CN102034562B - 导电性糊剂 - Google Patents

导电性糊剂 Download PDF

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Publication number
CN102034562B
CN102034562B CN2010105036622A CN201010503662A CN102034562B CN 102034562 B CN102034562 B CN 102034562B CN 2010105036622 A CN2010105036622 A CN 2010105036622A CN 201010503662 A CN201010503662 A CN 201010503662A CN 102034562 B CN102034562 B CN 102034562B
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China
Prior art keywords
conductive paste
carboxylic acid
conductive
pattern
acid resin
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Chinese (zh)
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CN102034562A (zh
Inventor
佐佐木正树
小田桐悠斗
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Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

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  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN2010105036622A 2009-09-30 2010-09-30 导电性糊剂 Active CN102034562B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-227885 2009-09-30
JP2009227885A JP5560014B2 (ja) 2009-09-30 2009-09-30 導電性ペースト

Publications (2)

Publication Number Publication Date
CN102034562A CN102034562A (zh) 2011-04-27
CN102034562B true CN102034562B (zh) 2012-10-31

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ID=43887321

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010105036622A Active CN102034562B (zh) 2009-09-30 2010-09-30 导电性糊剂

Country Status (3)

Country Link
JP (1) JP5560014B2 (ko)
KR (2) KR101392597B1 (ko)
CN (1) CN102034562B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012038625A (ja) * 2010-08-09 2012-02-23 Sekisui Chem Co Ltd 導電性微粒子分散ペースト
JP5771072B2 (ja) 2011-06-08 2015-08-26 太陽ホールディングス株式会社 導電性ペースト
US8696860B1 (en) * 2012-10-10 2014-04-15 E I Du Pont De Nemours And Company Lamination of polymer thick film conductor compositions
JP7023042B2 (ja) * 2015-11-04 2022-02-21 株式会社ノリタケカンパニーリミテド 導電ペーストおよび導体膜の形成方法
CN106279740B (zh) * 2016-08-19 2019-04-16 清华大学深圳研究生院 一种树脂混合物、透明导电膜及其制备方法
CN106336521B (zh) * 2016-08-19 2019-03-26 清华大学深圳研究生院 一种树脂混合物、透明导电膜及其图形化制备方法
WO2018150697A1 (ja) * 2017-02-14 2018-08-23 バンドー化学株式会社 グラビアオフセット印刷用導電性ペースト、導電性パターンの形成方法、及び、導電性基板の製造方法
JP6348241B1 (ja) * 2017-02-14 2018-06-27 バンドー化学株式会社 グラビアオフセット印刷用導電性ペースト、導電性パターンの形成方法、及び、導電性基板の製造方法
WO2018179838A1 (ja) * 2017-03-30 2018-10-04 ハリマ化成株式会社 導電性ペースト
JP6618969B2 (ja) * 2017-10-13 2019-12-11 株式会社ノリタケカンパニーリミテド 導電性ペースト
KR102124997B1 (ko) * 2018-10-05 2020-06-22 주식회사 아이에스시 도전성 입자의 제조방법 및 그 제조방법으로 제조된 도전성 입자

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1072708A (zh) * 1992-11-17 1993-06-02 上海开林造漆厂 一种新颖聚氨酯导电漆
CN1269386A (zh) * 1999-03-25 2000-10-11 株式会社村田制作所 光敏型导电膏
CN1269585A (zh) * 1999-03-10 2000-10-11 东洋纺绩株式会社 导电糊
CN101000810A (zh) * 2007-01-05 2007-07-18 华南理工大学 导电组合物
CN101354926A (zh) * 2008-09-16 2009-01-28 彩虹集团公司 含碳银导体浆料的制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH064790B2 (ja) * 1985-09-27 1994-01-19 東芝ケミカル株式会社 導電性ペ−スト
CA2322517C (en) * 1998-12-28 2008-10-14 Nof Corporation Thermosetting composition containing polyhemiacetal ester resin and powdery thermosetting composition
JP3614152B2 (ja) * 2001-08-07 2005-01-26 株式会社村田製作所 感光性導電ペースト、それを用いた回路基板及びセラミック多層基板の製造方法
JP2003281937A (ja) * 2002-03-22 2003-10-03 Dainippon Printing Co Ltd ポリエーテルポリオール系樹脂を用いた感光性導電ペースト、電極の形成方法及び電極
CN100357336C (zh) * 2002-10-25 2007-12-26 旭化成化学株式会社 胶囊型硬化剂及其组合物
JP3975932B2 (ja) * 2003-02-12 2007-09-12 株式会社村田製作所 光反応性樹脂組成物、回路基板の製造方法、およびセラミック多層基板の製造方法
JP4253306B2 (ja) * 2005-03-01 2009-04-08 太陽インキ製造株式会社 感光性ペースト及びそれを用いて形成した焼成物パターン
JP5134352B2 (ja) * 2007-12-13 2013-01-30 ナミックス株式会社 導電性ペースト

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1072708A (zh) * 1992-11-17 1993-06-02 上海开林造漆厂 一种新颖聚氨酯导电漆
CN1269585A (zh) * 1999-03-10 2000-10-11 东洋纺绩株式会社 导电糊
CN1269386A (zh) * 1999-03-25 2000-10-11 株式会社村田制作所 光敏型导电膏
CN101000810A (zh) * 2007-01-05 2007-07-18 华南理工大学 导电组合物
CN101354926A (zh) * 2008-09-16 2009-01-28 彩虹集团公司 含碳银导体浆料的制备方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP昭62-72749A 1987.04.03

Also Published As

Publication number Publication date
CN102034562A (zh) 2011-04-27
KR101392597B1 (ko) 2014-05-08
JP2011076899A (ja) 2011-04-14
KR20130060241A (ko) 2013-06-07
JP5560014B2 (ja) 2014-07-23
KR20110035946A (ko) 2011-04-06

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