CN204189795U - 弧形mcob led封装结构 - Google Patents
弧形mcob led封装结构 Download PDFInfo
- Publication number
- CN204189795U CN204189795U CN201420482524.4U CN201420482524U CN204189795U CN 204189795 U CN204189795 U CN 204189795U CN 201420482524 U CN201420482524 U CN 201420482524U CN 204189795 U CN204189795 U CN 204189795U
- Authority
- CN
- China
- Prior art keywords
- cup
- substrate
- arc
- led
- encapsulation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Led Device Packages (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420482524.4U CN204189795U (zh) | 2014-08-25 | 2014-08-25 | 弧形mcob led封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420482524.4U CN204189795U (zh) | 2014-08-25 | 2014-08-25 | 弧形mcob led封装结构 |
Publications (1)
Publication Number | Publication Date |
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CN204189795U true CN204189795U (zh) | 2015-03-04 |
Family
ID=52621770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201420482524.4U Active CN204189795U (zh) | 2014-08-25 | 2014-08-25 | 弧形mcob led封装结构 |
Country Status (1)
Country | Link |
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CN (1) | CN204189795U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104319341A (zh) * | 2014-11-17 | 2015-01-28 | 深圳市晶台股份有限公司 | 一种防止led支架端子包装变形的方法 |
WO2018015781A1 (en) * | 2016-07-19 | 2018-01-25 | Ismet Yesil | Self light guided led lighting unit |
-
2014
- 2014-08-25 CN CN201420482524.4U patent/CN204189795U/zh active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104319341A (zh) * | 2014-11-17 | 2015-01-28 | 深圳市晶台股份有限公司 | 一种防止led支架端子包装变形的方法 |
CN104319341B (zh) * | 2014-11-17 | 2017-07-21 | 深圳市晶台股份有限公司 | 一种防止led支架端子包装变形的方法 |
WO2018015781A1 (en) * | 2016-07-19 | 2018-01-25 | Ismet Yesil | Self light guided led lighting unit |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180703 Address after: 523000 407, room 4, building 1, innovation and Technology Park, Songshan Lake high tech Industrial Development Zone, Dongguan, Guangdong, China Patentee after: Dongguan Yanyuan Investment Company Limited Address before: 523000, 4 floor, building 1, Songshan Lake innovation and Technology Park, Dongguan, Guangdong. Patentee before: Dongguan Institute of Opto-Electronics Peking University |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180802 Address after: 523000 Dongguan, Guangdong Province, the town of Xiao Lang village, 8 Patentee after: DONGGUAN ZHONGHAO LIGHTING TECHNOLOGY CO., LTD. Address before: 523000 407, room 4, building 1, innovation and Technology Park, Songshan Lake high tech Industrial Development Zone, Dongguan, Guangdong, China Patentee before: Dongguan Yanyuan Investment Company Limited |