CN103464900B - 激光密封方法和系统 - Google Patents
激光密封方法和系统 Download PDFInfo
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- CN103464900B CN103464900B CN201310360443.7A CN201310360443A CN103464900B CN 103464900 B CN103464900 B CN 103464900B CN 201310360443 A CN201310360443 A CN 201310360443A CN 103464900 B CN103464900 B CN 103464900B
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- 238000007789 sealing Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 74
- 230000008878 coupling Effects 0.000 claims abstract description 35
- 238000010168 coupling process Methods 0.000 claims abstract description 35
- 238000005859 coupling reaction Methods 0.000 claims abstract description 35
- 238000005538 encapsulation Methods 0.000 claims abstract description 27
- 230000013011 mating Effects 0.000 claims abstract description 27
- 239000004973 liquid crystal related substance Substances 0.000 claims description 4
- 230000001360 synchronised effect Effects 0.000 abstract description 15
- 238000010438 heat treatment Methods 0.000 abstract description 9
- 238000004806 packaging method and process Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000087 laser glass Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
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CN201310360443.7A CN103464900B (zh) | 2013-08-09 | 2013-08-16 | 激光密封方法和系统 |
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CN201310347990.1 | 2013-08-09 | ||
CN201310347990 | 2013-08-09 | ||
CN201310360443.7A CN103464900B (zh) | 2013-08-09 | 2013-08-16 | 激光密封方法和系统 |
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CN103464900A CN103464900A (zh) | 2013-12-25 |
CN103464900B true CN103464900B (zh) | 2015-12-23 |
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CN201310360443.7A Expired - Fee Related CN103464900B (zh) | 2013-08-09 | 2013-08-16 | 激光密封方法和系统 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104761132B (zh) * | 2014-01-02 | 2017-05-31 | 上海微电子装备有限公司 | 一种双光束耦合的激光辅助玻璃料封装系统和方法 |
CN104795511A (zh) * | 2014-01-20 | 2015-07-22 | 上海微电子装备有限公司 | 一种激光封装设备及其封装方法 |
CN105023880A (zh) * | 2014-04-15 | 2015-11-04 | 上海微电子装备有限公司 | 玻璃封装体的密封装置 |
CN105895828A (zh) * | 2014-05-12 | 2016-08-24 | 上海微电子装备有限公司 | 步进式激光封装温度及功率探测与控制装置及方法 |
CN106425088B (zh) * | 2016-10-25 | 2019-09-17 | 昆山国显光电有限公司 | 激光密封玻璃料的方法及激光密封系统 |
CN106584868A (zh) * | 2016-12-13 | 2017-04-26 | 大族激光科技产业集团股份有限公司 | 激光同步掩膜焊接封装柔性oled屏的方法与装置 |
Citations (8)
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KR0174687B1 (ko) * | 1996-09-12 | 1999-04-01 | 삼성전자주식회사 | 화상형성장치에서 레이져 스케닝 유니트의 소음 방지장치 |
CN101536133A (zh) * | 2005-12-06 | 2009-09-16 | 康宁股份有限公司 | 制造玻璃包封的方法 |
CN101842918A (zh) * | 2007-09-28 | 2010-09-22 | 康宁股份有限公司 | 使用可变激光束的玻璃料密封 |
CN102089898A (zh) * | 2008-06-11 | 2011-06-08 | 康宁股份有限公司 | 用来密封玻璃封套的掩模和方法 |
JP4907002B2 (ja) * | 2000-12-05 | 2012-03-28 | 三菱電機株式会社 | 気密封止型半導体装置の製造方法 |
TW201228463A (en) * | 2010-12-30 | 2012-07-01 | Au Optronics Corp | Sealing device and sealing process use the same |
CN103137824A (zh) * | 2011-11-29 | 2013-06-05 | 昆山开威电子有限公司 | 一种白光led器件及其无金线封装方法 |
CN103189947A (zh) * | 2010-09-03 | 2013-07-03 | 康宁股份有限公司 | 密封玻璃封装件的方法以及所得到的玻璃封装件 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09189531A (ja) * | 1996-01-09 | 1997-07-22 | Rohm Co Ltd | 半導体レーザのワイヤの検査方法 |
KR101023949B1 (ko) * | 2008-08-08 | 2011-03-28 | 주식회사 탑 엔지니어링 | 기판검사정보를 이용한 디스펜서의 페이스트 도포 방법 |
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Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0174687B1 (ko) * | 1996-09-12 | 1999-04-01 | 삼성전자주식회사 | 화상형성장치에서 레이져 스케닝 유니트의 소음 방지장치 |
JP4907002B2 (ja) * | 2000-12-05 | 2012-03-28 | 三菱電機株式会社 | 気密封止型半導体装置の製造方法 |
CN101536133A (zh) * | 2005-12-06 | 2009-09-16 | 康宁股份有限公司 | 制造玻璃包封的方法 |
CN101842918A (zh) * | 2007-09-28 | 2010-09-22 | 康宁股份有限公司 | 使用可变激光束的玻璃料密封 |
CN102089898A (zh) * | 2008-06-11 | 2011-06-08 | 康宁股份有限公司 | 用来密封玻璃封套的掩模和方法 |
CN103189947A (zh) * | 2010-09-03 | 2013-07-03 | 康宁股份有限公司 | 密封玻璃封装件的方法以及所得到的玻璃封装件 |
TW201228463A (en) * | 2010-12-30 | 2012-07-01 | Au Optronics Corp | Sealing device and sealing process use the same |
CN103137824A (zh) * | 2011-11-29 | 2013-06-05 | 昆山开威电子有限公司 | 一种白光led器件及其无金线封装方法 |
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CN103464900A (zh) | 2013-12-25 |
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Owner name: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD. Effective date: 20140619 |
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CB03 | Change of inventor or designer information |
Inventor after: Zhang Jianhua Inventor after: Ge Junfeng Inventor after: Fu Kui Inventor after: Luo Wen Inventor before: Zhang Jianhua Inventor before: Ge Junfeng Inventor before: Fu Kui |
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Free format text: CORRECT: INVENTOR; FROM: ZHANG JIANHUA GE JUNFENG FU KUI TO: ZHANG JIANHUA GE JUNFENG FU KUI LUO WEN |
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Effective date of registration: 20140619 Address after: 200072, Shanghai, Zhabei District extension Road, flat display center 149 (149 extension Road, Zhabei District, electrical building, Room 301) Applicant after: Shanghai University Applicant after: Shanghai Micro Electronics Equipment Co., Ltd. Address before: 200072, Shanghai Zhabei District Road extension 149 flat panel display center Applicant before: Shanghai University |
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