CN101842918B - 使用可变激光束的玻璃料密封 - Google Patents

使用可变激光束的玻璃料密封 Download PDF

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Publication number
CN101842918B
CN101842918B CN2008801146060A CN200880114606A CN101842918B CN 101842918 B CN101842918 B CN 101842918B CN 2008801146060 A CN2008801146060 A CN 2008801146060A CN 200880114606 A CN200880114606 A CN 200880114606A CN 101842918 B CN101842918 B CN 101842918B
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CN
China
Prior art keywords
laser beam
frit
laser
lens
frit pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008801146060A
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English (en)
Chinese (zh)
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CN101842918A (zh
Inventor
A·刘
L·张
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
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Filing date
Publication date
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Publication of CN101842918A publication Critical patent/CN101842918A/zh
Application granted granted Critical
Publication of CN101842918B publication Critical patent/CN101842918B/zh
Expired - Fee Related legal-status Critical Current
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/206—Laser sealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B23K26/324—Bonding taking account of the properties of the material involved involving non-metallic parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
CN2008801146060A 2007-09-28 2008-09-25 使用可变激光束的玻璃料密封 Expired - Fee Related CN101842918B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/904,696 US8247730B2 (en) 2007-09-28 2007-09-28 Method and apparatus for frit sealing with a variable laser beam
US11/904,696 2007-09-28
PCT/US2008/011140 WO2009045320A2 (en) 2007-09-28 2008-09-25 Frit sealing with a variable laser beam

Publications (2)

Publication Number Publication Date
CN101842918A CN101842918A (zh) 2010-09-22
CN101842918B true CN101842918B (zh) 2012-07-04

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008801146060A Expired - Fee Related CN101842918B (zh) 2007-09-28 2008-09-25 使用可变激光束的玻璃料密封

Country Status (7)

Country Link
US (1) US8247730B2 (enExample)
EP (1) EP2203946B1 (enExample)
JP (1) JP5323843B2 (enExample)
KR (1) KR101359060B1 (enExample)
CN (1) CN101842918B (enExample)
TW (1) TWI377863B (enExample)
WO (1) WO2009045320A2 (enExample)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5308718B2 (ja) 2008-05-26 2013-10-09 浜松ホトニクス株式会社 ガラス溶着方法
US10322469B2 (en) * 2008-06-11 2019-06-18 Hamamatsu Photonics K.K. Fusion bonding process for glass
US9045365B2 (en) * 2008-06-23 2015-06-02 Hamamatsu Photonics K.K. Fusion-bonding process for glass
US8198564B2 (en) * 2008-09-09 2012-06-12 Electro Scientific Industries, Inc. Adaptive optic beamshaping in laser processing systems
US8440479B2 (en) * 2009-05-28 2013-05-14 Corning Incorporated Method for forming an organic light emitting diode device
US8568184B2 (en) * 2009-07-15 2013-10-29 Apple Inc. Display modules
JP5481167B2 (ja) 2009-11-12 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法
JP5535588B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5466929B2 (ja) 2009-11-25 2014-04-09 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5567319B2 (ja) * 2009-11-25 2014-08-06 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535590B2 (ja) * 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5525246B2 (ja) 2009-11-25 2014-06-18 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5481172B2 (ja) 2009-11-25 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535589B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5481173B2 (ja) 2009-11-25 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
WO2011067700A1 (en) * 2009-12-02 2011-06-09 Koninklijke Philips Electronics N.V. Substrate connection by heat activated binder
KR101243920B1 (ko) * 2010-01-07 2013-03-14 삼성디스플레이 주식회사 기판 밀봉에 사용되는 레이저 빔 조사 장치, 기판 밀봉 방법, 및 유기 발광 디스플레이 장치의 제조 방법
KR101097327B1 (ko) * 2010-01-07 2011-12-23 삼성모바일디스플레이주식회사 기판 밀봉에 사용되는 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101097328B1 (ko) * 2010-01-07 2011-12-23 삼성모바일디스플레이주식회사 기판 밀봉에 사용되는 레이저 빔 조사 장치, 기판 밀봉 방법, 및 유기 발광 디스플레이 장치의 제조 방법
KR101117732B1 (ko) * 2010-01-19 2012-02-24 삼성모바일디스플레이주식회사 기판 밀봉에 사용되는 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101097340B1 (ko) * 2010-03-08 2011-12-23 삼성모바일디스플레이주식회사 표시 장치
KR101137394B1 (ko) 2010-07-05 2012-04-20 삼성모바일디스플레이주식회사 레이저 빔 조사 장치 및 상기 레이저 빔 조사 장치를 포함하는 기판 밀봉 장치
EP2478990B1 (de) 2011-01-21 2019-04-17 Leister Technologies AG Verfahren zum Einstellen eines Laserlichtspots zur Laserbearbeitung von Werkstücken sowie Laseranordnung zur Durchführung des Verfahrens
TWI654762B (zh) 2011-05-05 2019-03-21 日商半導體能源研究所股份有限公司 半導體裝置及其製造方法
EP2707699B1 (en) * 2011-05-12 2021-07-07 Xy, Llc Uv diode laser excitation in flow cytometry
JP5724684B2 (ja) * 2011-07-01 2015-05-27 日本電気硝子株式会社 発光デバイス用セル及び発光デバイス
US9472776B2 (en) * 2011-10-14 2016-10-18 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing sealed structure including welded glass frits
JP2013101923A (ja) * 2011-10-21 2013-05-23 Semiconductor Energy Lab Co Ltd 分散組成物の加熱方法、及びガラスパターンの形成方法
TWI570906B (zh) * 2011-11-29 2017-02-11 半導體能源研究所股份有限公司 密封結構，發光裝置，電子裝置，及照明裝置
JP2013125718A (ja) * 2011-12-16 2013-06-24 Sharp Corp 表示装置及びその製造方法
KR101316617B1 (ko) 2012-02-21 2013-10-15 주식회사 엘티에스 레이저를 이용한 프릿 실링장치
KR20130118491A (ko) 2012-04-20 2013-10-30 삼성디스플레이 주식회사 레이저 실링 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
US9238577B2 (en) * 2012-09-21 2016-01-19 The University Of North Carolina At Charlotte Dynamic laser beam shaping methods and systems
KR101398020B1 (ko) * 2012-11-30 2014-05-30 주식회사 엘티에스 레이저를 이용한 프릿 실링장치
KR102034252B1 (ko) 2012-12-21 2019-10-21 삼성디스플레이 주식회사 레이저 빔 조사 장치 및 기판 밀봉 방법
KR102049445B1 (ko) 2013-05-31 2019-11-28 삼성디스플레이 주식회사 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
JP2015020914A (ja) * 2013-07-16 2015-02-02 日本電気硝子株式会社 ガラスパッケージの製造方法
CN103464900B (zh) * 2013-08-09 2015-12-23 上海大学 激光密封方法和系统
KR102117608B1 (ko) 2013-08-14 2020-06-02 삼성디스플레이 주식회사 밀봉 장치, 밀봉 장치를 포함하는 기판 밀봉 장치 및 기판 밀봉 방법
TWI561904B (en) * 2014-01-17 2016-12-11 Au Optronics Corp Substrate packaging structure and packaging method thereof
CN104795511A (zh) * 2014-01-20 2015-07-22 上海微电子装备有限公司 一种激光封装设备及其封装方法
CN105336877B (zh) * 2014-07-29 2018-01-26 上海微电子装备（集团）股份有限公司 激光扫描密封玻璃封装体的系统和方法
CN104362262B (zh) * 2014-10-23 2017-03-15 京东方科技集团股份有限公司 封装系统和封装方法
CN106159112B (zh) * 2015-03-26 2017-12-29 上海微电子装备（集团）股份有限公司 一种激光封装设备
CN106607645A (zh) * 2015-10-21 2017-05-03 上海微电子装备有限公司 一种激光封装系统及激光封装过程中温度控制的方法
KR102541451B1 (ko) * 2016-01-08 2023-06-09 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
JP6644563B2 (ja) * 2016-01-28 2020-02-12 浜松ホトニクス株式会社 レーザ光照射装置
CN107665826B (zh) * 2016-07-29 2019-11-26 上海微电子装备（集团）股份有限公司 激光封装方法及激光封装装置
CN107775187A (zh) * 2016-08-31 2018-03-09 上海微电子装备（集团）股份有限公司 一种激光封装装置和方法
CN106425088B (zh) * 2016-10-25 2019-09-17 昆山国显光电有限公司 激光密封玻璃料的方法及激光密封系统
AU2019203404B2 (en) 2018-05-15 2024-11-07 Howmedica Osteonics Corp. Fabrication of components using shaped energy beam profiles
KR102580292B1 (ko) * 2018-05-29 2023-09-19 삼성디스플레이 주식회사 표시 장치, 그 제조 방법 및 표시 장치 제조를 위한 레이저 가공 장치
CN111400989B (zh) * 2018-12-29 2022-06-17 上海微电子装备（集团）股份有限公司 激光封装路径获取方法、激光封装方法以及激光封装系统
CN112018269B (zh) * 2019-05-31 2021-11-12 上海微电子装备（集团）股份有限公司 激光封装方法
CN115283827A (zh) * 2022-07-29 2022-11-04 无锡先导智能装备股份有限公司 一种激光封装装置、系统及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1816236A (zh) * 2004-12-03 2006-08-09 三星Sdi株式会社 激光照射装置、构图方法及有机发光显示器的制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4521087A (en) * 1983-05-23 1985-06-04 International Business Machines Corporation Optical system with diffuser for transformation of a collimated beam into a self-luminous arc with required curvature and numerical aperture
US5704700A (en) * 1994-07-25 1998-01-06 Proxima Corporation Laser illuminated image projection system and method of using same
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US20040206953A1 (en) * 2003-04-16 2004-10-21 Robert Morena Hermetically sealed glass package and method of fabrication
US7371143B2 (en) * 2004-10-20 2008-05-13 Corning Incorporated Optimization of parameters for sealing organic emitting light diode (OLED) displays
US7250618B2 (en) * 2005-02-02 2007-07-31 Nikon Corporation Radiantly heated cathode for an electron gun and heating assembly
TWI327757B (en) * 2005-12-06 2010-07-21 Corning Inc System and method for frit sealing glass packages
JP5127465B2 (ja) * 2005-12-06 2013-01-23 コーニング インコーポレイテッド 密封ガラスパッケージおよびその製造方法
US7537504B2 (en) * 2005-12-06 2009-05-26 Corning Incorporated Method of encapsulating a display element with frit wall and laser beam
KR100671638B1 (ko) 2006-01-26 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1816236A (zh) * 2004-12-03 2006-08-09 三星Sdi株式会社 激光照射装置、构图方法及有机发光显示器的制备方法

Also Published As

Publication number Publication date
KR20100072315A (ko) 2010-06-30
US20090086325A1 (en) 2009-04-02
TWI377863B (en) 2012-11-21
EP2203946A2 (en) 2010-07-07
WO2009045320A2 (en) 2009-04-09
WO2009045320A3 (en) 2009-05-22
CN101842918A (zh) 2010-09-22
JP2010541162A (ja) 2010-12-24
TW200948174A (en) 2009-11-16
JP5323843B2 (ja) 2013-10-23
EP2203946B1 (en) 2018-07-11
KR101359060B1 (ko) 2014-02-05
US8247730B2 (en) 2012-08-21

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