CN102110241B - 制造电子卡的方法 - Google Patents
制造电子卡的方法 Download PDFInfo
- Publication number
- CN102110241B CN102110241B CN201010623218.4A CN201010623218A CN102110241B CN 102110241 B CN102110241 B CN 102110241B CN 201010623218 A CN201010623218 A CN 201010623218A CN 102110241 B CN102110241 B CN 102110241B
- Authority
- CN
- China
- Prior art keywords
- electronic unit
- electronic
- diaphragm
- packing material
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Claims (28)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09180782A EP2341471B1 (fr) | 2009-12-28 | 2009-12-28 | Procédé de fabrication de cartes électroniques |
EP09180782.6 | 2009-12-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102110241A CN102110241A (zh) | 2011-06-29 |
CN102110241B true CN102110241B (zh) | 2014-10-22 |
Family
ID=42126329
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010623218.4A Expired - Fee Related CN102110241B (zh) | 2009-12-28 | 2010-12-28 | 制造电子卡的方法 |
Country Status (14)
Country | Link |
---|---|
US (1) | US8402646B2 (zh) |
EP (1) | EP2341471B1 (zh) |
JP (1) | JP5408801B2 (zh) |
KR (1) | KR101665140B1 (zh) |
CN (1) | CN102110241B (zh) |
AU (1) | AU2010257415B2 (zh) |
CA (1) | CA2725309C (zh) |
ES (1) | ES2405981T3 (zh) |
HK (1) | HK1157904A1 (zh) |
MX (1) | MX2010014342A (zh) |
PL (1) | PL2341471T3 (zh) |
PT (1) | PT2341471E (zh) |
SG (1) | SG172580A1 (zh) |
SI (1) | SI2341471T1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NO20093601A1 (no) | 2009-12-29 | 2011-06-30 | Idex Asa | Overflatesensor |
GB201208680D0 (en) | 2012-05-17 | 2012-06-27 | Origold As | Method of manufacturing an electronic card |
EP3350750B1 (en) * | 2015-09-18 | 2020-11-04 | X-Card Holdings, LLC | Self-centered inlay and core layer for information carrying card, process and resulting products |
CN105721749B (zh) * | 2016-02-24 | 2020-07-24 | 宁波舜宇光电信息有限公司 | 摄像模组及其电气支架和线路板组件及制造方法 |
US10984304B2 (en) | 2017-02-02 | 2021-04-20 | Jonny B. Vu | Methods for placing an EMV chip onto a metal card |
USD956760S1 (en) * | 2018-07-30 | 2022-07-05 | Lion Credit Card Inc. | Multi EMV chip card |
DE102020122437A1 (de) | 2020-08-27 | 2022-03-03 | Infineon Technologies Ag | Package, Verfahren zum Bilden eines Packages, Trägerband, Chipkarte und Verfahren zum Bilden eines Trägerbands |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1703718A (zh) * | 2002-10-11 | 2005-11-30 | 纳格雷德股份有限公司 | 具有在一个表面上可见的元件的电子组件及这种组件的制造方法 |
CN1829416A (zh) * | 2005-02-28 | 2006-09-06 | 三星电机株式会社 | 嵌入式芯片印刷电路板及其制造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3466108D1 (en) | 1983-06-09 | 1987-10-15 | Flonic Sa | Method of producing memory cards, and cards obtained thereby |
DE19601389A1 (de) * | 1996-01-16 | 1997-07-24 | Siemens Ag | Chipkartenkörper |
JP4249381B2 (ja) * | 2000-10-06 | 2009-04-02 | Nec液晶テクノロジー株式会社 | 回路基板およびそれを用いた液晶表示装置 |
JP4396618B2 (ja) * | 2005-11-10 | 2010-01-13 | パナソニック株式会社 | カード型情報装置およびその製造方法 |
-
2009
- 2009-12-28 PL PL09180782T patent/PL2341471T3/pl unknown
- 2009-12-28 EP EP09180782A patent/EP2341471B1/fr active Active
- 2009-12-28 ES ES09180782T patent/ES2405981T3/es active Active
- 2009-12-28 PT PT91807826T patent/PT2341471E/pt unknown
- 2009-12-28 SI SI200930595T patent/SI2341471T1/sl unknown
-
2010
- 2010-12-14 CA CA2725309A patent/CA2725309C/en not_active Expired - Fee Related
- 2010-12-17 KR KR1020100129580A patent/KR101665140B1/ko active IP Right Grant
- 2010-12-20 MX MX2010014342A patent/MX2010014342A/es active IP Right Grant
- 2010-12-21 SG SG2010094902A patent/SG172580A1/en unknown
- 2010-12-23 AU AU2010257415A patent/AU2010257415B2/en not_active Ceased
- 2010-12-24 JP JP2010287048A patent/JP5408801B2/ja not_active Expired - Fee Related
- 2010-12-28 US US12/979,620 patent/US8402646B2/en not_active Expired - Fee Related
- 2010-12-28 CN CN201010623218.4A patent/CN102110241B/zh not_active Expired - Fee Related
-
2011
- 2011-09-08 HK HK11109479.8A patent/HK1157904A1/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1703718A (zh) * | 2002-10-11 | 2005-11-30 | 纳格雷德股份有限公司 | 具有在一个表面上可见的元件的电子组件及这种组件的制造方法 |
CN1829416A (zh) * | 2005-02-28 | 2006-09-06 | 三星电机株式会社 | 嵌入式芯片印刷电路板及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP5408801B2 (ja) | 2014-02-05 |
JP2011138508A (ja) | 2011-07-14 |
PL2341471T3 (pl) | 2013-08-30 |
SG172580A1 (en) | 2011-07-28 |
AU2010257415A1 (en) | 2011-07-14 |
PT2341471E (pt) | 2013-05-08 |
AU2010257415B2 (en) | 2016-07-21 |
US20110154662A1 (en) | 2011-06-30 |
CA2725309A1 (en) | 2011-06-28 |
KR101665140B1 (ko) | 2016-10-11 |
EP2341471B1 (fr) | 2013-02-20 |
CN102110241A (zh) | 2011-06-29 |
US8402646B2 (en) | 2013-03-26 |
CA2725309C (en) | 2018-01-23 |
MX2010014342A (es) | 2011-06-27 |
HK1157904A1 (zh) | 2012-07-06 |
KR20110076772A (ko) | 2011-07-06 |
SI2341471T1 (sl) | 2013-06-28 |
EP2341471A1 (fr) | 2011-07-06 |
ES2405981T3 (es) | 2013-06-04 |
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TR01 | Transfer of patent right |
Effective date of registration: 20150709 Address after: geneva Patentee after: Nagravision SA Address before: La Chaux-de-Fonds Patentee before: Nagraid SA |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141022 Termination date: 20191228 |
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CF01 | Termination of patent right due to non-payment of annual fee |