CN101916766B - 成像装置模块和采用该成像装置模块的便携式电子设备 - Google Patents

成像装置模块和采用该成像装置模块的便携式电子设备 Download PDF

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Publication number
CN101916766B
CN101916766B CN2010102424240A CN201010242424A CN101916766B CN 101916766 B CN101916766 B CN 101916766B CN 2010102424240 A CN2010102424240 A CN 2010102424240A CN 201010242424 A CN201010242424 A CN 201010242424A CN 101916766 B CN101916766 B CN 101916766B
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imaging device
radiation
heat
radiation component
circuit board
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CN2010102424240A
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CN101916766A (zh
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山宫国雄
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Olympus Corp
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Olympus Imaging Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

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  • Camera Bodies And Camera Details Or Accessories (AREA)
CN2010102424240A 2007-02-08 2008-02-05 成像装置模块和采用该成像装置模块的便携式电子设备 Expired - Fee Related CN101916766B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007029337 2007-02-08
JP2007-029337 2007-10-25
JP2007321138A JP5060935B2 (ja) 2007-02-08 2007-12-12 撮像素子モジュール及びそれを用いた携帯用電子機器
JP2007-321138 2007-12-12

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CN200810008690XA Division CN101241924B (zh) 2007-02-08 2008-02-05 成像装置模块和采用该成像装置模块的便携式电子设备

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CN101916766A CN101916766A (zh) 2010-12-15
CN101916766B true CN101916766B (zh) 2013-04-10

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CN200810008690XA Expired - Fee Related CN101241924B (zh) 2007-02-08 2008-02-05 成像装置模块和采用该成像装置模块的便携式电子设备

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CN (2) CN101916766B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5365470B2 (ja) * 2008-11-26 2013-12-11 株式会社リコー カメラボディ、撮像ユニット、撮像システム、その撮像ユニットのカメラボディに対する着脱方法、その撮像ユニットのカメラボディに対する装着方法、その撮像ユニットのカメラボディに対する抜き取り方法
JP2010243634A (ja) * 2009-04-02 2010-10-28 Sony Corp 撮像装置
CN102129110B (zh) * 2010-01-20 2014-05-14 智宝科技股份有限公司 光学变焦系统
JP5574776B2 (ja) * 2010-03-26 2014-08-20 キヤノン株式会社 レンズ鏡筒および撮像装置
JP5820607B2 (ja) * 2011-04-25 2015-11-24 株式会社シグマ 撮像装置及び撮像システム
JP6193753B2 (ja) * 2013-06-27 2017-09-06 京セラ株式会社 撮像素子搭載用基板及び撮像装置
CN207799306U (zh) * 2016-10-20 2018-08-31 台湾东电化股份有限公司 光学系统
CN109427264A (zh) * 2017-08-30 2019-03-05 深圳市奥拓电子股份有限公司 一种光控板及led显示屏
CN110896435B (zh) * 2018-09-13 2021-07-20 三赢科技（深圳）有限公司 相机模组
JP6756357B2 (ja) * 2018-11-29 2020-09-16 株式会社ニコン 撮像装置
KR102918505B1 (ko) * 2020-08-21 2026-01-28 엘지이노텍 주식회사 카메라 모듈
CN114740674B (zh) * 2022-02-28 2023-12-08 广东安达智能装备股份有限公司 一种微型工业ccd模组及其组装方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1501696A (zh) * 2002-09-27 2004-06-02 ������������ʽ���� 摄像装置以及便携式终端设备
US6956272B2 (en) * 2004-03-10 2005-10-18 Micron Technology, Inc. Support frame for semiconductor packages

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2665441B2 (ja) * 1993-05-21 1997-10-22 オリンパス光学工業株式会社 内視鏡
JPH08107526A (ja) * 1994-10-05 1996-04-23 Olympus Optical Co Ltd 電子的撮像装置
JP3875505B2 (ja) * 2001-03-29 2007-01-31 オリンパス株式会社 撮像装置
JP2006174226A (ja) * 2004-12-17 2006-06-29 Konica Minolta Photo Imaging Inc 撮像ユニット及び撮像装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1501696A (zh) * 2002-09-27 2004-06-02 ������������ʽ���� 摄像装置以及便携式终端设备
US6956272B2 (en) * 2004-03-10 2005-10-18 Micron Technology, Inc. Support frame for semiconductor packages

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Publication number Publication date
JP5060935B2 (ja) 2012-10-31
CN101241924A (zh) 2008-08-13
CN101241924B (zh) 2010-09-22
JP2008219861A (ja) 2008-09-18
CN101916766A (zh) 2010-12-15

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CF01 Termination of patent right due to non-payment of annual fee