CN102185078A - 贴片式户外led的封装结构及封装方法 - Google Patents
贴片式户外led的封装结构及封装方法 Download PDFInfo
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- CN102185078A CN102185078A CN201110078466XA CN201110078466A CN102185078A CN 102185078 A CN102185078 A CN 102185078A CN 201110078466X A CN201110078466X A CN 201110078466XA CN 201110078466 A CN201110078466 A CN 201110078466A CN 102185078 A CN102185078 A CN 102185078A
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- led
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110078466XA CN102185078B (zh) | 2011-03-30 | 2011-03-30 | 贴片式户外led的封装结构及封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201110078466XA CN102185078B (zh) | 2011-03-30 | 2011-03-30 | 贴片式户外led的封装结构及封装方法 |
Publications (2)
Publication Number | Publication Date |
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CN102185078A true CN102185078A (zh) | 2011-09-14 |
CN102185078B CN102185078B (zh) | 2013-02-06 |
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CN201110078466XA Active CN102185078B (zh) | 2011-03-30 | 2011-03-30 | 贴片式户外led的封装结构及封装方法 |
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Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102683552A (zh) * | 2012-05-04 | 2012-09-19 | 佛山市蓝箭电子有限公司 | 一种具有防水功能的表面贴装led及其支架 |
CN102983253A (zh) * | 2012-12-12 | 2013-03-20 | 南京汉德森科技股份有限公司 | Led荧光胶固化方法 |
CN103094452A (zh) * | 2012-11-14 | 2013-05-08 | 南京市江宁区丁卯电子科技中心 | 一种led的封装方法 |
CN103400927A (zh) * | 2013-07-25 | 2013-11-20 | 晶科电子(广州)有限公司 | 一种高可靠性led支架及其led器件 |
CN103489985A (zh) * | 2012-06-14 | 2014-01-01 | 深圳市斯迈得光电子有限公司 | 一种新型的led支架及封装结构 |
CN104051598A (zh) * | 2013-03-12 | 2014-09-17 | 安徽湛蓝光电科技有限公司 | 一种钢网式丝印荧光胶的led封装方法 |
WO2015070483A1 (zh) * | 2013-11-15 | 2015-05-21 | 深圳市华星光电技术有限公司 | Uv胶固化方法及oled封装方法 |
CN105702831A (zh) * | 2016-01-19 | 2016-06-22 | 深圳市华天迈克光电子科技有限公司 | 全彩smd显示屏支架及其固晶焊线方法 |
CN107123719A (zh) * | 2017-04-27 | 2017-09-01 | 深圳市明空光电科技有限公司 | 一种贴片式紫外led封装方法 |
US10373535B2 (en) | 2013-12-31 | 2019-08-06 | Ultravision Technologies, Llc | Modular display panel |
US10706770B2 (en) | 2014-07-16 | 2020-07-07 | Ultravision Technologies, Llc | Display system having module display panel with circuitry for bidirectional communication |
CN111554788A (zh) * | 2020-06-10 | 2020-08-18 | 广西欣亿光电科技有限公司 | 一种数码专用的led封装结构及生产工艺 |
US10871932B2 (en) | 2013-12-31 | 2020-12-22 | Ultravision Technologies, Llc | Modular display panels |
CN117650218A (zh) * | 2024-01-29 | 2024-03-05 | 广东安林电子科技股份有限公司 | 一种全彩贴片式led防水结构 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2888220Y (zh) * | 2006-03-02 | 2007-04-11 | 朱建华 | 防水密封套管装置 |
CN201112433Y (zh) * | 2007-10-26 | 2008-09-10 | 惠州市德赛电池有限公司 | 一种防水封装电池壳体 |
CN101442035A (zh) * | 2008-12-14 | 2009-05-27 | 天水华天科技股份有限公司 | 一种扁平无引线封装件及其生产方法 |
CN201699054U (zh) * | 2010-06-04 | 2011-01-05 | 浙江联众光电科技股份有限公司 | 贴片发光二极管 |
-
2011
- 2011-03-30 CN CN201110078466XA patent/CN102185078B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2888220Y (zh) * | 2006-03-02 | 2007-04-11 | 朱建华 | 防水密封套管装置 |
CN201112433Y (zh) * | 2007-10-26 | 2008-09-10 | 惠州市德赛电池有限公司 | 一种防水封装电池壳体 |
CN101442035A (zh) * | 2008-12-14 | 2009-05-27 | 天水华天科技股份有限公司 | 一种扁平无引线封装件及其生产方法 |
CN201699054U (zh) * | 2010-06-04 | 2011-01-05 | 浙江联众光电科技股份有限公司 | 贴片发光二极管 |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102683552A (zh) * | 2012-05-04 | 2012-09-19 | 佛山市蓝箭电子有限公司 | 一种具有防水功能的表面贴装led及其支架 |
CN103489985A (zh) * | 2012-06-14 | 2014-01-01 | 深圳市斯迈得光电子有限公司 | 一种新型的led支架及封装结构 |
CN103094452A (zh) * | 2012-11-14 | 2013-05-08 | 南京市江宁区丁卯电子科技中心 | 一种led的封装方法 |
CN102983253A (zh) * | 2012-12-12 | 2013-03-20 | 南京汉德森科技股份有限公司 | Led荧光胶固化方法 |
CN104051598A (zh) * | 2013-03-12 | 2014-09-17 | 安徽湛蓝光电科技有限公司 | 一种钢网式丝印荧光胶的led封装方法 |
CN103400927B (zh) * | 2013-07-25 | 2016-04-27 | 广东晶科电子股份有限公司 | 一种高可靠性led支架及其led器件 |
CN103400927A (zh) * | 2013-07-25 | 2013-11-20 | 晶科电子(广州)有限公司 | 一种高可靠性led支架及其led器件 |
WO2015070483A1 (zh) * | 2013-11-15 | 2015-05-21 | 深圳市华星光电技术有限公司 | Uv胶固化方法及oled封装方法 |
US9240566B2 (en) | 2013-11-15 | 2016-01-19 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Method for curing UV-curable resin and method for packaging OLED |
US10871932B2 (en) | 2013-12-31 | 2020-12-22 | Ultravision Technologies, Llc | Modular display panels |
US10540917B2 (en) | 2013-12-31 | 2020-01-21 | Ultravision Technologies, Llc | Modular display panel |
US10373535B2 (en) | 2013-12-31 | 2019-08-06 | Ultravision Technologies, Llc | Modular display panel |
US10380925B2 (en) | 2013-12-31 | 2019-08-13 | Ultravision Technologies, Llc | Modular display panel |
US10410552B2 (en) | 2013-12-31 | 2019-09-10 | Ultravision Technologies, Llc | Modular display panel |
US10706770B2 (en) | 2014-07-16 | 2020-07-07 | Ultravision Technologies, Llc | Display system having module display panel with circuitry for bidirectional communication |
CN105702831A (zh) * | 2016-01-19 | 2016-06-22 | 深圳市华天迈克光电子科技有限公司 | 全彩smd显示屏支架及其固晶焊线方法 |
CN107123719A (zh) * | 2017-04-27 | 2017-09-01 | 深圳市明空光电科技有限公司 | 一种贴片式紫外led封装方法 |
CN111554788A (zh) * | 2020-06-10 | 2020-08-18 | 广西欣亿光电科技有限公司 | 一种数码专用的led封装结构及生产工艺 |
CN117650218A (zh) * | 2024-01-29 | 2024-03-05 | 广东安林电子科技股份有限公司 | 一种全彩贴片式led防水结构 |
CN117650218B (zh) * | 2024-01-29 | 2024-04-16 | 广东安林电子科技股份有限公司 | 一种全彩贴片式led防水结构 |
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Denomination of invention: Packaging structure and packaging method of patch type outdoor LED Effective date of registration: 20211222 Granted publication date: 20130206 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: LEDMAN OPTOELECTROIC Co.,Ltd. Registration number: Y2021980015927 |
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Date of cancellation: 20230720 Granted publication date: 20130206 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: LEDMAN OPTOELECTROIC Co.,Ltd. Registration number: Y2021980015927 |
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