CN102110241A - 制造电子卡的方法 - Google Patents
制造电子卡的方法 Download PDFInfo
- Publication number
- CN102110241A CN102110241A CN2010106232184A CN201010623218A CN102110241A CN 102110241 A CN102110241 A CN 102110241A CN 2010106232184 A CN2010106232184 A CN 2010106232184A CN 201010623218 A CN201010623218 A CN 201010623218A CN 102110241 A CN102110241 A CN 102110241A
- Authority
- CN
- China
- Prior art keywords
- electronic
- electronic unit
- diaphragm
- packing material
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 50
- 239000007787 solid Substances 0.000 claims abstract description 66
- 239000011347 resin Substances 0.000 claims abstract description 51
- 229920005989 resin Polymers 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims description 69
- 239000000463 material Substances 0.000 claims description 59
- 238000012856 packing Methods 0.000 claims description 55
- 238000009434 installation Methods 0.000 claims description 35
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- 230000009257 reactivity Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 2
- 239000007790 solid phase Substances 0.000 claims 3
- 230000000903 blocking effect Effects 0.000 claims 1
- 230000001681 protective effect Effects 0.000 abstract description 6
- 230000002093 peripheral effect Effects 0.000 abstract description 3
- 210000002105 tongue Anatomy 0.000 description 8
- 230000008021 deposition Effects 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 210000004276 hyalin Anatomy 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 208000005189 Embolism Diseases 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009422 external insulation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 108091008695 photoreceptors Proteins 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004148 unit process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Claims (28)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09180782A EP2341471B1 (fr) | 2009-12-28 | 2009-12-28 | Procédé de fabrication de cartes électroniques |
EP09180782.6 | 2009-12-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102110241A true CN102110241A (zh) | 2011-06-29 |
CN102110241B CN102110241B (zh) | 2014-10-22 |
Family
ID=42126329
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010623218.4A Expired - Fee Related CN102110241B (zh) | 2009-12-28 | 2010-12-28 | 制造电子卡的方法 |
Country Status (14)
Country | Link |
---|---|
US (1) | US8402646B2 (zh) |
EP (1) | EP2341471B1 (zh) |
JP (1) | JP5408801B2 (zh) |
KR (1) | KR101665140B1 (zh) |
CN (1) | CN102110241B (zh) |
AU (1) | AU2010257415B2 (zh) |
CA (1) | CA2725309C (zh) |
ES (1) | ES2405981T3 (zh) |
HK (1) | HK1157904A1 (zh) |
MX (1) | MX2010014342A (zh) |
PL (1) | PL2341471T3 (zh) |
PT (1) | PT2341471E (zh) |
SG (1) | SG172580A1 (zh) |
SI (1) | SI2341471T1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NO20093601A1 (no) | 2009-12-29 | 2011-06-30 | Idex Asa | Overflatesensor |
GB201208680D0 (en) | 2012-05-17 | 2012-06-27 | Origold As | Method of manufacturing an electronic card |
CN108027892B (zh) * | 2015-09-18 | 2021-04-09 | X卡控股有限公司 | 用于信息携带卡的自定心嵌体和芯层、过程以及得到的产品 |
CN105721749B (zh) * | 2016-02-24 | 2020-07-24 | 宁波舜宇光电信息有限公司 | 摄像模组及其电气支架和线路板组件及制造方法 |
US10984304B2 (en) | 2017-02-02 | 2021-04-20 | Jonny B. Vu | Methods for placing an EMV chip onto a metal card |
USD956760S1 (en) * | 2018-07-30 | 2022-07-05 | Lion Credit Card Inc. | Multi EMV chip card |
DE102020122437A1 (de) | 2020-08-27 | 2022-03-03 | Infineon Technologies Ag | Package, Verfahren zum Bilden eines Packages, Trägerband, Chipkarte und Verfahren zum Bilden eines Trägerbands |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1703718A (zh) * | 2002-10-11 | 2005-11-30 | 纳格雷德股份有限公司 | 具有在一个表面上可见的元件的电子组件及这种组件的制造方法 |
CN1829416A (zh) * | 2005-02-28 | 2006-09-06 | 三星电机株式会社 | 嵌入式芯片印刷电路板及其制造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3466108D1 (en) * | 1983-06-09 | 1987-10-15 | Flonic Sa | Method of producing memory cards, and cards obtained thereby |
DE19601389A1 (de) * | 1996-01-16 | 1997-07-24 | Siemens Ag | Chipkartenkörper |
JP4249381B2 (ja) | 2000-10-06 | 2009-04-02 | Nec液晶テクノロジー株式会社 | 回路基板およびそれを用いた液晶表示装置 |
JP4396618B2 (ja) | 2005-11-10 | 2010-01-13 | パナソニック株式会社 | カード型情報装置およびその製造方法 |
-
2009
- 2009-12-28 PT PT91807826T patent/PT2341471E/pt unknown
- 2009-12-28 EP EP09180782A patent/EP2341471B1/fr not_active Not-in-force
- 2009-12-28 ES ES09180782T patent/ES2405981T3/es active Active
- 2009-12-28 PL PL09180782T patent/PL2341471T3/pl unknown
- 2009-12-28 SI SI200930595T patent/SI2341471T1/sl unknown
-
2010
- 2010-12-14 CA CA2725309A patent/CA2725309C/en not_active Expired - Fee Related
- 2010-12-17 KR KR1020100129580A patent/KR101665140B1/ko active IP Right Grant
- 2010-12-20 MX MX2010014342A patent/MX2010014342A/es active IP Right Grant
- 2010-12-21 SG SG2010094902A patent/SG172580A1/en unknown
- 2010-12-23 AU AU2010257415A patent/AU2010257415B2/en not_active Ceased
- 2010-12-24 JP JP2010287048A patent/JP5408801B2/ja not_active Expired - Fee Related
- 2010-12-28 CN CN201010623218.4A patent/CN102110241B/zh not_active Expired - Fee Related
- 2010-12-28 US US12/979,620 patent/US8402646B2/en not_active Expired - Fee Related
-
2011
- 2011-09-08 HK HK11109479.8A patent/HK1157904A1/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1703718A (zh) * | 2002-10-11 | 2005-11-30 | 纳格雷德股份有限公司 | 具有在一个表面上可见的元件的电子组件及这种组件的制造方法 |
CN1829416A (zh) * | 2005-02-28 | 2006-09-06 | 三星电机株式会社 | 嵌入式芯片印刷电路板及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
AU2010257415B2 (en) | 2016-07-21 |
ES2405981T3 (es) | 2013-06-04 |
SG172580A1 (en) | 2011-07-28 |
MX2010014342A (es) | 2011-06-27 |
KR20110076772A (ko) | 2011-07-06 |
EP2341471A1 (fr) | 2011-07-06 |
CN102110241B (zh) | 2014-10-22 |
CA2725309C (en) | 2018-01-23 |
US20110154662A1 (en) | 2011-06-30 |
KR101665140B1 (ko) | 2016-10-11 |
EP2341471B1 (fr) | 2013-02-20 |
PT2341471E (pt) | 2013-05-08 |
PL2341471T3 (pl) | 2013-08-30 |
US8402646B2 (en) | 2013-03-26 |
JP2011138508A (ja) | 2011-07-14 |
AU2010257415A1 (en) | 2011-07-14 |
JP5408801B2 (ja) | 2014-02-05 |
CA2725309A1 (en) | 2011-06-28 |
HK1157904A1 (zh) | 2012-07-06 |
SI2341471T1 (sl) | 2013-06-28 |
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Owner name: NAGRAVISION SA Free format text: FORMER OWNER: NAGRAID SA Effective date: 20150709 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150709 Address after: geneva Patentee after: Nagravision SA Address before: La Chaux-de-Fonds Patentee before: Nagraid SA |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141022 Termination date: 20191228 |
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CF01 | Termination of patent right due to non-payment of annual fee |