CN102034768A - 具有晶粒埋入式以及双面覆盖重增层的基板结构及其方法 - Google Patents
具有晶粒埋入式以及双面覆盖重增层的基板结构及其方法 Download PDFInfo
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- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
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- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
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- H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
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- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US23284709A | 2009-09-25 | 2009-09-25 | |
US12/232,847 | 2009-09-25 |
Publications (2)
Publication Number | Publication Date |
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CN102034768A true CN102034768A (zh) | 2011-04-27 |
CN102034768B CN102034768B (zh) | 2012-09-05 |
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CN2009101775389A Expired - Fee Related CN102034768B (zh) | 2008-09-25 | 2009-09-15 | 具有晶粒埋入式以及双面覆盖重增层的基板结构及其方法 |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102088013A (zh) * | 2009-12-02 | 2011-06-08 | 杨文焜 | 具有晶粒埋入式以及双面覆盖重增层之基板结构及其方法 |
CN102832181A (zh) * | 2011-06-13 | 2012-12-19 | 矽品精密工业股份有限公司 | 芯片尺寸封装件 |
CN103681518A (zh) * | 2012-09-12 | 2014-03-26 | 景硕科技股份有限公司 | 芯片及载板的封装结构 |
CN104008980A (zh) * | 2013-02-22 | 2014-08-27 | 英飞凌科技股份有限公司 | 半导体器件 |
CN104425465A (zh) * | 2013-08-28 | 2015-03-18 | 三星电机株式会社 | 电子组件模块和制造该电子组件模块的方法 |
CN105280624A (zh) * | 2014-07-17 | 2016-01-27 | 三星电机株式会社 | 电子装置模块及其制造方法 |
CN106816416A (zh) * | 2015-11-27 | 2017-06-09 | 蔡亲佳 | 半导体嵌入式混合封装结构及其制作方法 |
CN109257874A (zh) * | 2018-11-16 | 2019-01-22 | 深圳市和美精艺科技有限公司 | 一种在pcb板制作过程中芯片埋入的方法及其结构 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI517321B (zh) * | 2014-12-08 | 2016-01-11 | 旭德科技股份有限公司 | 封裝結構及其製作方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1163960C (zh) * | 2000-12-13 | 2004-08-25 | 矽品精密工业股份有限公司 | 具有高散热性的超薄封装件及其制造方法 |
US7830004B2 (en) * | 2006-10-27 | 2010-11-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packaging with base layers comprising alloy 42 |
US20080191335A1 (en) * | 2007-02-08 | 2008-08-14 | Advanced Chip Engineering Technology Inc. | Cmos image sensor chip scale package with die receiving opening and method of the same |
-
2009
- 2009-09-15 CN CN2009101775389A patent/CN102034768B/zh not_active Expired - Fee Related
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102088013A (zh) * | 2009-12-02 | 2011-06-08 | 杨文焜 | 具有晶粒埋入式以及双面覆盖重增层之基板结构及其方法 |
CN102088013B (zh) * | 2009-12-02 | 2012-10-10 | 金龙国际公司 | 具有晶粒埋入式以及双面覆盖重增层之基板结构及其方法 |
CN102832181A (zh) * | 2011-06-13 | 2012-12-19 | 矽品精密工业股份有限公司 | 芯片尺寸封装件 |
CN102832181B (zh) * | 2011-06-13 | 2015-06-10 | 矽品精密工业股份有限公司 | 芯片尺寸封装件 |
CN103681518A (zh) * | 2012-09-12 | 2014-03-26 | 景硕科技股份有限公司 | 芯片及载板的封装结构 |
CN104008980A (zh) * | 2013-02-22 | 2014-08-27 | 英飞凌科技股份有限公司 | 半导体器件 |
CN104425465A (zh) * | 2013-08-28 | 2015-03-18 | 三星电机株式会社 | 电子组件模块和制造该电子组件模块的方法 |
CN105280624A (zh) * | 2014-07-17 | 2016-01-27 | 三星电机株式会社 | 电子装置模块及其制造方法 |
CN106816416A (zh) * | 2015-11-27 | 2017-06-09 | 蔡亲佳 | 半导体嵌入式混合封装结构及其制作方法 |
CN106816416B (zh) * | 2015-11-27 | 2020-02-14 | 蔡亲佳 | 半导体嵌入式混合封装结构及其制作方法 |
CN109257874A (zh) * | 2018-11-16 | 2019-01-22 | 深圳市和美精艺科技有限公司 | 一种在pcb板制作过程中芯片埋入的方法及其结构 |
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