CN102176425B - 笛卡尔机械臂群集工具架构 - Google Patents

笛卡尔机械臂群集工具架构 Download PDF

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Publication number
CN102176425B
CN102176425B CN201110080003.7A CN201110080003A CN102176425B CN 102176425 B CN102176425 B CN 102176425B CN 201110080003 A CN201110080003 A CN 201110080003A CN 102176425 B CN102176425 B CN 102176425B
Authority
CN
China
Prior art keywords
assembly
mechanical arm
base material
processing procedure
cluster tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110080003.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN102176425A (zh
Inventor
M·利斯
J·胡金斯
C·卡尔森
W·T·威弗
R·劳伦斯
E·英格哈特
D·C·鲁泽克
D·塞法缇
M·库查
K·范凯特
V·霍斯金
V·沙阿
S·洪乔姆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/315,778 external-priority patent/US20060182535A1/en
Priority claimed from US11/315,984 external-priority patent/US7651306B2/en
Priority claimed from US11/315,873 external-priority patent/US7374391B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN102176425A publication Critical patent/CN102176425A/zh
Application granted granted Critical
Publication of CN102176425B publication Critical patent/CN102176425B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CN201110080003.7A 2005-04-22 2006-04-07 笛卡尔机械臂群集工具架构 Expired - Fee Related CN102176425B (zh)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US67384805P 2005-04-22 2005-04-22
US60/673,848 2005-04-22
US11/315,778 2005-12-22
US11/315,778 US20060182535A1 (en) 2004-12-22 2005-12-22 Cartesian robot design
US11/315,984 US7651306B2 (en) 2004-12-22 2005-12-22 Cartesian robot cluster tool architecture
US11/315,984 2005-12-22
US11/315,873 2005-12-22
US11/315,873 US7374391B2 (en) 2005-12-22 2005-12-22 Substrate gripper for a substrate handling robot

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2006800133558A Division CN101164138B (zh) 2005-04-22 2006-04-07 笛卡尔机械臂群集工具架构

Publications (2)

Publication Number Publication Date
CN102176425A CN102176425A (zh) 2011-09-07
CN102176425B true CN102176425B (zh) 2013-02-06

Family

ID=36676525

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201110080003.7A Expired - Fee Related CN102176425B (zh) 2005-04-22 2006-04-07 笛卡尔机械臂群集工具架构
CN201210342380.8A Expired - Fee Related CN102867764B (zh) 2005-04-22 2006-04-07 笛卡尔机械臂群集工具架构
CN2006800133558A Expired - Fee Related CN101164138B (zh) 2005-04-22 2006-04-07 笛卡尔机械臂群集工具架构

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201210342380.8A Expired - Fee Related CN102867764B (zh) 2005-04-22 2006-04-07 笛卡尔机械臂群集工具架构
CN2006800133558A Expired - Fee Related CN101164138B (zh) 2005-04-22 2006-04-07 笛卡尔机械臂群集工具架构

Country Status (5)

Country Link
JP (2) JP5265343B2 (enExample)
KR (1) KR100960765B1 (enExample)
CN (3) CN102176425B (enExample)
TW (1) TWI345817B (enExample)
WO (1) WO2006115745A1 (enExample)

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KR100265287B1 (ko) 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US8636458B2 (en) 2007-06-06 2014-01-28 Asml Netherlands B.V. Integrated post-exposure bake track
CN101332604B (zh) * 2008-06-20 2010-06-09 哈尔滨工业大学 人机相互作用机械臂的控制方法
KR101803111B1 (ko) * 2010-01-08 2017-11-29 케이엘에이-텐코 코포레이션 이중 트레이 캐리어 유닛
US9435826B2 (en) 2012-05-08 2016-09-06 Kla-Tencor Corporation Variable spacing four-point probe pin device and method
JP6182065B2 (ja) * 2013-12-27 2017-08-16 東京エレクトロン株式会社 基板処理装置
JP2015207622A (ja) * 2014-04-18 2015-11-19 株式会社ディスコ 搬送機構
EP2947686A1 (en) * 2014-05-19 2015-11-25 Meyer Burger AG Wafer processing method
US9555545B2 (en) * 2014-05-21 2017-01-31 Bot & Dolly, Llc Systems and methods for time-based parallel robotic operation
JP6559976B2 (ja) * 2015-03-03 2019-08-14 川崎重工業株式会社 基板搬送ロボットおよび基板処理システム
KR102478317B1 (ko) 2015-04-08 2022-12-16 도쿄엘렉트론가부시키가이샤 기판 처리 시스템
JP6425639B2 (ja) * 2015-04-08 2018-11-21 東京エレクトロン株式会社 基板処理システム
TWI602131B (zh) 2016-05-26 2017-10-11 台灣積體電路製造股份有限公司 倉儲系統及倉儲系統控制方法
KR101885257B1 (ko) * 2016-11-03 2018-08-03 포톤데이즈(주) 다수 매거진 구조의 광소자 신뢰성 및 특성 검사 장치
EP3361316A1 (de) * 2017-02-14 2018-08-15 VAT Holding AG Pneumatische stifthubvorrichtung und pneumatischer hubzylinder
TWI678277B (zh) * 2017-03-21 2019-12-01 德律科技股份有限公司 障礙偵測方法及壓床防撞方法
JP6902379B2 (ja) 2017-03-31 2021-07-14 東京エレクトロン株式会社 処理システム
CN114026680A (zh) * 2019-02-14 2022-02-08 柿子技术公司 带有双连杆臂的线性机器人
CN112582318B (zh) * 2019-09-30 2025-07-25 沈阳芯源微电子设备股份有限公司 涂胶显影设备
JP7536582B2 (ja) * 2020-10-01 2024-08-20 ニデックインスツルメンツ株式会社 搬送システム
US12162145B2 (en) * 2021-11-17 2024-12-10 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveying robot and substrate conveying robot system
KR102870016B1 (ko) * 2021-12-29 2025-10-17 세메스 주식회사 기판 반송 장치 및 이를 가지는 기판 처리 설비

Citations (1)

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US6099643A (en) * 1996-12-26 2000-08-08 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing a substrate providing an efficient arrangement and atmospheric isolation of chemical treatment section

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JPH08222616A (ja) * 1995-02-13 1996-08-30 Dainippon Screen Mfg Co Ltd 基板処理装置
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JP3957445B2 (ja) * 1999-07-02 2007-08-15 東京エレクトロン株式会社 基板処理装置および基板処理方法
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JP4547524B2 (ja) * 2000-12-05 2010-09-22 川崎重工業株式会社 ワーク処理方法、ワーク処理装置およびロボット
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Also Published As

Publication number Publication date
JP2008538654A (ja) 2008-10-30
CN102176425A (zh) 2011-09-07
CN102867764A (zh) 2013-01-09
WO2006115745A1 (en) 2006-11-02
CN101164138A (zh) 2008-04-16
KR20070120175A (ko) 2007-12-21
CN102867764B (zh) 2015-06-17
JP5265343B2 (ja) 2013-08-14
TWI345817B (en) 2011-07-21
CN101164138B (zh) 2012-10-17
JP5329705B2 (ja) 2013-10-30
JP2013030787A (ja) 2013-02-07
TW200707621A (en) 2007-02-16
KR100960765B1 (ko) 2010-06-01

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SE01 Entry into force of request for substantive examination
C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Address after: California, USA

Applicant after: APPLIED MATERIALS, Inc.

Address before: California, USA

Applicant before: APPLIED MATERIALS, Inc.

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130206

CF01 Termination of patent right due to non-payment of annual fee