CN102076164A - 一种微波高频电路板 - Google Patents

一种微波高频电路板 Download PDF

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Publication number
CN102076164A
CN102076164A CN 201110023103 CN201110023103A CN102076164A CN 102076164 A CN102076164 A CN 102076164A CN 201110023103 CN201110023103 CN 201110023103 CN 201110023103 A CN201110023103 A CN 201110023103A CN 102076164 A CN102076164 A CN 102076164A
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circuit board
substrate
copper foil
microwave high
frequency
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CN102076164B (zh
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倪新军
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TAIZHOU BOTAI ELECTRONICS CO., LTD.
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倪新军
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Abstract

本发明公开了一种微波高频电路板，它包括高频单面覆铜箔基板(1)，该基板(1)上设有若干接线孔(5)，在基板1覆铜箔的一面设有铜箔线路层(2)，所述铜箔线路层(2)上设有阻焊层(3)；所述基板1的另一面设有复合介质材料层(4)，在复合介质材料层(4)上设有阻焊层(3)。本发明提供的一种微波高频电路板，它不但可以调节电路板的介电常数，而且可调节电路板的阻抗性能，拓宽了微波高频线路的设计范围，使电路板电气性能的品质因数有了很大的选择范围。

Description

一种微波高频电路板
技术领域
本发明涉及一种微波高频电路板。
背景技术
目前电子产品的运行速度越来越快，频率越来越高，已经进入到微波阶段，微波即无线电波，它的频率比普通无线电波更高，进入微波阶段后电子产品对电路板的电气性能提出了许多要求，诸如介电常数、特性阻抗等品质因数，电路板基材就决定了电路板的电气性能，品质因数的选择性范围很窄，限制了微波高频线路的设计范围，很难满足电子通讯产品多元化的设计需求。
发明内容
本发明提供了一种微波高频电路板，它不但可以调节电路板的介电常数，而且可调节电路板的阻抗性能，拓宽了微波高频线路的设计范围，使电路板电气性能的品质因数有了很大的选择范围。
本发明采用了以下技术方案：一种微波高频电路板，它包括高频单面覆铜箔基板，该基板上设有若干接线孔，在基板覆铜箔的一面设有铜箔线路层，所述铜箔线路层上设有阻焊层；所述基板的另一面设有复合介质材料层，在复合介质材料层上设有阻焊层。
所述的复合介质材料层是由金红石粉和绝缘玻璃胶混合而成。
本发明具有以下有益效果：本发明采用金红石粉和绝缘玻璃胶按一定的比例混合后形成的复合介质材料，在高频基板介质层的一面用丝网印刷复合介质材料，通过金红石粉和绝缘玻璃胶的配比来调节介电常数和特性阻抗，可以根据客户的设计要求在高频基板的介质材料上涂覆，来增强高频电路板的电气性能，有利于客户产品的多元化设计。
附图说明
图1为本发明的结构示意图。
具体实施方式
在图1中，本发明为一种微波高频电路板，它包括高频单面覆铜箔基板1，该基板1上设有若干接线孔5，在基板1覆铜箔的一面设有铜箔线路层2，所述铜箔线路层2上设有阻焊层3。所述基板1的另一面涂覆金红石粉和绝缘玻璃胶按比例混合的复合介质材料4，在复合介质材料4上设有阻焊层3。

Claims (2)

1.一种微波高频电路板，它包括高频单面覆铜箔基板(1)，该基板(1)上设有若干接线孔(5)，其特征是在基板1覆铜箔的一面设有铜箔线路层(2)，所述铜箔线路层(2)上设有阻焊层(3)；所述基板1的另一面设有复合介质材料层(4)，在复合介质材料层(4)上设有阻焊层(3)。
2.根据权利要求1所述的一种微波高频电路板，其特征是所述的复合介质材料层(4)是由金红石粉和绝缘玻璃胶混合而成。
CN2011100231036A 2011-01-17 2011-01-17 一种微波高频电路板 Active CN102076164B (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102421243A (zh) * 2011-08-06 2012-04-18 倪新军 一种微波高频电路板

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985002750A1 (en) * 1983-12-13 1985-06-20 Rolf Dahlberg Printed circuit board
CN1380812A (zh) * 2002-02-07 2002-11-20 泰州市旺灵绝缘材料厂 一种复合介质覆铜箔基片及其制造方法
US20040004823A1 (en) * 2002-03-13 2004-01-08 Mitsui Mining & Smelting Co., Ltd. COF flexible printed wiring board and method of producing the wiring board
US20060068164A1 (en) * 2004-09-29 2006-03-30 Mitsui Mining & Smelting Co., Ltd. Film carrier tape for mounting electronic devices thereon and flexible substrate
US20070116964A1 (en) * 2005-11-14 2007-05-24 World Properties, Inc. Adhesive compositions for flexible circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
CN101232774A (zh) * 2007-01-24 2008-07-30 南京汉德森科技股份有限公司 高热导率陶瓷基印刷电路板及其制作方法
CN201986258U (zh) * 2011-01-17 2011-09-21 倪新军 一种微波高频电路板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985002750A1 (en) * 1983-12-13 1985-06-20 Rolf Dahlberg Printed circuit board
CN1380812A (zh) * 2002-02-07 2002-11-20 泰州市旺灵绝缘材料厂 一种复合介质覆铜箔基片及其制造方法
US20040004823A1 (en) * 2002-03-13 2004-01-08 Mitsui Mining & Smelting Co., Ltd. COF flexible printed wiring board and method of producing the wiring board
US20060068164A1 (en) * 2004-09-29 2006-03-30 Mitsui Mining & Smelting Co., Ltd. Film carrier tape for mounting electronic devices thereon and flexible substrate
US20070116964A1 (en) * 2005-11-14 2007-05-24 World Properties, Inc. Adhesive compositions for flexible circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
CN101232774A (zh) * 2007-01-24 2008-07-30 南京汉德森科技股份有限公司 高热导率陶瓷基印刷电路板及其制作方法
CN201986258U (zh) * 2011-01-17 2011-09-21 倪新军 一种微波高频电路板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102421243A (zh) * 2011-08-06 2012-04-18 倪新军 一种微波高频电路板

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