是图4中标记5的区域的展开图，只是在电连接微驱动器之后。
图7是图4中标记5的区域的展开图，只是在放置微驱动器之前。
图8是根据本发明的实施例的包括安装板和微驱动器安装结构的悬挂组合件部件的俯视平面图。
具体实施方式
图1是能够包括本发明的实施例的磁盘驱动器100的俯视图。磁盘驱动器100包括磁盘驱动器基座102。磁盘驱动器100还包括可转动地安装在磁盘驱动器基座102上的枢轴106，以便转动安装在枢轴106上的磁盘104。磁盘104的转动建立通过可选的再循环过滤器108的空气流。在特定实施例中，磁盘驱动器100以仅仅具有单个磁盘104，或者，两个或者更多个磁盘。
磁盘驱动器100还包括可转动地安装在磁盘驱动器基座102上的转动粗驱动器110。转动粗驱动器110包括支撑磁头悬架组合件(HGA)118的驱动臂114。音圈电机112转动驱动器110通过有限角度范围使得HGA118可以期望地相对于磁盘104上的一个或者更多个信息轨道定位。优选地，磁盘驱动器100将每个磁盘表面包括一个HGA 118，但其中使用更少HGA的数目减少的磁盘驱动器也被考虑。在非工作状态下，HGA可以停泊在斜坡120上，例如以避免当其不旋转时与磁盘104接触。到/来自HGA 118的电信号被带到其它驱动电子器件，部分是经由柔性缆线(未示出)和柔性缆线支架116。
图2是能够包括本发明的实施例的HGA 200的底部立体图。下面额外地参照图2，HGA 200包括负载梁202以及用于从磁盘读数据和写数据到磁盘(例如磁盘104)的读取磁头210。读取磁头210包括具有空气承载表面(标记210指向该表面)和相对的顶表面(在图2的视图中不可见)的滑块衬底。滑块衬底优选包括AlTiC，尽管也可以使用其它陶瓷或者硅。读取磁头210的滑块衬底还包括拖尾面212，其包括读/写换能器(太小以至于在图2中不能实际示出，但设置在拖尾面212上)。在特定实施例中，读/写换能器优选地是与磁阻读换能器合并的电感磁写换能器。负载梁202的目的是为了向读取磁头210提供有限竖直顺从性以在磁盘(例如图1的磁盘104)的表面转动时跟随其竖直波动，以及将读取磁头210的空气承载表面通过通常称为“克加载”的预载力预载到磁盘表面。
在图2的实施例中，HGA 200还包括附连到负载梁202的层压挠曲件204。层压挠曲件204包括具有读取磁头接合表面的舌状件206。磁头210附连到层压挠曲件204的舌状件206的读取磁头接合表面。因为读取磁头210部分地遮挡舌状件206，所以在图2中舌状件206的仅仅一部分可见。层压挠曲件204的第一个目的是为磁头210提供顺从性，以在磁盘(例如磁盘104)的表面转动时遵循其俯仰和滚转角度波动，同时限制读取磁头210和负载梁202之间在横向方向和围绕摇摆轴的相对运动。层压挠曲件204的第二个目的是提供多个电路径以便于往来读取磁头210的信号传输。为了第二个目的，层压挠曲件204包括限定在层压挠曲件204的导电子层(例如铜)中的多个导电迹线218。导电迹线218通过电介质层(例如聚酰亚胺)与支撑层(例如不锈钢)隔离。
在图2的实施例中，负载梁202包括铰链板222和224，并且经过铰链板222和224和微驱动器安装结构300附连到安装板220。这些部件可以由不锈钢制成，并且其彼此的附连可以通过例如多个点焊进行。或者，负载梁202可以具有整体铰链板区域而不是用分开的铰链板部件组装，使得负载梁202及其铰链板将是具有材料连续性的单个部件。
负载梁202以及其铰链板222、224(如果存在)、微驱动器安装结构300以及安装板220可以一起被称为“悬挂组合件”。此外，安装板220还可以被称为悬挂组合件安装板220。在特定的优选实施例中，悬挂组合件安装板220包括锻造轴套226以帮助将悬挂组合件附连到驱动臂(例如驱动臂114)。在该情况下，悬挂组合件安装板220还可以被称为“锻造安装板”。请注意，在层压挠曲件204被附连到负载梁202之后，层压挠曲件204可以被认为也附属于“悬挂组合件”。然而，在层压挠曲件204被附连到负载梁202之前，术语“悬挂组合件”可以仅仅指负载梁202和其铰链板222、224(如果存在)、以及安装板220。
图3是图2中标记3的HGA 200的区域的展开图。下面额外参照图3，可看见微驱动器安装结构300从悬挂组合件安装板220伸出。在图3的实施例中，看见微驱动器安装结构300是附连到悬挂组合件安装板220(例如通过多个点焊)的单独的子部件。然而，替代地，微驱动器安装结构300和悬挂组合件安装板220可以是具有材料连续性的单个部件而不是子部件的组合件。
微驱动器安装结构300可以包括至少一个顺从臂(compliant arm)310使得微驱动器能够相对于微驱动器安装结构300的锚定部分316移动末梢部分318。例如，在图3的实施例中，微驱动器安装结构300包括两个顺从臂310和312，使得微驱动器安装结构包围窗口314。窗口314被设定尺寸使得其可以被微驱动器300跨过。然而，替代地，微驱动器安装结构300能够被设计为具有单个顺从臂(例如居中于悬挂组合件的纵轴)使得微驱动器安装结构300在末梢和根部分之间大体是I形。这种实施例可以在I形的任一侧具有跨过从末梢部分到根部分之间的距离的两个微驱动器。
在图3的实施例中，负载梁202从微驱动器安装结构300的末梢部分318伸出，其中负载梁202包括附连到微驱动器安装结构300的末梢部分318并且从其伸出的铰链板222和224。在替换实施例中，铰链板222、224和负载梁202能够是具有材料连续性的单个部件(而不是图3中所示的子部件的组合件)。
图4是根据本发明的实施例的悬挂组合件400的俯视立体图，在放置微驱动器430之后但在电连接微驱动器430之前。在图4的实施例中，悬挂组合件400包括负载梁402和附连到负载梁402的层压挠曲件404。负载梁402包括铰链板422和424，并且经过铰链板422和424附连到悬挂组合件安装板420。这些部件可以由不锈钢制成，并且它们的彼此附连可以通过例如点焊进行。替代地，负载梁402可以具有整体铰链板区域而不是用分开的铰链板部件组装，使得负载梁402及其铰链板将是具有材料连续性的单个部件。在特定的优选实施例中，悬挂组合件安装板420包括锻造轴套426以帮助悬挂组合件附连到驱动臂(例如驱动臂114)。
图5是图4中被标记为5的悬挂组合件400的区域的展开图。下面额外地参照图5，能够看出悬挂组合件安装板420包括从悬挂组合件安装板420伸出的微驱动器安装结构500。在图5的实施例中，微驱动器安装结构500包括其中可以放置微驱动器430的部分蚀刻井540。在特定优选实施例中，微驱动器430被粘合剂(例如UV固化树脂、热固化树脂等)粘贴到微驱动器安装结构500，并且这种粘合剂或者其它封装材料可以布置在微驱动器430的周围以及在部分蚀刻井内以帮助防止物品脱落。
在图5的实施例中，微驱动器安装结构500包括至少一个顺从臂510使得微驱动器430能够相对于微驱动器安装结构500的锚定部分516移动末梢部分518。例如，在图5的实施例中，微驱动器安装结构500包括两个顺从臂510和512，使得微驱动器安装结构包围窗口514。窗口514被设定尺寸使得其能够被微驱动器430跨过。然而，替代地，微驱动器安装结构500能够被设计为具有单个顺从臂使得微驱动器安装结构500在末梢部分和根部分之间是大体I形。这种实施例可以在I形的任一侧上具有跨过从末梢部分到根部分的距离的两个微驱动器。
在图5的实施例中，负载梁402从微驱动器安装结构500的末梢部分518伸出，因为负载梁402包括附连于微驱动器安装结构500的末梢部分518并且从其伸出的铰链板422和424。在替换实施例中，铰链板422、424和负载梁402能够是具有材料连续性的单个部件(而不是如图5中所示的子部件的组合件)。在图5的实施例中，微驱动器安装结构500的末梢部分518可以可选地包括粘性限制沟槽570以帮助防止粘合剂到达铰链板422、424(以及潜在地非期望地影响铰链板422、424的结构特性)。
在图5的实施例中，悬挂组合件400的微驱动器安装结构500包括不锈钢表面，不锈钢表面具有涂覆金的两个区域550和552。替代地，一个或者更多个金涂层可以布置在位于微驱动器安装结构500的锚定部分516之外但邻近锚定部分516的悬挂组合件安装板420的不锈钢表面上。替代地，金涂层可以布置在每个铰链板422、424的不锈钢表面上，在微驱动器安装结构500的末梢部分518之外但是邻近末梢部分518。在这些替换实施例的每一个中，期望的是金涂层布置得足够接近微驱动器430以便于将其电连接到微驱动器430。优选但不是必须地，微驱动器安装结构500的不锈钢表面的两个覆金区域550和552分别包括部分蚀刻的沟槽560和562。
在图5的实施例中，微驱动器430包括被绝缘区域434分离的顶电极432和436。然而，在图5的视图中，顶电极432和436不电连接到微驱动器安装结构500的不锈钢表面的两个覆金区域550和552。在特定的优选实施例中，微驱动器430是压电微驱动器，其在顶电极432下方与在顶电极436下方不同地极化，以在尽管从公共底电极(未示出)施加公共电场的情况下便于差分移动(differential motion)。在特定的其它实施例中，微驱动器是在顶电极432下方与在顶电极436下方类似地极化的压电微驱动器，差分移动是通过施加不同或者相反电压到一个相对的底电极(未示出)和另一个底电极而产生。
图6是图4中(悬挂组合件400的)标记5的区域的展开图，但在将微驱动器430的顶电极432和436电连接到微驱动器安装结构500的不锈钢表面的两个覆金区域550和552之后。图7是图4中(悬挂组合件400的)标记5的区域的展开图，但在放置微驱动器430之前。
具体地，并且现在额外地参照图6和图7，微驱动器430的顶电极432和436已经通过掺杂银颗粒的环氧粘合剂的颗粒(beads)650和652电连接到微驱动器安装结构500的不锈钢表面的两个覆金区域550和552。替代地，焊料或者金线缝合可以被用来进行电连接。然而，如果焊料被使用并且微驱动器是压电微驱动器，则可能期望焊料是低熔点的，因为它不需要变得使压电材料(例如PZT)被去极化的那样地热。
在特定实施例中，覆金区域550和552中的金涂层可以有利地减少或者防止会导致非期望的氧化层形成在连接位置处的不锈钢表面上的电化学反应，并且由此提高电连接的可靠性。请注意部分蚀刻的沟槽560和562还可以提高微驱动器430的顶电极432和436到两个覆金区域550和552的电连接的可靠性。
在特定实施例中，微驱动器可以包括两个压电元件，它们均连接到多个导电迹线(例如导电迹线218)中的至少一个。在这种实施例中，每个压电元件能够被单独激励或不同地激励，以产生微驱动器安装部分的末梢部分相对于其锚定部分的期望运动。在另一实施例中，微驱动器包括具有电连接到多个导电迹线中两个的底电极的一个压电元件(如图5所示)。在这种实施例中，不同的电压能够施加到一个压电元件的不同部分以产生微驱动器安装部分的末梢部分相对于其锚定部分的期望运动。在优选实施例中，微驱动器430包括具有电连接到多个导电迹线中的仅仅单一一个的公共底电极的一个压电元件(其中所述顶电极或多个顶电极经过悬挂组合件不锈钢结构接地)。在这种实施例中，压电元件优选地在一个表面电极下方与另一个表面电极下方不同地极化，以在尽管从单个导电迹线施加共同电压的情况下便于差分运动。请注意在上述实施例中，被接地的压电微驱动器的侧部可以经过到悬挂组合件的不锈钢部分(用作接地导体而不是层压挠曲件的接地迹线或者作为层压挠曲件的接地迹线的补充)的连接而接地。
图8是根据本发明的实施例的悬挂组合件部件800的俯视平面图。悬挂组合件部件800包括安装板部分820和从安装板部分820伸出的微驱动器安装结构801。在图8的实施例中，安装板部分820和微驱动器安装结构801被显示为具有材料连续性的单个部件而不是子部件的组合件。
在图8的实施例中，微驱动器安装结构801包括其中可以放置微驱动器的部分蚀刻井840。微驱动器安装结构801包括至少一个顺从臂810，使得微驱动器能够相对于微驱动器安装结构801的锚定部分816移动末梢部分818。例如，在图8的实施例中，微驱动器安装结构801包括两个顺从臂810和812，使得微驱动器安装结构包围窗口814。窗口814被设定尺寸使得其能够被微驱动器跨过。
在图8的实施例中，微驱动器安装结构801的末梢部分818包括不锈钢表面，该不锈钢表面具有涂覆金的两个区域850和852。替代地，一个或者更多个金涂层能够布置在安装板部分820的不锈钢表面上，例如在微驱动器安装结构801的锚定部分816之外但是与之邻近。在这些替换实施例的任一种中，期望的是金涂层布置得足够接近部分蚀刻井840以便于电连接到放置于其中的微驱动器。优选地但不必要，微驱动器安装结构801的不锈钢表面的两个覆金区域850和852分别包括部分蚀刻沟槽860和862，其可以增加与之的电连接的可靠性。在图8的实施例中，微驱动器安装结构801的末梢部分818可以可选地还包括粘性限制沟槽870。
在上述说明书中，参照具体示例实施例描述了本发明，但是本领域技术人员将认识本发明不限于此。预计本发明的各种特征和方面可以被单独使用或结合使用并且可能用在不同环境或者应用中。说明书和附图因此被认为是说明性和举例性的而不是限制性的。“包括”、“包含”以及“具有”是无限制的术语。
Claims (30)
1.一种磁盘驱动器，其包括：
磁盘驱动器基座；
附连到所述磁盘驱动器基座的枢轴；
安装在所述枢轴上的磁盘；
附连到所述磁盘驱动器基座的粗驱动器，所述粗驱动器包括驱动臂；
悬挂组合件，所述悬挂组合件包括：
附连到所述驱动臂的悬挂组合件安装板；
从所述悬挂组合件安装板伸出的微驱动器安装结构；
从所述微驱动器安装结构伸出的负载梁；以及
附连到所述负载梁的层压挠曲件，所述层压挠曲件包括舌状件；
其中所述悬挂组合件包括具有金涂层的不锈钢表面，并且还包
括附连到所述微驱动器安装结构并且电连接到所述金涂层的微驱动器；以及
接合到所述舌状件的读取磁头。
2.根据权利要求1所述出磁盘驱动器，其中所述不锈钢表面是所述微驱动器安装结构的不锈钢表面。
3.根据权利要求1所述的磁盘驱动器，其中所述不锈钢表面是所述悬挂组合件安装板的不锈钢表面。
4.根据权利要求1所述的磁盘驱动器，其中所述负载梁包括至少一个铰链板并且所述不锈钢表面是所述铰链板的不锈钢表面。
5.根据权利要求1所述的磁盘驱动器，其中所述微驱动器用掺杂银颗粒的环氧粘合剂电连接到所述金涂层。
6.根据权利要求1所述的磁盘驱动器，其中所述层压挠曲件包括结构层、电介质层以及限定多个导电迹线的导电层，并且其中所述读取磁头电连接到所述多个导电迹线中的超过一个。
7.根据权利要求6所述的磁盘驱动器，其中所述微驱动器包括两个压电元件，并且其中所述两个压电元件均电连接到所述多个导电迹线中的至少一个。
8.根据权利要求6所述的磁盘驱动器，其中所述微驱动器包括一个压电元件，并且其中所述压电元件电连接到所述多个导电迹线中的两个。
9.根据权利要求6所述的磁盘驱动器，其中所述微驱动器包括一个压电元件，并且其中所述压电元件电连接到所述多个导电迹线中的仅仅一个。
10.根据权利要求1所述的磁盘驱动器，其中所述微驱动器安装结构和所述悬挂组合件安装板是具有材料连续性的单个部件而不是子部件的组合件。
11.根据权利要求1所述的磁盘驱动器，其中所述微驱动器安装结构通过多个点焊附连到所述悬挂组合件安装板。
12.一种悬挂组合件，其包括：
悬挂组合件安装板；
从所述悬挂组合件安装板伸出的微驱动器安装结构；
从所述微驱动器安装结构伸出的负载梁；以及
附连到所述负载梁的层压挠曲件，所述层压挠曲件包括具有读取磁头接合表面的舌状件；
其中所述悬挂组合件包括具有金涂层的不锈钢表面，并且还包括附连到所述微驱动器安装结构并且电连接到所述金涂层的微驱动器。
13.根据权利要求12所述的悬挂组合件，其中所述不锈钢表面是所述微驱动器安装结构的不锈钢表面。
14.根据权利要求12所述的悬挂组合件，其中所述不锈钢表面是所述悬挂组合件安装板的不锈钢表面。
15.根据权利要求12所述的悬挂组合件，其中所述负载梁包括至少一个铰链板并且所述不锈钢表面是所述铰链板的不锈钢表面。
16.根据权利要求15所述的悬挂组合件，其中所述至少一个铰链板和负载梁是具有材料连续性的单个部件而不是子部件的组合件。
17.根据权利要求15所述的悬挂组合件，其中所述至少一个铰链板通过多个点焊附连到所述负载梁。
18.根据权利要求13所述的悬挂组合件，其中所述微驱动器安装结构和所述悬挂组合件安装板是具有材料连续性的单个部件而不是子部件的组合件。
19.根据权利要求13所述的悬挂组合件，其中所述微驱动器安装结构通过多个点焊附连到所述悬挂组合件安装板。
20.根据权利要求12所述的悬挂组合件，其中所述微驱动器用掺杂银颗粒的环氧粘合剂电连接到所述金涂层。
21.根据权利要求12所述的悬挂组合件，其中所述层压挠曲件包括结构层、电介质层以及限定多个导电迹线的导电层。
22.根据权利要求21所述的悬挂组合件，其中所述微驱动器包括两个压电元件，并且其中所述两个压电元件均电连接到所述多个导电迹线中的至少一个。
23.根据权利要求21所述的悬挂组合件，其中所述微驱动器包括一个压电元件，并且其中所述压电元件电连接到所述多个导电迹线中的仅仅一个。
24.根据权利要求12所述的悬挂组合件，还包括位于具有所述金涂层的不锈钢表面中的至少一个部分蚀刻沟槽。
25.一种磁头悬架组合件，其包括：
悬挂组合件，所述悬挂组合件包括：
悬挂组合件安装板；
从所述悬挂组合件安装板伸出的微驱动器安装结构；
从所述微驱动器安装结构伸出的负载梁；以及
附连到所述负载梁的层压挠曲件，所述层压挠曲件包括舌状件；
其中所述悬挂组合件包括具有金涂层的不锈钢表面，并且还包括附连到所述微驱动器安装结构并且电连接到所述金涂层的微驱动器；以及
接合到所述舌状件的读取磁头。
26.根据权利要求25所述的磁头悬架组合件，其中所述不锈钢表面是所述微驱动器安装结构的不锈钢表面。
27.根据权利要求25所述的磁头悬架组合件，其中所述不锈钢表面是所述悬挂组合件安装板的不锈钢表面。
28.根据权利要求25所述的磁头悬架组合件，其中所述负载梁包括至少一个铰链板并且所述不锈钢表面是所述铰链板的不锈钢表面。
29.根据权利要求25所述的磁头悬架组合件，其中所述微驱动器安装结构和所述悬挂组合件安装板是具有材料连续性的单个部件而不是子部件的组合件。
30.根据权利要求25所述的磁头悬架组合件，其中所述微驱动器安装结构通过多个点焊附连到所述悬挂组合件安装板。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/725,730 | 2010-03-17 | ||
| US12/725,730 US8542465B2 (en) | 2010-03-17 | 2010-03-17 | Suspension assembly having a microactuator electrically connected to a gold coating on a stainless steel surface |
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| Publication Number | Publication Date |
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| CN102194471A true CN102194471A (zh) | 2011-09-21 |
| CN102194471B CN102194471B (zh) | 2016-03-02 |
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| CN201110068572.XA Active CN102194471B (zh) | 2010-03-17 | 2011-03-17 | 具有电连接到不锈钢表面上的金涂层的微驱动器的悬挂组合件 |
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| Country | Link |
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| US (3) | US8542465B2 (zh) |
| CN (1) | CN102194471B (zh) |
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| US8760814B1 (en) | 2013-02-26 | 2014-06-24 | Western Digital Technologies, Inc. | Disk drive head suspension assembly having a DLC coating between dimple and tongue |
| US8699179B1 (en) | 2013-03-14 | 2014-04-15 | Western Digital Technologies, Inc. | Hermetically sealed disk drive with fill port valve |
| US8760800B1 (en) | 2013-03-14 | 2014-06-24 | Western Digital Technologies, Inc. | Sealing member for constraining balance weights |
| US8760816B1 (en) | 2013-04-10 | 2014-06-24 | Western Digital Technologies, Inc. | Disk drive with a biased actuator latch, and having a first permanent magnet that is larger than a second permanent magnet |
| US8780504B1 (en) | 2013-04-16 | 2014-07-15 | Western Digital Technologies, Inc. | Disk drive head suspension assembly with load beam inner rails between piezo actuator elements |
-
2010
- 2010-03-17 US US12/725,730 patent/US8542465B2/en active Active
-
2011
- 2011-03-17 CN CN201110068572.XA patent/CN102194471B/zh active Active
- 2011-11-14 HK HK11112275.8A patent/HK1158355A1/zh not_active IP Right Cessation
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2013
- 2013-08-28 US US14/012,449 patent/US9099131B1/en active Active
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2015
- 2015-07-17 US US14/802,329 patent/US9472218B2/en active Active
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| US5754368A (en) * | 1995-10-27 | 1998-05-19 | Tdk Corporation | Suspension, slider-suspension assembly, assembly carriage device and manufacturing method of suspension |
| US20020118492A1 (en) * | 2001-02-23 | 2002-08-29 | Mitsuru Watanabe | Magnetic head device having suspension with microactuator bonded thereto |
| CN1448919A (zh) * | 2002-03-29 | 2003-10-15 | 日本发条株式会社 | 磁盘驱动器的悬架 |
| US7218481B1 (en) * | 2002-10-07 | 2007-05-15 | Hutchinson Technology Incorporated | Apparatus for insulating and electrically connecting piezoelectric motor in dual stage actuator suspension |
| CN1858899A (zh) * | 2005-05-02 | 2006-11-08 | 半导体元件工业有限责任公司 | 半导体器件及其结构的制作方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113539301A (zh) * | 2020-04-17 | 2021-10-22 | 西部数据技术公司 | 数据存储装置对精细致动器偏置的校准 |
| CN113539301B (zh) * | 2020-04-17 | 2023-02-28 | 西部数据技术公司 | 数据存储装置对精细致动器偏置的校准 |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1158355A1 (zh) | 2012-07-13 |
| US20110228425A1 (en) | 2011-09-22 |
| US9472218B2 (en) | 2016-10-18 |
| US20160133283A1 (en) | 2016-05-12 |
| US8542465B2 (en) | 2013-09-24 |
| US9099131B1 (en) | 2015-08-04 |
| CN102194471B (zh) | 2016-03-02 |
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