CN101978016B - 粘接剂组合物 - Google Patents

粘接剂组合物 Download PDF

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Publication number
CN101978016B
CN101978016B CN2010800011133A CN201080001113A CN101978016B CN 101978016 B CN101978016 B CN 101978016B CN 2010800011133 A CN2010800011133 A CN 2010800011133A CN 201080001113 A CN201080001113 A CN 201080001113A CN 101978016 B CN101978016 B CN 101978016B
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China
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weight parts
adhesive composition
weight
resinous principle
mentioned
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CN2010800011133A
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Chinese (zh)
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CN101978016A (zh
Inventor
木下淳一
寺田恒彦
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Tatsuta Electric Wire and Cable Co Ltd
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Tatsuta Electric Wire and Cable Co Ltd
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Publication of CN101978016A publication Critical patent/CN101978016A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/24—Graft or block copolymers according to groups C08L51/00, C08L53/00 or C08L55/02; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Inorganic Chemistry (AREA)
  • Combinations Of Printed Boards (AREA)
CN2010800011133A 2009-01-26 2010-01-15 粘接剂组合物 Active CN101978016B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009014152A JP4580021B2 (ja) 2009-01-26 2009-01-26 接着剤組成物
JP2009-014152 2009-01-26
PCT/JP2010/000207 WO2010084722A1 (fr) 2009-01-26 2010-01-15 Composition adhésive

Publications (2)

Publication Number Publication Date
CN101978016A CN101978016A (zh) 2011-02-16
CN101978016B true CN101978016B (zh) 2013-07-17

Family

ID=42355780

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800011133A Active CN101978016B (zh) 2009-01-26 2010-01-15 粘接剂组合物

Country Status (5)

Country Link
JP (1) JP4580021B2 (fr)
KR (1) KR101022124B1 (fr)
CN (1) CN101978016B (fr)
TW (1) TWI378132B (fr)
WO (1) WO2010084722A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5825503B2 (ja) * 2009-12-22 2015-12-02 スリーボンドファインケミカル株式会社 異方導電性接着剤
CN102906211B (zh) * 2010-07-23 2014-11-05 大自达电线股份有限公司 导电性粘合剂组合物及导电性粘合膜
JP5675975B2 (ja) * 2011-05-31 2015-02-25 タツタ電線株式会社 接着剤組成物及び接着フィルム
JP5849036B2 (ja) * 2012-09-27 2016-01-27 富士フイルム株式会社 導電ペースト、プリント配線基板
CN103173180B (zh) * 2013-03-23 2015-06-24 广东新展化工新材料有限公司 一种热塑性胶黏剂及其制备方法
JP6251888B2 (ja) * 2014-06-25 2017-12-27 パナソニックＩｐマネジメント株式会社 投影システム
CN105367735A (zh) * 2015-11-23 2016-03-02 苏州盖德精细材料有限公司 一种鞋用聚氨酯胶粘剂及其制备方法
KR102336265B1 (ko) * 2020-06-22 2021-12-06 김병수 오염물질 침입 방지형 이동식 캐리어
KR20240063725A (ko) 2022-11-03 2024-05-10 율촌화학 주식회사 벤딩성 및 단차 추종성이 우수한 열경화형 도전성 접착 필름
KR20240063724A (ko) 2022-11-03 2024-05-10 율촌화학 주식회사 단차 추종성과 레진플로우가 우수한 열경화형 도전성 접착 필름

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0878505A1 (fr) * 1996-11-22 1998-11-18 Daicel Chemical Industries, Ltd. Compositions thermofusibles et objets moules multicouches comprenant les couches renfermant ces compositions
CN101255262A (zh) * 2008-04-01 2008-09-03 宁波一舟塑胶有限公司 可与尼龙包覆粘结的热塑性弹性体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0757865B2 (ja) * 1990-10-05 1995-06-21 日本ゼオン株式会社 粘着剤組成物
JP3420809B2 (ja) * 1993-12-16 2003-06-30 信越ポリマー株式会社 導電性粒子およびこれを用いた異方導電接着剤
JP3846757B2 (ja) * 1997-08-06 2006-11-15 古河電気工業株式会社 ケーブル
JP4406785B2 (ja) * 2002-10-22 2010-02-03 株式会社スリーボンド 接着剤組成物
WO2005090509A1 (fr) * 2004-03-19 2005-09-29 Three Bond Co., Ltd. Composition adhesive thermique photovulcanisable de type film
JP4673116B2 (ja) * 2004-11-01 2011-04-20 タツタ電線株式会社 異方導電性接着剤及びこれを用いて形成された電子機器
JP2008274044A (ja) * 2007-04-26 2008-11-13 Fujitsu Ltd 粘着材料、これを用いたタッチパネル型入力装置およびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0878505A1 (fr) * 1996-11-22 1998-11-18 Daicel Chemical Industries, Ltd. Compositions thermofusibles et objets moules multicouches comprenant les couches renfermant ces compositions
CN101255262A (zh) * 2008-04-01 2008-09-03 宁波一舟塑胶有限公司 可与尼龙包覆粘结的热塑性弹性体

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
G.霍尔登等.《热塑性弹性体》.《热塑性弹性体》.化学工业出版社,2000,(第1版),第372页. *

Also Published As

Publication number Publication date
WO2010084722A1 (fr) 2010-07-29
JP2010168510A (ja) 2010-08-05
CN101978016A (zh) 2011-02-16
TW201031728A (en) 2010-09-01
KR101022124B1 (ko) 2011-03-17
JP4580021B2 (ja) 2010-11-10
KR20100096259A (ko) 2010-09-01
TWI378132B (en) 2012-12-01

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