CN102185078B - 贴片式户外led的封装结构及封装方法 - Google Patents

贴片式户外led的封装结构及封装方法 Download PDF

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CN102185078B
CN102185078B CN201110078466XA CN201110078466A CN102185078B CN 102185078 B CN102185078 B CN 102185078B CN 201110078466X A CN201110078466X A CN 201110078466XA CN 201110078466 A CN201110078466 A CN 201110078466A CN 102185078 B CN102185078 B CN 102185078B
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李漫铁
王绍芳
周杰
冯珍
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Ledman Optoelectronic Co Ltd
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Abstract

本发明涉及一种贴片式户外LED的封装结构及封装方法,所述封装结构,包括LED支架、发光晶片和导线,所述LED支架包括金属片和树脂反射杯,所述发光晶片固定设置在树脂反射杯杯底,所述发光晶片的正负极通过所述导线与LED支架的正负极电连接,所述树脂反射杯内填充有荧光胶,所述金属片上与树脂反射杯的结合部设有防水结构,所述防水结构为凹陷、凸起、通孔或波形纹。由于本发明贴片式户外LED的封装结构在金属片上与树脂反射杯的结合部设有防水结构,所述防水结构为凹陷、凸起、通孔或波形纹,有效地加强LED侧面的防水性能。

Description

贴片式户外LED的封装结构及封装方法
技术领域
本发明涉及一种贴片式户外LED的封装结构及封装方法。
背景技术
由红、绿、蓝三基色LED作为像素点而制作成的超大平板LED显示器,具有亮度高、色域范围广、对比度高、长寿命、节能等特点,在户外显示屏领域具有绝对优势。目前,应用于显示终端的LED主要有两种:一种是常规应用于户外的LED,即椭圆形直插式LED;另外一种就是专门应用于户内显示屏的贴片式LED。
椭圆形直插式LED由于受其结构限制,在做显示屏时,目前可以做到的点间距最小只能做到P10,即点间距为10mm,同时由于R/G/B(R:红色LED,G:绿色LED,B:蓝色LED)配光配色仍然存在不足,在0-100度角度内的画质有5%-15%的色差。如果要做到0-120度范围内色差小于5%以下,其R/G/B的芯片距离必须小于5mm,常规椭圆形LED无法满足该要求。
对于这种高分辨率的显示屏,现阶段的主要技术是采用贴片式LED来制造,然而这种高画质、高色泽一致性的户外LED显示屏所需要的贴片式LED,在封装技术领域和应用领域还存在着防水及可靠性问题:由于目前贴片式LED的支架反射杯通常使用的是PPA(Polyphthalamide聚邻苯二甲酰胺)材料,因PPA材料有比较容易吸湿的特点,在高温高湿条件下,其抗老化性下降,尤其在户外显示屏或其他特种照明产品中,容易出现封装胶体与PPA反射杯分离,从而导致死灯或整套产品报废。
发明内容
本发明主要解决的技术问题是提供一种防水性更好的贴片式户外LED的封装结构及封装方法。
为解决上述技术问题,本发明采用的技术方案是:提供一种贴片式户外LED的封装结构,包括LED支架、发光晶片和导线,所述LED支架包括金属片和树脂反射杯,所述发光晶片固定设置在树脂反射杯杯底,所述发光晶片的正负极通过所述导线与LED支架的正负极电连接,所述树脂反射杯内填充有荧光胶,所述金属片上与树脂反射杯的结合部设有防水结构,所述防水结构为凹陷、凸起、通孔或波形纹。
其中,所述发光晶片包括红光晶片、绿光晶片和蓝光晶片,所述发光晶片呈垂直排列。
其中,所述荧光胶为抗UV特性的环氧树脂。
其中,所述抗UV特性的环氧树脂内按照10∶1~10比例(重量比)添加有机树脂类或无机盐类扩散粉。
其中,所述荧光胶的表面为凸面R≥3mm,或凹面R≥2mm,或平面。
本发明的有益效果是:由于本发明贴片式户外LED的封装结构在金属片上与树脂反射杯的结合部设有防水结构,所述防水结构为凹陷、凸起、通孔或波形纹,有效地加强LED侧面的防水性能。
本发明还提供了一种贴片式户外LED的封装方法,包括以下步骤:
(1)固定发光晶片,利用底胶把发光晶片固定在LED支架的树脂反射杯杯底;
(2)对LED支架、发光晶片和底胶进行烘烤;
(3)利用导线把发光晶片的正负极和LED支架的正负极连接起来;
(4)在树脂反射杯内填充荧光胶,控制荧光胶的粘度≤1500mPa.S;
(5)对LED半成品进行烘干固化。
其中,所述发光晶片包括红光晶片、绿光晶片和蓝光晶片,所述发光晶片呈垂直排列。
其中,在步骤(5)中,对树脂反射杯内的荧光胶进行初步固化成型和二次固化成型,初步固化成型采用烘烤温度为110℃~160℃,烘烤时间为1~2小时,或者采用450nm以下和780nm以上的光谱照射,照射时间为10-120分钟;二次固化成型采用烘烤温度120℃~180℃,烘烤时间为4~6小时,或者用450nm以下和780nm以上的光谱照射,照射时间为2-6小时。
其中,所述LED支架包括金属片和树脂反射杯,金属片上与树脂反射杯的结合部设有防水结构,所述防水结构为凹陷、凸起、通孔或波形纹。
其中,所述树脂反射杯为PPA反射杯。
本发明的有益效果是:由于树脂反射杯在成型时,成型模具的表面并非完全光滑,而是具有微小的加工纹路,因此树脂反射杯的内侧面也会复制出所述纹路,另外树脂反射杯的材料一般会加入玻璃纤维,树脂反射杯的材料与玻璃纤维复合时再熔结后,也会在树脂反射杯的内侧面形成微小的沟槽结构,本发明贴片式户外LED的封装方法,在树脂反射杯内填充荧光胶时,控制荧光胶的粘度≤1500mPa.S,使荧光胶快速地渗透到纹路及沟槽结构内,完成“微孔渗透”,当荧光胶固化后,使荧光胶与树脂反射杯内侧面除了本身的物理粘附外,同时还形成物理啮合,使荧光胶和树脂反射杯结合更加紧密,达到超常规的防水性能,非常适合用于户外LED显示产品和照明产品。
附图说明
图1是本发明贴片式户外LED的封装结构实施例的俯视图;
图2是图1中A-A向剖示图;
图3是本发明贴片式户外LED的封装方法实施例的结构示意图;
图4是图3中B处放大图;
图5是本发明荧光胶的表面为凸面的LED封装结构;
图6是本发明荧光胶的表面为凹面的LED封装结构。
其中,1、金属片;11、防水结构;2、树脂反射杯;3、发光晶片;4、导线;5、荧光胶。
具体实施方式
为详细说明本发明的技术内容、构造特征、所实现目的及效果,以下结合实施方式并配合附图详予说明。
作为本发明贴片式户外LED的封装结构的实施例,请参阅图1至图6,包括LED支架、发光晶片3和导线4,所述LED支架包括金属片1和树脂反射杯2,所述发光晶片3固定设置在树脂反射杯2杯底,所述发光晶片3的正负极通过所述导线4与LED支架的正负极电连接,所述树脂反射杯2内填充有荧光胶5,所述金属片1上与树脂反射杯2的结合部设有防水结构11,所述防水结构11为凹陷、凸起、通孔或波形纹,图1所示的防水结构11为波形纹。
在本实施例中,所述树脂反射杯2可以为PPA反射杯。
本实施例中,所述导线4可以为金线、铝线、铜线或银线等金属线;所述防水结构11的凹陷或凸起的形状可以为圆形、方形、矩形或其它形状。
由于本发明贴片式户外LED的封装结构在金属片1上与树脂反射杯2的结合部设有防水结构11,有效地加强了LED侧面的防水性能。
在一实施例中,所述发光晶片3包括红光晶片、绿光晶片和蓝光晶片,所述发光晶片呈垂直排列,以确保其分别发出的红光、绿光、蓝光在水平或垂直方向的配光配色误差≤10%。
在一实施例中,所述荧光胶5为抗UV特性的环氧树脂,可以增加LED的抗UV耐候特性。
在一实施例中,所述抗UV特性的环氧树脂内按照10∶1~10比例(重量比)还添加有机树脂类或无机盐类扩散粉。
在一实施例中,所述荧光胶5的表面为凸面R≥3mm,如图5所示,或凹面R≥2mm,如图6所示,又或者为平面,以确保光学效果符合设计要求。
作为本发明所述贴片式户外LED的封装方法,包括以下步骤:
(1)固定发光晶片3,利用底胶把发光晶片3固定在LED支架的树脂反射杯2杯底;
(2)对LED支架、发光晶片3和底胶进行烘烤;
(3)利用导线4把发光晶片3的正负极和LED支架的正负极连接起来;
(4)在树脂反射杯2内填充荧光胶5,控制荧光胶5的粘度≤1500mPa.S;
(5)对LED半成品进行烘干固化。
在本实施例中,所述树脂反射杯2可以为PPA反射杯。
由于树脂反射杯在成型时,成型模具的表面并非完全光滑,而是具有微小的加工纹路,因此树脂反射杯的内侧面也会复制出所述纹路,另外树脂反射杯的材料一般会加入玻璃纤维,树脂反射杯的材料与玻璃纤维复合时再熔结后,也会在树脂反射杯的内侧面形成微小的沟槽结构,本发明贴片式户外LED的封装方法,在树脂反射杯内填充荧光胶时,控制荧光胶的粘度≤1500mPa.S,使荧光胶快速地渗透到纹路及沟槽结构内,完成“微孔渗透”,当荧光胶固化后,使荧光胶与树脂反射杯内侧面除了本身的物理粘附外,同时还形成物理啮合,使荧光胶和树脂反射杯结合更加紧密,达到超常规的防水性能,有效加强了LED产品正面防水性能,非常适合用于户外LED显示产品和照明产品。
在一实施例中,所述发光晶片3包括红光晶片、绿光晶片和蓝光晶片,所述发光晶片呈垂直排列,以确保其分别发出的红光、绿光、蓝光在水平或垂直方向的配光配色误差≤10%。
在一实施例中,在步骤(5)中,对树脂反射杯2内的荧光胶5进行初步固化成型和二次固化成型,初步固化成型采用烘烤温度为110℃~160℃,烘烤时间为1~2小时,或者采用450nm以下和780nm以上的光谱照射,照射时间为10~120分钟,使荧光胶5固化率≥60%;二次固化成型采用烘烤温度120℃~180℃,烘烤时间为4~6小时,或者用450nm以下和780nm以上的光谱照射,照射时间为2~6小时,使荧光胶5固化率≥90%。
在一实施例中,所述LED支架包括金属片1和树脂反射杯2,金属片1上与树脂反射杯2的结合部设有防水结构11,所述防水结构11为凹陷、凸起、通孔或波形纹,防水结构11可以有效地加强了LED侧面的防水性能。
在一实施例中,在步骤(3)和步骤(4)之间还包括对LED支架进行预热的步骤。
以上所述仅为本发明的实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本发明的专利保护范围内。

Claims (3)

1.一种贴片式户外LED的封装方法,其特征在于,包括以下步骤:
(1)固定发光晶片,利用底胶把发光晶片固定在LED支架的树脂反射杯杯底;
(2)对LED支架、发光晶片和底胶进行烘烤;
(3)利用导线把发光晶片的正负极和LED支架的正负极连接起来;
(4)在树脂反射杯内填充荧光胶,控制荧光胶的粘度≤1500mPa.S;
(5)对LED半成品进行烘干固化,
所述LED支架包括金属片和树脂反射杯,金属片上与树脂反射杯的结合部设有防水结构,所述防水结构为凹陷、凸起、通孔或波形纹,
在步骤(5)中,对树脂反射杯内的荧光胶进行初步固化成型和二次固化成型,初步固化成型采用烘烤温度为110℃~160℃,烘烤时间为1~2小时,或者采用450nm以下和780nm以上的光谱照射,照射时间为10-120分钟;二次固化成型采用烘烤温度120℃~180℃,烘烤时间为4~6小时,或者用450nm以下和780nm以上的光谱照射,照射时间为2-6小时。
2.根据权利要求1所述贴片式户外LED的封装方法,其特征在于:所述发光晶片包括红光晶片、绿光晶片和蓝光晶片,所述发光晶片呈垂直排列。
3.根据权利要求1所述贴片式户外LED的封装方法,其特征在于:所述树脂反射杯为PPA反射杯。 
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