CN101859851A - 晶片的加工方法 - Google Patents

晶片的加工方法 Download PDF

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Publication number
CN101859851A
CN101859851A CN201010104679A CN201010104679A CN101859851A CN 101859851 A CN101859851 A CN 101859851A CN 201010104679 A CN201010104679 A CN 201010104679A CN 201010104679 A CN201010104679 A CN 201010104679A CN 101859851 A CN101859851 A CN 101859851A
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CN
China
Prior art keywords
wafer
mentioned
rigid plate
confining force
slot segmentation
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Pending
Application number
CN201010104679A
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English (en)
Chinese (zh)
Inventor
足立卓也
梅田桂男
田篠文照
池端久贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
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Disco Corp
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Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN101859851A publication Critical patent/CN101859851A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201010104679A 2009-02-09 2010-01-28 晶片的加工方法 Pending CN101859851A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-027527 2009-02-09
JP2009027527A JP2010183014A (ja) 2009-02-09 2009-02-09 ウエーハの加工方法

Publications (1)

Publication Number Publication Date
CN101859851A true CN101859851A (zh) 2010-10-13

Family

ID=42756446

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010104679A Pending CN101859851A (zh) 2009-02-09 2010-01-28 晶片的加工方法

Country Status (4)

Country Link
JP (1) JP2010183014A (ja)
KR (1) KR20100091105A (ja)
CN (1) CN101859851A (ja)
TW (1) TW201030833A (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102848305A (zh) * 2011-06-30 2013-01-02 株式会社迪思科 被加工物的磨削方法
CN104701156A (zh) * 2013-12-05 2015-06-10 德州仪器公司 用于在裸片分离过程期间减小背面裸片损坏的方法
CN106469681A (zh) * 2015-08-21 2017-03-01 株式会社迪思科 晶片的加工方法
CN109148348A (zh) * 2017-06-16 2019-01-04 株式会社迪思科 晶片的加工方法
CN109848577A (zh) * 2017-11-30 2019-06-07 株式会社迪思科 晶片的激光加工方法
CN110517987A (zh) * 2018-05-21 2019-11-29 株式会社迪思科 晶片的加工方法
CN115990802A (zh) * 2023-03-22 2023-04-21 之江实验室 载具和抛光设备

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013230478A (ja) * 2012-04-27 2013-11-14 Disco Corp レーザー加工装置及びレーザー加工方法
KR102070091B1 (ko) 2013-02-20 2020-01-29 삼성전자주식회사 기판 연마 방법 및 이를 이용한 반도체 발광소자 제조방법
JP2017100255A (ja) * 2015-12-03 2017-06-08 株式会社ディスコ ウエーハの加工方法
JP6194394B2 (ja) * 2016-07-28 2017-09-06 東京応化工業株式会社 半導体装置の製造方法
JP2023183035A (ja) 2022-06-15 2023-12-27 株式会社ディスコ ウエーハの取り扱い方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602007007330D1 (de) * 2006-06-19 2010-08-05 Denki Kagaku Kogyo Kk Harzzusammensetzung und verfahren zur temporären fixierung und oberflächenschutzverfahren für ein teil, das mit der harzzusammensetzung verarbeitet wird
JP5275553B2 (ja) * 2006-06-27 2013-08-28 スリーエム イノベイティブ プロパティズ カンパニー 分割チップの製造方法
JP2009027057A (ja) * 2007-07-23 2009-02-05 Renesas Technology Corp 半導体装置の製造方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102848305A (zh) * 2011-06-30 2013-01-02 株式会社迪思科 被加工物的磨削方法
CN102848305B (zh) * 2011-06-30 2016-04-27 株式会社迪思科 被加工物的磨削方法
CN104701156A (zh) * 2013-12-05 2015-06-10 德州仪器公司 用于在裸片分离过程期间减小背面裸片损坏的方法
CN104701156B (zh) * 2013-12-05 2019-03-19 德州仪器公司 用于在裸片分离过程期间减小背面裸片损坏的方法
CN106469681A (zh) * 2015-08-21 2017-03-01 株式会社迪思科 晶片的加工方法
CN106469681B (zh) * 2015-08-21 2022-05-17 株式会社迪思科 晶片的加工方法
CN109148348A (zh) * 2017-06-16 2019-01-04 株式会社迪思科 晶片的加工方法
CN109148348B (zh) * 2017-06-16 2024-02-02 株式会社迪思科 晶片的加工方法
CN109848577A (zh) * 2017-11-30 2019-06-07 株式会社迪思科 晶片的激光加工方法
CN110517987A (zh) * 2018-05-21 2019-11-29 株式会社迪思科 晶片的加工方法
CN110517987B (zh) * 2018-05-21 2024-03-15 株式会社迪思科 晶片的加工方法
CN115990802A (zh) * 2023-03-22 2023-04-21 之江实验室 载具和抛光设备

Also Published As

Publication number Publication date
KR20100091105A (ko) 2010-08-18
JP2010183014A (ja) 2010-08-19
TW201030833A (en) 2010-08-16

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Application publication date: 20101013