WO2018015781A1 - Self light guided led lighting unit - Google Patents

Self light guided led lighting unit Download PDF

Info

Publication number
WO2018015781A1
WO2018015781A1 PCT/IB2016/001491 IB2016001491W WO2018015781A1 WO 2018015781 A1 WO2018015781 A1 WO 2018015781A1 IB 2016001491 W IB2016001491 W IB 2016001491W WO 2018015781 A1 WO2018015781 A1 WO 2018015781A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
lighting unit
led lighting
cob led
Prior art date
Application number
PCT/IB2016/001491
Other languages
French (fr)
Inventor
Ismet Yesil
Qumars MOHAMADE
Original Assignee
Ismet Yesil
Mohamade Qumars
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ismet Yesil, Mohamade Qumars filed Critical Ismet Yesil
Publication of WO2018015781A1 publication Critical patent/WO2018015781A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/10—Light sources with three-dimensionally disposed light-generating elements on concave supports or substrates, e.g. on the inner side of bowl-shaped supports
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/70—Light sources with three-dimensionally disposed light-generating elements on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Definitions

  • the present invention relates to a chip-on-board (COB) type LED lighting unit capable of guiding light ideally with no lens.
  • COB chip-on-board
  • the COB LED lighting units mainly comprise various LED chips arranged directly on a printed circuit board (PCB). LED chips are bonded to the printed circuit board by means of an adhesive with a high thermal conductivity and electrical connection is established between the LED and conductive lines formed on the printed circuit board by means of conductive wires.
  • a cooling layer is provided which is made of a material with high conductivity, such as aluminum, ceramic etc. Thus, the heat flow from the LED towards the printed circuit board is discharged.
  • a phosphor-containing silica gel or an epoxy resin-containing window layer is provided at the upper portion of the LEDs which is opened to allow exit of the light.
  • lenses used are also arranged on this window layer. Lenses may considerably affect efficiency of a LED lighting unit. In fact, lenses may have deficiencies in light guiding functions because of manufacturing errors. Furthermore, when the incident light is guided by a lens, a portion of light is reflected back, which results in a loss of efficiency of the lighting unit.
  • the geometric form of the printed circuit board imposes to use a lens in a COB LED lighting unit of a known configuration.
  • the known COB LED printed circuit board (similarly, the underlying cooling layer for heat transfer) has a flat form. Therefore, lenses must be used if a certain area is to be illuminated by the light at an angle of 60°, 90° and 120°.
  • An object of the invention is to increase efficiency of COB LEDs in an effective manner.
  • the present invention relates to a COB LED lighting unit comprising a printed circuit board, and at least one LED positioned thereon, wherein the printed circuit board has a form which is at least partially curved and the at least one LED is positioned on the said at least partially curved form; wherein the COB LED lighting unit does not comprise a lens for guiding the LED light.
  • the printed circuit board has a form of a concave ellipsoid or a spherical cap surface.
  • the printed circuit board has at least two forms with different curvatures.
  • the printed circuit board comprises at least one flat surface and at least one curved surface. In an embodiment of the invention, it comprises a cooling layer associated with the lower portion of the said printed circuit board and the form of the said cooling layer preferably corresponds to that of the printed circuit board.
  • Figure 1 is a perspective view of a COB LED array according to the prior art.
  • Figure 2 is a sectional view of a COB LED array according to the prior art.
  • Figure 3 is a perspective view of a COB LED array according to the invention.
  • Figure 4 is a sectional view of a COB LED array according to the invention.
  • Figure 5 is a sectional view of an alternative embodiment of a COB LED array according to the invention.
  • the COB LED lighting unit comprises a number of - at least one - LEDs (2), a printed circuit board (1) on which LEDs are positioned, and a cooling layer (3) covering the printed circuit board (1) underside. Since the operational connection of these components is known from the prior art, description thereof is omitted.
  • the printed circuit board (1) has a concave and ellipsoid cap surface form.
  • the LEDs are suitably distributed on this surface.
  • the curve of the printed circuit board (1) and the way in which the LEDs are distributed thereon may vary depending on the diffusion of the light desired in the area to be illuminated. For example, if a symmetrical light area is desired, it is likely that the printed circuit board (1) displays a form of a concave spherical cap surface and the LEDs are, in turn, arranged on the printed circuit board (1) in the corresponding number and with a uniform distribution.
  • the area desired to be illuminated is, for example, a street, an avenue etc.
  • a printed circuit board (1) with an asymmetric geometry as shown in Figure 5.
  • Said asymmetric geometry may for example be comprised of a section of the printed circuit board (1) that comprises a curved surface (4) and a section thereof that comprises a flat surface (5).
  • the printed circuit board (1) may have at least two curved forms with different curves, based on the lighting needs of the area to be illuminated.
  • the cooling layer (3) which is located underside of the printed circuit board (1) has a form corresponding to that of the printed circuit board (1).
  • mounting tolerances should be considered, taking into consideration of expansions arising from the temperature differences.
  • the printed circuit board (1) though not illustrated in the drawings, may have a convex surface form, and the light may be focused on the desired region by arranging the LEDs on the convex surface in the corresponding number and with a suitable shape.
  • the COB LED lighting unit may comprise a conventional reflector. Similarly, it may comprise, at the upper portion of the LEDs which is opened to allow exit of the light, a phosphor-containing silica gel or an epoxy resin-containing window layer.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a COB LED lighting unit including a printed circuit board, and at least one LED positioned thereon, wherein the printed circuit board has a form which is at least partially curved and the at least one LED is positioned on the said at least partially curved form. Here, the COB LED lighting unit does not comprise lenses for guiding the LED light.

Description

SELF LIGHT GUIDED LED LIGHTING UNIT
DESCRIPTION
TECHNICAL FIELD
The present invention relates to a chip-on-board (COB) type LED lighting unit capable of guiding light ideally with no lens.
BACKGROUND OF THE INVENTION
The COB LED lighting units mainly comprise various LED chips arranged directly on a printed circuit board (PCB). LED chips are bonded to the printed circuit board by means of an adhesive with a high thermal conductivity and electrical connection is established between the LED and conductive lines formed on the printed circuit board by means of conductive wires. At the bottom of the printed circuit board, a cooling layer is provided which is made of a material with high conductivity, such as aluminum, ceramic etc. Thus, the heat flow from the LED towards the printed circuit board is discharged.
At the upper portion of the LEDs which is opened to allow exit of the light, a phosphor-containing silica gel or an epoxy resin-containing window layer is provided. When it is desired to illuminate a certain area with the light, lenses used are also arranged on this window layer. Lenses may considerably affect efficiency of a LED lighting unit. In fact, lenses may have deficiencies in light guiding functions because of manufacturing errors. Furthermore, when the incident light is guided by a lens, a portion of light is reflected back, which results in a loss of efficiency of the lighting unit.
Essentially, the geometric form of the printed circuit board imposes to use a lens in a COB LED lighting unit of a known configuration. As shown in Figures 1 and 2, the known COB LED printed circuit board (similarly, the underlying cooling layer for heat transfer) has a flat form. Therefore, lenses must be used if a certain area is to be illuminated by the light at an angle of 60°, 90° and 120°.
DESCRIPTION OF THE INVENTION
An object of the invention is to increase efficiency of COB LEDs in an effective manner.
In order to achieve the above object, the present invention relates to a COB LED lighting unit comprising a printed circuit board, and at least one LED positioned thereon, wherein the printed circuit board has a form which is at least partially curved and the at least one LED is positioned on the said at least partially curved form; wherein the COB LED lighting unit does not comprise a lens for guiding the LED light.
In an embodiment of the invention, the printed circuit board has a form of a concave ellipsoid or a spherical cap surface.
In an embodiment of the invention, the printed circuit board has at least two forms with different curvatures.
In an embodiment of the invention, the printed circuit board comprises at least one flat surface and at least one curved surface. In an embodiment of the invention, it comprises a cooling layer associated with the lower portion of the said printed circuit board and the form of the said cooling layer preferably corresponds to that of the printed circuit board.
BRIEF DESCRIPTION OF THE DRAWINGS
Figure 1 is a perspective view of a COB LED array according to the prior art. Figure 2 is a sectional view of a COB LED array according to the prior art. Figure 3 is a perspective view of a COB LED array according to the invention.
Figure 4 is a sectional view of a COB LED array according to the invention. Figure 5 is a sectional view of an alternative embodiment of a COB LED array according to the invention.
REFERANCE NUMBERS OF THE PARTS IN THE DRAWINGS 1 Printed circuit board
2 LED
3 Cooling layer
4 Curved surface
5 Flat surface
DETAILED DESCRIPTION OF THE INVENTION
In order to provide a better understanding of the invention, LED arrays of the COB LED lighting unit according to the invention are shown in the drawings. Accordingly, the COB LED lighting unit comprises a number of - at least one - LEDs (2), a printed circuit board (1) on which LEDs are positioned, and a cooling layer (3) covering the printed circuit board (1) underside. Since the operational connection of these components is known from the prior art, description thereof is omitted.
As shown in Figure 3, the printed circuit board (1) has a concave and ellipsoid cap surface form. The LEDs are suitably distributed on this surface. The curve of the printed circuit board (1) and the way in which the LEDs are distributed thereon may vary depending on the diffusion of the light desired in the area to be illuminated. For example, if a symmetrical light area is desired, it is likely that the printed circuit board (1) displays a form of a concave spherical cap surface and the LEDs are, in turn, arranged on the printed circuit board (1) in the corresponding number and with a uniform distribution. On the other hand, if the area desired to be illuminated is, for example, a street, an avenue etc., it may be suitable to use a printed circuit board (1) with an asymmetric geometry, as shown in Figure 5. Said asymmetric geometry may for example be comprised of a section of the printed circuit board (1) that comprises a curved surface (4) and a section thereof that comprises a flat surface (5). Likewise, the printed circuit board (1) may have at least two curved forms with different curves, based on the lighting needs of the area to be illuminated.
As shown in Figures 4 and 5, the cooling layer (3) which is located underside of the printed circuit board (1) has a form corresponding to that of the printed circuit board (1). However, in view of the conditions of an environment where the COB LED lighting unit is to be used, especially a cold outer environment, mounting tolerances should be considered, taking into consideration of expansions arising from the temperature differences.
The printed circuit board (1), though not illustrated in the drawings, may have a convex surface form, and the light may be focused on the desired region by arranging the LEDs on the convex surface in the corresponding number and with a suitable shape.
With the curved form of the printed circuit board (1) and the LEDs (2) arranged thereon in a suitable manner, an ideally lens-free COB LED lighting unit is achieved. Optionally, the COB LED lighting unit may comprise a conventional reflector. Similarly, it may comprise, at the upper portion of the LEDs which is opened to allow exit of the light, a phosphor-containing silica gel or an epoxy resin-containing window layer.

Claims

1. A COB LED lighting unit comprising a printed circuit board (1) and at least one LED (2) positioned thereon, characterized in that the printed circuit board (1) has a form which is at least partially curved and the at least one LED (2) is positioned on the said at least partially curved form, and in that the printed circuit board (1) does not comprise a lens for guiding the LED light.
2. A COB LED lighting unit according to claim 1 , characterized in that the printed circuit board (1) has a concave ellipsoid cap surface form.
3. A COB LED lighting unit according to claim 1 , characterized in that the printed circuit board (1) has a concave spherical cap surface form.
4. A COB LED lighting unit according to claim 1 , characterized in that the printed circuit board (1) has at least two curved forms with different curvatures.
5. A COB LED lighting unit according to claim 1 , characterized in that the printed circuit board (1) has at least one flat surface (5) and at least one curved surface (4).
6. A COB LED lighting unit according to claim 1 , characterized in that the said cooling layer (3) has a form corresponding to that of the printed circuit board (1).
7. A COB LED lighting unit according to the foregoing claims, characterized by comprising a reflector.
8. A COB LED lighting unit according to the foregoing claims, characterized by comprising, at the upper portion of the LEDs, a phosphor-containing silica gel or an epoxy resin-containing window layer.
PCT/IB2016/001491 2016-07-19 2016-10-14 Self light guided led lighting unit WO2018015781A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TR201610022 2016-07-19
TR2016/10022 2016-07-19

Publications (1)

Publication Number Publication Date
WO2018015781A1 true WO2018015781A1 (en) 2018-01-25

Family

ID=57233777

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2016/001491 WO2018015781A1 (en) 2016-07-19 2016-10-14 Self light guided led lighting unit

Country Status (1)

Country Link
WO (1) WO2018015781A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011253782A (en) * 2010-06-04 2011-12-15 Panasonic Corp Led lamp
US20130114243A1 (en) * 2011-11-08 2013-05-09 Industrial Technology Research Institute Ceiling fixture
US20140232288A1 (en) * 2013-02-15 2014-08-21 Cree, Inc. Solid state lighting apparatuses and related methods
US20150034976A1 (en) * 2013-08-02 2015-02-05 Led Folio Corporation Led chip-on-board type flexible pcb and flexible heat spreader sheet pad and heat-sink structure using the same
CN204189795U (en) * 2014-08-25 2015-03-04 北京大学东莞光电研究院 Arc MCOB LED encapsulation structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011253782A (en) * 2010-06-04 2011-12-15 Panasonic Corp Led lamp
US20130114243A1 (en) * 2011-11-08 2013-05-09 Industrial Technology Research Institute Ceiling fixture
US20140232288A1 (en) * 2013-02-15 2014-08-21 Cree, Inc. Solid state lighting apparatuses and related methods
US20150034976A1 (en) * 2013-08-02 2015-02-05 Led Folio Corporation Led chip-on-board type flexible pcb and flexible heat spreader sheet pad and heat-sink structure using the same
CN204189795U (en) * 2014-08-25 2015-03-04 北京大学东莞光电研究院 Arc MCOB LED encapsulation structure

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