CN101836512A - 挠性印刷电路布线板、使用其的引入片、rfid媒介及其制造方法 - Google Patents

挠性印刷电路布线板、使用其的引入片、rfid媒介及其制造方法 Download PDF

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Publication number
CN101836512A
CN101836512A CN200880113333.8A CN200880113333A CN101836512A CN 101836512 A CN101836512 A CN 101836512A CN 200880113333 A CN200880113333 A CN 200880113333A CN 101836512 A CN101836512 A CN 101836512A
Authority
CN
China
Prior art keywords
film
adhesive layer
thermal adhesive
resin
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200880113333.8A
Other languages
English (en)
Chinese (zh)
Inventor
西睦夫
斋宫芳纪
佐佐木靖
横山诚一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Toyo Textile Co Ltd
Original Assignee
Toyo Textile Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007278471A external-priority patent/JP5157366B2/ja
Priority claimed from JP2007278470A external-priority patent/JP2009110987A/ja
Application filed by Toyo Textile Co Ltd filed Critical Toyo Textile Co Ltd
Publication of CN101836512A publication Critical patent/CN101836512A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/514—Oriented
    • B32B2307/518—Oriented bi-axially
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
CN200880113333.8A 2007-10-26 2008-10-27 挠性印刷电路布线板、使用其的引入片、rfid媒介及其制造方法 Pending CN101836512A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2007-278470 2007-10-26
JP2007278471A JP5157366B2 (ja) 2007-10-26 2007-10-26 Ｒｆｉｄメディアの製造方法
JP2007278470A JP2009110987A (ja) 2007-10-26 2007-10-26 フレキシブルプリント配線板、それを用いたインレットシート及びｒｆｉｄメディア
JP2007-278471 2007-10-26
PCT/JP2008/069415 WO2009054523A1 (fr) 2007-10-26 2008-10-27 Carte de circuit imprimé souple, feuille d'entrée l'utilisant, support rfid, et procédé de fabrication du support rfid

Publications (1)

Publication Number Publication Date
CN101836512A true CN101836512A (zh) 2010-09-15

Family

ID=40579624

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880113333.8A Pending CN101836512A (zh) 2007-10-26 2008-10-27 挠性印刷电路布线板、使用其的引入片、rfid媒介及其制造方法

Country Status (4)

Country Link
KR (1) KR20100082360A (fr)
CN (1) CN101836512A (fr)
TW (1) TW200932523A (fr)
WO (1) WO2009054523A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103538341A (zh) * 2012-07-17 2014-01-29 昆山雅森电子材料科技有限公司 热滚压合设备
CN105365304A (zh) * 2015-12-18 2016-03-02 无锡科睿坦电子科技有限公司 基于不透明pet薄膜的rfid标签天线及其制作工艺
CN108712818A (zh) * 2018-05-11 2018-10-26 张海根 下压式褶皱柔性pcb电子器件制备整机
WO2022057074A1 (fr) * 2020-09-18 2022-03-24 徐强 Procédé d'amincissement chimique et dispositif pour la production de matériau enroulé en verre souple à l'aide d'un procédé continu

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101022697B1 (ko) * 2010-09-06 2011-03-22 (주)유엘티 알에프아이디 태그 안테나 제조에 있어서의 회로형성을 위한 알루미늄박 에칭공정

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002155158A (ja) * 2000-11-21 2002-05-28 Teijin Ltd 光学用易接着性積層フィルム
JP2002270975A (ja) * 2001-03-07 2002-09-20 Toyo Kohan Co Ltd Ｉｃカード用基板、ｉｃカード用基板の製造方法、それらを用いたｉｃカード用コイル付き基板、およびそれらを用いたｉｃカード
JP2003078225A (ja) * 2001-09-06 2003-03-14 Taisei Laminator Co Ltd ラミネートフィルム
JP2005209171A (ja) * 2003-12-25 2005-08-04 Toyobo Co Ltd Ｉｃカードまたはｉｃタグの製造方法及びこれに用いる延伸プラスチックフィルム
JP2006155224A (ja) * 2004-11-29 2006-06-15 Mitsubishi Polyester Film Copp Ｒｆｉｄタグ用ポリエステルフィルム
JP3968667B2 (ja) * 2005-04-28 2007-08-29 東洋紡績株式会社 Ｉｃカードまたはｉｃタグ用熱接着性ポリエステルフィルム

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103538341A (zh) * 2012-07-17 2014-01-29 昆山雅森电子材料科技有限公司 热滚压合设备
CN103538341B (zh) * 2012-07-17 2015-11-25 昆山雅森电子材料科技有限公司 热滚压合设备
CN105365304A (zh) * 2015-12-18 2016-03-02 无锡科睿坦电子科技有限公司 基于不透明pet薄膜的rfid标签天线及其制作工艺
CN108712818A (zh) * 2018-05-11 2018-10-26 张海根 下压式褶皱柔性pcb电子器件制备整机
CN108712818B (zh) * 2018-05-11 2020-12-18 泗阳富朋特电子科技有限公司 下压式褶皱柔性pcb电子器件制备整机
WO2022057074A1 (fr) * 2020-09-18 2022-03-24 徐强 Procédé d'amincissement chimique et dispositif pour la production de matériau enroulé en verre souple à l'aide d'un procédé continu

Also Published As

Publication number Publication date
KR20100082360A (ko) 2010-07-16
WO2009054523A1 (fr) 2009-04-30
TW200932523A (en) 2009-08-01

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Application publication date: 20100915