CN101973146B - 带有载体的预浸料及其制造工艺、薄双面板及其制造工艺和多层印刷电路板的制造工艺 - Google Patents

带有载体的预浸料及其制造工艺、薄双面板及其制造工艺和多层印刷电路板的制造工艺 Download PDF

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Publication number
CN101973146B
CN101973146B CN2010102791521A CN201010279152A CN101973146B CN 101973146 B CN101973146 B CN 101973146B CN 2010102791521 A CN2010102791521 A CN 2010102791521A CN 201010279152 A CN201010279152 A CN 201010279152A CN 101973146 B CN101973146 B CN 101973146B
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China
Prior art keywords
carrier
insulating resin
resin layer
face fabric
weaving face
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Expired - Fee Related
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CN2010102791521A
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Chinese (zh)
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CN101973146A (zh
Inventor
汤浅圆
八月朔日猛
新井政贵
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Textile Engineering (AREA)
  • Composite Materials (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN2010102791521A 2005-09-30 2006-09-27 带有载体的预浸料及其制造工艺、薄双面板及其制造工艺和多层印刷电路板的制造工艺 Expired - Fee Related CN101973146B (zh)

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Application Number Priority Date Filing Date Title
JP2005288716 2005-09-30
JP2005-288716 2005-09-30
JP2006035408 2006-02-13
JP2006-035408 2006-02-13

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CN2006800257103A Division CN101223015B (zh) 2005-09-30 2006-09-27 带有载体的预浸料及其制造工艺、薄双面板及其制造工艺和多层印刷电路板的制造工艺

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CN101973146A CN101973146A (zh) 2011-02-16
CN101973146B true CN101973146B (zh) 2012-09-26

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CN2010102791521A Expired - Fee Related CN101973146B (zh) 2005-09-30 2006-09-27 带有载体的预浸料及其制造工艺、薄双面板及其制造工艺和多层印刷电路板的制造工艺
CN2006800257103A Expired - Fee Related CN101223015B (zh) 2005-09-30 2006-09-27 带有载体的预浸料及其制造工艺、薄双面板及其制造工艺和多层印刷电路板的制造工艺

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US20110120630A1 (en) 2011-05-26
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KR20080009157A (ko) 2008-01-24
JPWO2007040125A1 (ja) 2009-04-16
CN101223015A (zh) 2008-07-16
US20090126974A1 (en) 2009-05-21
TWI376396B (en) 2012-11-11
CN101223015B (zh) 2010-11-24
JP2011132535A (ja) 2011-07-07
CN101973146A (zh) 2011-02-16
MY148019A (en) 2013-02-28
JP4957552B2 (ja) 2012-06-20
KR20090101968A (ko) 2009-09-29
KR101014517B1 (ko) 2011-02-14
TW200724583A (en) 2007-07-01

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