KR101359060B1 - 가변 레이저 빔에 의한 프릿 밀봉 - Google Patents

가변 레이저 빔에 의한 프릿 밀봉 Download PDF

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Publication number
KR101359060B1
KR101359060B1 KR1020107009281A KR20107009281A KR101359060B1 KR 101359060 B1 KR101359060 B1 KR 101359060B1 KR 1020107009281 A KR1020107009281 A KR 1020107009281A KR 20107009281 A KR20107009281 A KR 20107009281A KR 101359060 B1 KR101359060 B1 KR 101359060B1
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KR
South Korea
Prior art keywords
laser beam
beam spot
power
frit
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020107009281A
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English (en)
Korean (ko)
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KR20100072315A (ko
Inventor
안핑 리우
루 장
Original Assignee
코닝 인코포레이티드
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Publication of KR20100072315A publication Critical patent/KR20100072315A/ko
Application granted granted Critical
Publication of KR101359060B1 publication Critical patent/KR101359060B1/ko
Expired - Fee Related legal-status Critical Current
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/206—Laser sealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B23K26/324—Bonding taking account of the properties of the material involved involving non-metallic parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020107009281A 2007-09-28 2008-09-25 가변 레이저 빔에 의한 프릿 밀봉 Expired - Fee Related KR101359060B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/904,696 2007-09-28
US11/904,696 US8247730B2 (en) 2007-09-28 2007-09-28 Method and apparatus for frit sealing with a variable laser beam
PCT/US2008/011140 WO2009045320A2 (en) 2007-09-28 2008-09-25 Frit sealing with a variable laser beam

Publications (2)

Publication Number Publication Date
KR20100072315A KR20100072315A (ko) 2010-06-30
KR101359060B1 true KR101359060B1 (ko) 2014-02-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107009281A Expired - Fee Related KR101359060B1 (ko) 2007-09-28 2008-09-25 가변 레이저 빔에 의한 프릿 밀봉

Country Status (7)

Country Link
US (1) US8247730B2 (enExample)
EP (1) EP2203946B1 (enExample)
JP (1) JP5323843B2 (enExample)
KR (1) KR101359060B1 (enExample)
CN (1) CN101842918B (enExample)
TW (1) TWI377863B (enExample)
WO (1) WO2009045320A2 (enExample)

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JP5481167B2 (ja) 2009-11-12 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法
JP5535589B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5466929B2 (ja) * 2009-11-25 2014-04-09 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535588B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5481173B2 (ja) 2009-11-25 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5525246B2 (ja) 2009-11-25 2014-06-18 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5481172B2 (ja) 2009-11-25 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535590B2 (ja) * 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5567319B2 (ja) * 2009-11-25 2014-08-06 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
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KR101097328B1 (ko) * 2010-01-07 2011-12-23 삼성모바일디스플레이주식회사 기판 밀봉에 사용되는 레이저 빔 조사 장치, 기판 밀봉 방법, 및 유기 발광 디스플레이 장치의 제조 방법
KR101097327B1 (ko) * 2010-01-07 2011-12-23 삼성모바일디스플레이주식회사 기판 밀봉에 사용되는 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101117732B1 (ko) * 2010-01-19 2012-02-24 삼성모바일디스플레이주식회사 기판 밀봉에 사용되는 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101097340B1 (ko) * 2010-03-08 2011-12-23 삼성모바일디스플레이주식회사 표시 장치
KR101137394B1 (ko) 2010-07-05 2012-04-20 삼성모바일디스플레이주식회사 레이저 빔 조사 장치 및 상기 레이저 빔 조사 장치를 포함하는 기판 밀봉 장치
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TWI654762B (zh) 2011-05-05 2019-03-21 日商半導體能源研究所股份有限公司 半導體裝置及其製造方法
WO2012155106A2 (en) * 2011-05-12 2012-11-15 Xy, Llc Uv diode laser excitation in flow cytometry
JP5724684B2 (ja) * 2011-07-01 2015-05-27 日本電気硝子株式会社 発光デバイス用セル及び発光デバイス
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JP2013101923A (ja) * 2011-10-21 2013-05-23 Semiconductor Energy Lab Co Ltd 分散組成物の加熱方法、及びガラスパターンの形成方法
TW201707202A (zh) 2011-11-29 2017-02-16 半導體能源研究所股份有限公司 密封結構，發光裝置，電子裝置，及照明裝置
JP2013125718A (ja) * 2011-12-16 2013-06-24 Sharp Corp 表示装置及びその製造方法
KR101316617B1 (ko) 2012-02-21 2013-10-15 주식회사 엘티에스 레이저를 이용한 프릿 실링장치
KR20130118491A (ko) 2012-04-20 2013-10-30 삼성디스플레이 주식회사 레이저 실링 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
US9238577B2 (en) * 2012-09-21 2016-01-19 The University Of North Carolina At Charlotte Dynamic laser beam shaping methods and systems
KR101398020B1 (ko) * 2012-11-30 2014-05-30 주식회사 엘티에스 레이저를 이용한 프릿 실링장치
KR102034252B1 (ko) 2012-12-21 2019-10-21 삼성디스플레이 주식회사 레이저 빔 조사 장치 및 기판 밀봉 방법
KR102049445B1 (ko) 2013-05-31 2019-11-28 삼성디스플레이 주식회사 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
JP2015020914A (ja) * 2013-07-16 2015-02-02 日本電気硝子株式会社 ガラスパッケージの製造方法
CN103464900B (zh) * 2013-08-09 2015-12-23 上海大学 激光密封方法和系统
KR102117608B1 (ko) 2013-08-14 2020-06-02 삼성디스플레이 주식회사 밀봉 장치, 밀봉 장치를 포함하는 기판 밀봉 장치 및 기판 밀봉 방법
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CN104795511A (zh) * 2014-01-20 2015-07-22 上海微电子装备有限公司 一种激光封装设备及其封装方法
CN105336877B (zh) * 2014-07-29 2018-01-26 上海微电子装备（集团）股份有限公司 激光扫描密封玻璃封装体的系统和方法
CN104362262B (zh) * 2014-10-23 2017-03-15 京东方科技集团股份有限公司 封装系统和封装方法
CN106159112B (zh) * 2015-03-26 2017-12-29 上海微电子装备（集团）股份有限公司 一种激光封装设备
CN106607645A (zh) * 2015-10-21 2017-05-03 上海微电子装备有限公司 一种激光封装系统及激光封装过程中温度控制的方法
KR102541451B1 (ko) * 2016-01-08 2023-06-09 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
JP6644563B2 (ja) * 2016-01-28 2020-02-12 浜松ホトニクス株式会社 レーザ光照射装置
CN107665826B (zh) * 2016-07-29 2019-11-26 上海微电子装备（集团）股份有限公司 激光封装方法及激光封装装置
CN107775187A (zh) * 2016-08-31 2018-03-09 上海微电子装备（集团）股份有限公司 一种激光封装装置和方法
CN106425088B (zh) * 2016-10-25 2019-09-17 昆山国显光电有限公司 激光密封玻璃料的方法及激光密封系统
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KR102580292B1 (ko) * 2018-05-29 2023-09-19 삼성디스플레이 주식회사 표시 장치, 그 제조 방법 및 표시 장치 제조를 위한 레이저 가공 장치
CN111400989B (zh) * 2018-12-29 2022-06-17 上海微电子装备（集团）股份有限公司 激光封装路径获取方法、激光封装方法以及激光封装系统
CN112018269B (zh) * 2019-05-31 2021-11-12 上海微电子装备（集团）股份有限公司 激光封装方法
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Publication number Publication date
EP2203946B1 (en) 2018-07-11
WO2009045320A2 (en) 2009-04-09
JP5323843B2 (ja) 2013-10-23
TWI377863B (en) 2012-11-21
CN101842918B (zh) 2012-07-04
WO2009045320A3 (en) 2009-05-22
CN101842918A (zh) 2010-09-22
TW200948174A (en) 2009-11-16
JP2010541162A (ja) 2010-12-24
US20090086325A1 (en) 2009-04-02
KR20100072315A (ko) 2010-06-30
US8247730B2 (en) 2012-08-21
EP2203946A2 (en) 2010-07-07

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