CN103489985A - 一种新型的led支架及封装结构 - Google Patents

一种新型的led支架及封装结构 Download PDF

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Publication number
CN103489985A
CN103489985A CN201210196640.5A CN201210196640A CN103489985A CN 103489985 A CN103489985 A CN 103489985A CN 201210196640 A CN201210196640 A CN 201210196640A CN 103489985 A CN103489985 A CN 103489985A
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China
Prior art keywords
novel led
chip
cavity
negative electrode
main body
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CN201210196640.5A
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English (en)
Inventor
程志坚
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SHENZHEN SMALITE OPTOELECTRONICS CO Ltd
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SHENZHEN SMALITE OPTOELECTRONICS CO Ltd
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Priority to CN201210196640.5A priority Critical patent/CN103489985A/zh
Publication of CN103489985A publication Critical patent/CN103489985A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

一种新型的LED支架及封装结构，它涉及照明技术领域。它包含支架本体(9)，支架本体(9)包含封装主体(10)、金属正电极(11)、金属负电极(12)，封装主体(10)的中间设置有凹腔(13)，金属正电极(11)的在端与金属负电极(12)的左端分别设置在凹腔(13)内 芯片(14)的背部通过固晶胶与凹腔(13)的底部粘接，金属正电极(11)的右端与金属负电极(12)的左端通过导线(15)与芯片(14)两端的电极相连，封装层(16)设置在芯片(14)上，支架本体(9)的侧面设置有凸起防滑层(9-1)。它能在拿取时，不易发生夹不稳或脱落现象，方便安装和拆卸。

Description

一种新型的LED支架及封装结构
技术领域：
本发明涉及照明技术领域，尤其涉及一种新型的LED支架及封装结构。
背景技术：
现有的LED封装结构(如图1)，首先有支架1，支架1包含封装主体2、金属正电极3、金属负电极4，封装主体2的中心位置形成凹腔5，金属正电极3、金属负电极4各自一部分露于凹腔5中，作为和芯片7表面的电极连接用，另有部分位于封装主体2之外。芯片7置于凹腔5中，用导线6将芯片7上的电极和金属正电极3、金属负电极4连接，完成电气连接。封装材料8将芯片7覆盖。此种封装结构，由于支架1的侧面1-1为光滑表面，在用镊子或其它工具夹住支架侧表面，拿取时，容易发生夹不稳或脱落的现象，给生产和应用过程造成不便。
发明内容：
本发明的目的是提供一种新型的LED支架及封装结构，它能在拿取时，不易发生夹不稳或脱落现象，方便安装和拆卸。
为了解决背景技术所存在的问题，本发明是采用如下技术方案：它包含支架本体9，支架本体9包含封装主体10、金属正电极11、金属负电极12，封装主体10的中间设置有凹腔13，金属正电极11的右端与金属负电极12的左端分别设置在凹腔13内，芯片14的背部通过固晶胶与凹腔13的底部粘接，金属正电极11的右端与金属负电极12的左端通过导线15与芯片14两端的电极相连，封装层16设置在芯片14上，所述的支架本体9的侧面设置有凸起防滑层9-1。
本发明能在拿取时，不是发生夹不稳或脱落现象，方便安装和拆卸。
附图说明：
图1为背景技术的结构示意图，
图2为图1的截面图，
图3为本发明的结构示意图，
图4为图3的截面图，
图5为具体实施方式二的结构示意图。
具体实施方式一：
参看图3-4，本具体实施方式采用如下技术方案：它包含支架本体9，支架本体9包含封装主体10、金属正电极11、金属负电极12，封装主体10的中间设置有凹腔13，金属正电极11的右端与金属负电极12的左端分别设置在凹腔13内，芯片14的背部通过固晶胶与凹腔13的底部粘接，金属正电极11的右端与金属负电极12的左端通过导线15与芯片14两端的电极相连，封装层16设置在芯片14上，所述的支架本体9的侧面设置有凸起防滑层9-1。
所述的封装主体10为圆形或方形或椭圆形或其他几何形状。
所述的封装主体10为白色树脂封装主体或陶瓷封装主体。
所述的封装层16为透明的环氧树脂或硅胶，也可为混有荧光粉和(或)起光扩散作用的无机或有机粉颗粒的环氧树脂或硅胶。
具体实施方式二：
参看图5，本具体实施方式与具体实施方式一不同处在于：所述的支架木体9的侧面设置有凹陷防滑层9-2，其它组成与连接关系和具体实施方式一相同。
本具体实施方式能在拿取时，不易发生夹不稳或脱落现象，方便安装和拆卸。

Claims (5)

1.一种新型的LED支架及封装结构，它包含支架本体(9)，支架本体(9)包含封装主体(10)、金属正电极(11)、金属负电极(12)，封装主体(10)的中间设置有凹腔(13)，金属正电极(11)的右端与金属负电极(12)的左端分别设置在凹腔(13)内 芯片(14)的背部通过固晶胶，与凹腔(13)的底部粘接，金属正电极(11)的右端与金属负电极(12)的左端通过导线(15)与芯片(14)两端的电极相连，封装层(16)设置在芯片(14)上，其特征在于所述的支架本体(9)的侧面设置有凸起防滑层(9-1)。
2.根据权利要求1所述的一种新型的LED支架及封装结构，其特征在于所述的支架本体(9)的侧面设置有凹陷防滑层(9-2)。
3.根据权利要求1所述的一种新型的LED支架及封装结构，其特征在于所述的封装主体(10)为圆形。
4.根据权利要求1所述的一种新型的LED支架及封装结构，其特征在于所述的封装主体(10)为方形。
5.根据权利要求1所述的一种新型的LED支架及封装结构，其特征在于所述的封装主体(10)为椭圆形。
CN201210196640.5A 2012-06-14 2012-06-14 一种新型的led支架及封装结构 Pending CN103489985A (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201209778Y (zh) * 2007-03-22 2009-03-18 付刚 一种改进型发光二极管发光单元
CN102185078A (zh) * 2011-03-30 2011-09-14 深圳雷曼光电科技股份有限公司 贴片式户外led的封装结构及封装方法
CN202178292U (zh) * 2011-06-22 2012-03-28 深圳市聚飞光电股份有限公司 一种led支架及led

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201209778Y (zh) * 2007-03-22 2009-03-18 付刚 一种改进型发光二极管发光单元
CN102185078A (zh) * 2011-03-30 2011-09-14 深圳雷曼光电科技股份有限公司 贴片式户外led的封装结构及封装方法
CN202178292U (zh) * 2011-06-22 2012-03-28 深圳市聚飞光电股份有限公司 一种led支架及led

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Address after: Baoan District Shiyan street Shenzhen city Guangdong province 518000 White Pine Road in Yuntai technology industrial plant building 6, 8, 9 floor

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