CN101836512A

CN101836512A - Flexible printed circuit board, inlet sheet using the same, RFID media, and method for producing the rfid media

Info

Publication number: CN101836512A
Application number: CN200880113333.8A
Authority: CN
Inventors: 西睦夫; 斋宫芳纪; 佐佐木靖; 横山诚一郎
Original assignee: Toyo Textile Co Ltd
Current assignee: Toyobo Co Ltd; Toyo Textile Co Ltd
Priority date: 2007-10-26
Filing date: 2008-10-27
Publication date: 2010-09-15
Also published as: WO2009054523A1; TW200932523A; KR20100082360A

Abstract

Disclosed is an FPC suitable for use in RFID media. Also disclosed are RFID media improved in production speed, rejection rate, electrical quality and product appearance, and a method for producing such RFID media. Specifically disclosed is a flexible printed circuit board which is produced by etching a laminate that is composed of a biaxially stretched polyester film having a thermal adhesive layer and a base layer formed by co-extrusion and a metal foil bonded to a surface of the biaxially stretched polyester film through the thermal adhesive layer. This flexible printed circuit board is characterized in that the base layer of the biaxially stretched polyester film has a melting point of 200-300 DEG C, and the thermal adhesive layer is made of a polyester resin containing a wax.

Description

Flexible printed circuit board, the introducing sheet that uses it, RFID media and manufacture method thereof

Technical field

The present invention relates to flexible printed circuit board and use its introducing sheet (inlet sheet) and RFID media.In addition, the manufacture method that relates to the RFID media.

Background technology

In recent years, popularizing the card be built-in with the IC chip or based on management of information utilization system's (rfid system) of label.The RFID media of Shi Yonging is commonly called " IC-card " or " IC tag " in these, compare with the card of in the past printing, notes formula, magnetic recording formula, label etc., can write down, keep useful on a large amount of information this point, therefore, use in each field of the various information of management application people or article.

Plastic material as constituting the RFID media used polyvinyl chloride (PVC) to be main flow in the past.Yet, in recent years,, do not use the raw-material expectation of replacement of halogens to uprise from the viewpoint of environmental protection, main flow is instead of polyester based resin in the described raw material.As sheet that comprises polyester based resin or film, from having amorphism and near the aspect of the processing characteristics of PVC, the main use comprises 1, the nothing orientation sheet of the copolyester that the 4-cyclohexanedimethanol contains as copolymer composition (PETG), or, mainly use biaxial stretch-formed PETG (PET) film from the aspect of versatility.

Using these sheets or film, when making the RFID media, by in the surface configuration of sheet or film the one or both sides of introducing sheet of IC chip or antenna loop etc. dispose other sheets or film, clip hot-melt adhesive etc. betwixt, carry out punching press adhesion, make it melting adhered and obtain duplexer.But, in this manufacture method, exist in the unsolved some problems of aspect of performance of productivity ratio or goods.

Sixty-four dollar question is productivity ratio (speed of production).The operation that to be existing manufacture method make for mold pressing during tens of overlapping several Zhang Naizhi with IC-card, therefore, the problem that the quantity that exists time per unit to make is restricted.At this problem, by increase by one-step mould stacked quantity is set, or the specification that increases mold pressing realizes temporary transient improvement, but the productivity ratio that can improve thus is about several times to tens times of present situation at most, may be difficult to tackle from now on the burst of the RFID media of anticipation and popularize.

In addition, on productivity ratio,, also there is the problem of the generation rate be difficult to reduce significantly defective item in the equipment of so-called mold pressing, the pressure or the temperature that are difficult to apply homogeneous in nature of operation with mold pressing surface integral body.At this problem, wait by research in the design of circuit or stable on heating raising and to have realized temporary transient improvement, but may be difficult to tackle the miniaturization in the multifunction of anticipation from now on and loop or complicated.

In addition, one of problem in the performance of goods is in each RFID media, in the gain of antenna even can produce uneven problem on the communication distance.This is difficult to strictly control the thickness of bond layer because existing manufacture method is a method of utilizing the bonding agent hot moulding bonding, mold pressing batch in or batch between produce uneven.Antenna or coil that the RFID media of discerning in the noncontact mode has by portion within it, and the reading device of outside between carry out telecommunication and discern.The raw-material dielectric constant or the dielectric absorption that occupy near the extreme space of antenna or coil are the essential factors of decisive these electrical characteristics of domination, therefore, are producing the uneven decisive essential factor of generation on the uneven performance that becomes at goods on the thickness of adhesive linkage.

In the present invention, in order to make the RFID media that has improved described three problems (inequality of speed of production, disqualification rate, quality), as its parts, the flexible printed circuit board that proposition is fit to (below, also abbreviate FPC sometimes as) and introduce sheet, propose to use the RFID media and the manufacture method thereof of its formation.

Conventional art as relevant with FPC of the present invention discloses technology shown below.

(1) comprises that the surface comprises the base material of amorphous PETG and is in contact with it and the IC-card antenna coil construction body of the metal pattern that forms.(for example, with reference to patent documentation 1).

(2) comprise the base material that comprises ethylene chloride resin and being in contact with it and the IC-card antenna coil construction body of the metal pattern that forms.(for example, with reference to patent documentation 2).

(3) the IC-card substrate that forms at polyester resin film laminated metal paper tinsel.(for example, with reference to patent documentation 3).

(4) utilize on the surface of polyester resin film and extruded the thermal bonding polyester film of thermal adhesive layer jointly stacked.(for example, with reference to patent documentation 4,5).

(5) in the lamination sheets of the surperficial stacked resilient coating of polyester resin film and adhesive linkage, bury the manufacture method (for example, with reference to patent documentation 6,7) of the IC-card that the IC chip forms underground.

[patent documentation 1] spy opens the 2004-46362 communique

[patent documentation 2] spy opens the 2004-46360 communique

[patent documentation 3] spy opens the 2002-270975 communique

[patent documentation 4] spy opens the 2006-327190 communique

[patent documentation 5] spy opens the 2006-327191 communique

[patent documentation 6] spy opens the 2000-36024 communique

[patent documentation 7] spy opens flat 11-328340 communique

In these documents, disclose for the time being and do not use bonding agent, efficient is made the method for RFID media well.

Yet, in the invention described in patent documentation 1 and 3,, use the pet film of amorphous, or, make it decrystallized by Biaxially oriented polyester film is heated to melt temperature again as base material, bonding with metal forming.Therefore, the structure of these inventions, substrate become amorphous basically base material.If base material is noncrystalline, softening and be out of shape when then in the RFID media manufacturing process of back operation, having applied high temperature, therefore, be difficult to apply tension force, stacked continuously.In addition, the thermal endurance of the RFID media of making thus is also insufficient.

In addition, the invention of record utilizes PVC to constitute in patent documentation 2, and is not preferred from the environment adaptability.

In addition, in the invention of

patent documentation

4 and 5, disclose the RFID polyester base material of realizing thermal endurance and thermal bonding simultaneously, will be metal foil laminated and etching but inquire into, as the situation of antenna loop usefulness FPC.About these polyester base materials, for the time being can be on its surface with the metal forming heat lamination and etching forms the FPC loop.But usually, the surface of metal forming is compared with the substrate surface that comprises plastic resin, significantly level and smooth, therefore, these polyester base materials stacked under the situation of metal forming, sometimes the air of bonding plane extraction or smooth property are insufficient, and the reduction of bonding force or the generation of wrinkle take place.

In addition, in

patent documentation

6 and 7 described inventions, bury the IC chip underground, therefore, make resilient coating and adhesive linkage thicker than base material.The softening temperature of resilient coating, adhesive linkage is low, therefore, with patent documentation 1 and 3 in the same manner, in the RFID media manufacturing process and thermal endurance on not preferred.

That is, in the prior art, the unexposed bonding agent that do not use is made FPC in continuous stacked operation, use it, makes the base material that the RFID media is fit in series-operation.

As the manufacture method of the RFID media relevant, disclose the conventional art of the following stated with the present invention.

(6), load the manufacture method (for example, with reference to patent documentation 4) of the IC tag roller of IC at roller shape raw material printed wiring.

(7) used the manufacture method (for example, with reference to patent documentation 5) of IC-card of the IC-card material of roller shape

(8) between two bands, supply with plastic sheet, utilize warm-up mill heating after, with the manufacture method (for example, with reference to patent documentation 6) of fluid oil as IC-card bonding in the continuous mould pressing operation of pressing piezodielectric.

(9) utilize the manufacture method (for example, with reference to patent documentation 7) of the IC-card of the bonding laminate film up and down of stacked roller.

(10) on the surface of return circuit module via the bonding cover sheet of bonding agent, after low temperature, low depress roller are pressed, carry out the manufacture method (for example, with reference to patent documentation 8) of the IC-card of static pressure mold pressing with high temperature, high pressure.

(11) as bonding agent, use ultraviolet curing resin, pressurize the planarization bond layer by roller after, irradiation ultraviolet radiation is made the method (for example, with reference to patent documentation 9) of IC-card of the thickness homogeneous of bond layer.

(12) at the sheet coating response type bonding agent of roller shape, enclosed the IC chip after, sandwich the manufacture method (for example, with reference to patent documentation 10) of the IC-card that make bonding agent reaction, solidifies with sheet material.

(13) after IC-card basal disc surface is covered the low resin bed of softening temperature in advance, the manufacture method of the IC-card of plastic laminate film or bond layer (for example, with reference to patent documentation 11).

[patent documentation 8] spy opens the 2005-259091 communique

[patent documentation 9] spy opens the 2001-229361 communique

[patent documentation 10] spy opens flat 10-217658 communique

[patent documentation 11] spy opens flat 8-216574 communique

[patent documentation 12] spy opens the 2000-57295 communique

[patent documentation 13] spy opens flat 10-175388 communique

[patent documentation 14] spy opens the 2005-332384 communique

[patent documentation 15] spy opens flat 11-111743 communique

In these documents, disclose for the time being in continuous manufacturing process, make the method for RFID media, disclose the manufacture method of boosting productivity for the time being.

Yet, in the method for patent documentation 8, do not inquire into laminate film etc., make these method, in patent documentation 10 and 13,14 method, be to utilize mold pressing procedure manufacturing eventually, therefore, do not realize the raising of productivity ratio and alleviating of disqualification rate fully, in the method for patent documentation 9 and 11～15, be to use bonding agent eventually, therefore, be difficult to improve the uneven thickness of bond layer, propose the technology that the inequality of speed of production and disqualification rate, quality all can be improved.

Promptly, in the prior art, unexposed use is by extruding the netted Biaxially oriented polyester film that has been pre-formed bond layer jointly, by not having the stacked roller bonding process of mold pressing procedure, do not use bonding agent and make, thus the manufacture method of the RFID media that the inequality of speed of production and disqualification rate, quality all can be improved.In addition, record is not pointed out by utilizing to extrude jointly yet and is formed the thickness homogenization that bond layer makes bond layer, improve the RFID media dielectric property technology or by without the stacked bonding process of mold pressing procedure, improve the technology of disqualification rate, propose the technology that the inequality of the speed of production in the described manufacture method and disqualification rate, quality all can be improved.

Summary of the invention

The object of the present invention is to provide to be adapted at the FPC that uses in the RFID media, RFID media and the manufacture method thereof of having improved speed of production and defective item generation rate, electric quality, products appearance are provided.

The issue invention that can solve described problem comprises following structure.

[1] a kind of flexible printed circuit board, it is with by carrying out the flexible printed circuit board that etch processes is made by extruding the Biaxially oriented polyester film that formed thermal adhesive layer and substrate layer jointly and being adhered to the duplexer that the metal forming on this Biaxially oriented polyester film surface forms via thermal adhesive layer, it is characterized in that, the substrate layer of Biaxially oriented polyester film has fusing point at 200～300 ℃, and thermal adhesive layer is to be formed by the mylar that contains wax.

[2] according to [1] described flexible printed circuit board, it is characterized in that,

The substrate layer of Biaxially oriented polyester film is that the white polyester film of Chinese white and/or fine emptying aperture is contained in portion within it.

[3] according to [1] or [2] described flexible printed circuit board, it is characterized in that,

Thermal adhesive layer comprises: amorphous polyester resin A, the thermoplastic resin B that mix non-with it and the mixture of wax.

[4] according to each described flexible printed circuit board in [1]～[3], it is characterized in that,

All features of thermal adhesive layer has following (1)～(4), that is:

(1) vitrification point of amorphous polyester resin A is 50～95 ℃;

(2) thermoplastic resin B is that fusing point is that 50～180 ℃ crystalline resin, vitrification point is-50～150 ℃ amorphous resin or these mixture;

(3) in thermal adhesive layer, contain thermoplastic resin B with 1～30 quality %;

(4) thickness of thermal adhesive layer is 5～30 μ m.

[5] according to each described flexible printed circuit board in [1]～[4], it is characterized in that,

Be formed with the overlay that utilizes coating to form by the thermal adhesive layer surface of extruding formation jointly, be included in the bonding metal forming of this coating aspect.

[6] according to each described flexible printed circuit board in [1]～[5], it is

Via the thermal adhesive layer of exposing by etch processes and then the bonding film that forms by other resins and stacked formation.

[7] a kind of RFID media is used and is introduced sheet, wherein,

Its flexible printed circuit board in [1]～[6] has disposed integrated circuit.

[8] a kind of RFID media, wherein,

It is to use [7] described introducing sheet to constitute.

[9] a kind of manufacture method of flexible printed circuit board, it has when rolling out the reticulated film of reeling with the roller shape and metal forming, carries out the operation of heat lamination continuously, it is characterized in that,

As reticulated film, use at 200～280 ℃ of polyester base material layers with fusing point and formed Biaxially oriented polyester film by the thermal adhesive layer of extruding the mylar that contains wax comprising of formation jointly.

[10] a kind of manufacture method of RFID media, it has when rolling out a plurality of reticulated film and the flexible printed circuit board of reeling with the roller shape or introducing sheet, carries out the operation of heat lamination continuously, it is characterized in that,

Use each described flexible printed circuit board or introducing sheet in [1]～[7].

[11] according to the manufacture method of [10] described RFID media, it is characterized in that,

Antenna loop is disposed at each described flexible printed circuit board in [1]～[7] or introduces the Biaxially oriented polyester film heat bonding aspect of sheet.

The FPC of the application of the invention and introduce the manufacture method of sheet, RFID media can be implemented in the reducing of inequality of productivity ratio irrealizable, high in the manufacture method in the past and low disqualification rate, electric quality.

[primary structure and action effect]

Use the Biaxially oriented polyester film set in advance thermal adhesive layer as base material among the FPC of the present invention, therefore, need be in heat lamination processing or its preceding operation the adhesive-applying layer, or stacked, can simplify manufacturing process.

In addition, FPC of the present invention will utilize thermal adhesive layer to be adhered to the metal forming etch processes of film surface and make, and therefore, by etching, the position that is removed metal forming is once more as thermal adhesive layer performance function.Thereby, it need be laminated in other resin films etc., adhesive-applying again when making RFID media or flat cable etc. can simplify production process.

In addition, in FPC of the present invention, kept under the original state as the oriented crystalline structure of the polyester molecule of the feature of Biaxially oriented polyester film (fusing point of polyester film being maintained 200～300 ℃ original state), bonded metal paper tinsel and making, therefore, mechanical strength or superior for heat resistance as reticulated film, can be supplied with continuously to the heat lamination operation.In addition, the thermal deformation of IC-card after the processing or IC tag can be improved to the practical no problem scope that.

In addition, thermal adhesive layer of the present invention sets in advance by extruding jointly, therefore, and stretch orientation together during with the stretching reticulated film.Therefore, the thickness of thermal adhesive layer with compare based on the processing of extruding stacked or solution coating etc., superior and homogeneous when being disposed near antenna loop of IC-card or IC tag, can prevent that the generation of the inequality of its dielectric property from promptly can alleviate the inequality of communication distance.In addition, even the thermal adhesive layer of stretch orientation is a noncrystalline, also, bring into play strong cementability because therefore molecularly oriented is firm adhesive linkage.

In addition, the Biaxially oriented polyester film that uses in FPC of the present invention comprises the crystalline polyester resin that does not contain halogen.Therefore, the environment adaptability when being used in the RFID media is superior, and thermal endurance, resistance to chemical reagents are superior.

In addition, in the Biaxially oriented polyester film that in FPC of the present invention, uses, has an amount of wax at its adhesive linkage.Thus, can improve smooth property, the generation of the wrinkle in the time of can reducing the heat bonding metal forming.In addition, can access necessary adhesive strength.

In manufacture method of the present invention, not according to mold pressing procedure, and heat lamination reticulated film is continuously made the RFID media, therefore, with current comparing by each mold pressing processing of sheet of carrying out widely, can improve speed of production by leaps and bounds.

In addition, in manufacture method of the present invention, as reticulated film, use Biaxially oriented polyester film, therefore, can carry out the stacked processing under the high temperature, compare with the non-stretched film of the amorphous resin system of poor heat resistance, can carry out special following batch process at a high speed and process.

In addition, in manufacture method of the present invention, utilize heated roller, therefore stacked continuously processing, regulate easily the temperature of face integral body of bonding processing or the distribution of pressure equably.The situation of the distribution of homogenization temperature or pressure is subjected to the restriction of mechanical precision, in addition, regulates the operation in the past of temperature or pressure when handling with the each mold pressing of needs once more and compares, and can alleviate the heat of IC chip or circuit, the generation frequency of mechanical damage.

[other structures and effect]

In the Biaxially oriented polyester film that in FPC of the present invention, uses, utilize and make the known technology that contains the emptying aperture polyester film, can make and contain a large amount of fine emptying apertures in the film.This is the technology of carrying out of being difficult in the past PVC or PETG sheet.Thus, can be that the resiliency of emptying aperture content even film or flexibility are adjusted to the scope that is fit to the apparent density of thermal bonding polyester film when being used in the RFID media.

The situation that appropriateness contains fine emptying aperture in the film is effective in to the RFID media and gives light weight or flexibility, resiliency, notes.In addition, will contain the light specific gravity of the RFID media that the emptying aperture polyester film uses as material,, also can be not straight not sink even fall into the water or marine.Therefore, under the many situations of the accident of losing media, can avoid.

In addition, contain the emptying aperture polyester film and compare with polyester film that does not contain emptying aperture or sheet, apparent dielectric constant is low.Therefore, in the communication based on the high frequency of HF band and even SHF band, dielectric absorption is few.That is, will contain the gain height of emptying aperture polyester film as the RFID media of material use, effective in communicate by letter precision or communication distance, province's electrification.

In addition, the Biaxially oriented polyester film that uses in FPC of the present invention has with the thermal adhesive layer of amorphous polyester resin as the thickness of the appropriateness of main body.Therefore, by the heat bonding operation, etched metal forming (antenna loop) is embedded in the thermal adhesive layer, alleviates concavo-convexly, can improve the outward appearance or the yield of RFID goods.

In addition, the Biaxially oriented polyester film that uses in FPC of the present invention has the thermal adhesive layer of the mixture that comprises amorphous polyester resin and the thermoplastic resin that mix non-with it and wax on its surface.Therefore,, remove metal forming and the confficient of static friction of the thermal adhesive layer exposed is 0.1～0.6, can improve and make when introducing sheet, and use caking when introducing sheet and making the RFID media by etch processes.

In addition, by the addition of the thermoplastic resin of this amorphous polyester resin or vitrification point, fusing point are adjusted to suitable scope, reducing or promotion that air extracts of coefficient of friction can be under the situation that does not hinder thermal bonding, realized, the outward appearance after bonding or the yield of goods can be improved.

In addition, in the thermal adhesive layer of the Biaxially oriented polyester film that in FPC of the present invention, uses,, also can come off hardly, cause that the contamination of heavy of operation is little even the projection that is formed by thermoplastic resin is big projection.In addition, according to low heat bonding temperature, also when heat bonding, softening transform and planarization, therefore, the same in the past interpolation had not the taken place reduction of inorganic/thermal bonding of taking place during organic filler of big particle diameter.In addition, compare with inorganic/organic filler, the similarity of distortion (outstanding degree) is also big, and therefore, the possibility that the intensity of generation film reduces is also little.

In addition, in the present invention in the thermal bonding polyester film of Shi Yonging, when using, can access necessary flatness as the constituent material of RFID media.This be because, regulate the thickness of thermal adhesive layer and the thickness of reticulated film, in addition, percent thermal shrinkage or coefficient of linear expansion in the table back of the body of film are controlled to be suitable scope, can reduce batching of in back manufacturing procedure etc. generation thus.

And then, in the Biaxially oriented polyester film of Shi Yonging, also be fit to constitute the outer dress or the intermediate layer of RFID media in the present invention.By it is used as extrapolation or intermediate layer, can necessary electric parts, the loop of interior reliably bag.This is because the present invention has that to add man-hour at heat bonding softening with appropriateness and the thermal adhesive layer of distortion in addition, contains the polymer that does not hinder it, have fusing point or vitrification point as island component (emboliform dispersion) in thermal adhesive layer.That is,, has concavo-convex the giving property of shape that absorbs IC chip or metal forming loop etc. reliably because when the Biaxially oriented polyester film of Shi Yonging is kept smooth property in the present invention.

Description of drawings

Fig. 1 is the schematic diagram of the stacked bonding process of use in

embodiment

1,2,5.

Fig. 2 is the schematic diagram of the stacked bonding process of use in

embodiment

1,3,4,5,6.

Fig. 3 is the schematic diagram of the stacked bonding process of use in embodiment 2.

Fig. 4 is the schematic diagram of the stacked bonding process of use in

embodiment

3,6.

Among the figure: the roller of film that 1-rolls out or introducing sheet, metal foil laminated body; The 2-guide roller; The roller of metal forming that 3-rolls out or introducing sheet, film; The 4-preheat roll; The stacked roller of 5-; The 6-chill roll; 7-roll (nip roll); The FPC that 8-reels or the goods roller of RFID media; The 9-heating furnace; The 10-infrared heater.

Embodiment

In FPC of the present invention, to comprise by extruding the Biaxially oriented polyester film that has been pre-formed thermal adhesive layer jointly and in the duplexer of film surface bonding metal forming via thermal adhesive layer carries out FPC that etch processes makes, the base material of Biaxially oriented polyester film has fusing point at 200～300 ℃, and thermal adhesive layer contains wax.

In addition, in FPC of the present invention, utilize the thermal adhesive layer adhering resin film that exposes by etch processes and stacked situation is preferred execution mode.

In addition, in FPC of the present invention, the situation that Biaxially oriented polyester film contains the white polyester film of Chinese white or fine emptying aperture for portion within it is preferred execution mode.

In addition, in FPC of the present invention, the thermal adhesive layer of Biaxially oriented polyester film is formed by the mylar that contains wax.Preferred polyester resin is an amorphous polyester resin.And then the thermal adhesive layer of preferred Biaxially oriented polyester film comprises amorphous polyester resin A, the thermoplastic resin B that mix non-with it, and the mixture of wax, and the confficient of static friction that more preferably overlaps the table back of the body two sides mensuration of Biaxially oriented polyester film is 0.1～0.6.In addition, more preferably overlap with FPC utilize etch processes remove metal forming film table back of the body two sides and the confficient of static friction measured is 0.1～0.6.

In addition, in FPC of the present invention, about the thermal adhesive layer that is provided with at biaxially oriented film, preferred 5～30 μ m of its thickness, comprise that vitrification point is 50～95 ℃ amorphous polyester resin A and the mixture of the thermoplastic resin B that mix non-with it, thermoplastic resin B is that (a) fusing point is that 50～180 ℃ crystalline resin, (b) vitrification point is-50～150 ℃ amorphous resin or (c) those mixture, and the situation that contains 1～30 quality % in thermal adhesive layer is preferred execution mode.

In addition, introduce in the sheet in RFID instrumentality of the present invention, the structure that has disposed IC at above-mentioned FPC is for preferred embodiment.In addition, RFID media of the present invention uses the situation of above-mentioned introducing sheet formation for preferred embodiment.

In addition, in the manufacture method of RFID media of the present invention, when having a plurality of net slices that roll out with roller shape coiling, in the manufacture method of the RFID media of the stacked and operation that Continuous Heat is stacked, as reticulated film, use above-mentioned FPC or introduce sheet, the situation of utilizing the bonding process of the stacked roller of use that does not have mold pressing procedure to make is preferred execution mode.

In addition, in the manufacture method of RFID media of the present invention, as with the antenna loop adjacency the layer, the situation that does not dispose bond layer is preferred execution mode.

Below, describe embodiments of the present invention in detail.

[flexible printed circuit board]

FPC of the present invention will carry out the FPC that etch processes is made by the duplexer that forms by the metal forming of extruding the Biaxially oriented polyester film that has been pre-formed thermal adhesive layer jointly and utilize thermal adhesive layer to be adhered to film surface, and the fusing point of the Biaxially oriented polyester film after the etch processes observes at 200～300 ℃.

As the raw material of metal forming as used herein, can use silver or copper, gold, metal that the aluminium constant resistance is little, but form the loop by etch processes, therefore, preferably use etching to be easy to copper or aluminium.In addition,, do not limit especially about the thickness of metal forming, but the viewpoint of operation from FPC manufacturing process or process stability, electrical property, cost, preferred 5～100 μ m, more preferably 10～50 μ m.In addition, from absorbing the concavo-convex viewpoint of metal forming (antenna loop), preferred 15～60 μ m.

The method that this metal forming is adhered to Biaxially oriented polyester film does not limit except the method based on heat bonding especially, as common widely used method, can use based on the punching press adhesion of punching press adhesion bonding or bonding based on the heat lamination of warm-up mill.In punching press adhesion is bonding, apply high pressure, have the advantage of can also be bonding reliably thick metal forming thus, but speed of production improves or there is the limit in disqualification rate on reducing, therefore, it is bonding more preferably to utilize heat lamination to carry out.

This metal forming of etch processes forms the method in loop so long as do not damage method with the function of the bonding Biaxially oriented polyester film of metal forming or its thermal adhesive layer, does not just limit especially.For example,, use under the situation of Copper Foil or aluminium foil, can use the known method of ferric chloride in aqueous solution as metal forming.

In addition, in the present invention, need be as after the FPC processing, Biaxially oriented polyester film shows fusing point 200～300 ℃ scope.Using the known in the past FPC of Biaxially oriented polyester film manufacturing is for the metal forming heat lamination is bonding, and the temperature that is heated to the fusing point that surpasses the mylar that constitutes base material is come bonding.

These FPC in the past bring into play sufficient performance on cementability, but therefore the polyester film of base material, uses FPC basically by decrystallized, make the operation of RFID or situation about using as the goods of RFID or FPC under thermal endurance insufficient.That is, rolling out from roller in the operation in the back, under stacked situation such as other resin sheets, base material is softening sometimes, is difficult to apply sufficient tension force, or since the ambient temperature during as RFID or FPC use deform.

After Biaxially oriented polyester film is processed as FPC, show under 200～300 ℃ the situation of fusing point, more preferably show under 250～300 ℃ the situation of fusing point, kept the original oriented crystalline structure of biaxially oriented film fully, can prevent these problems that stable on heating deficiency causes.The situation that fusing point is made as above-mentioned scope can realize by as described below, that is: as Biaxially oriented polyester film, use and comprise pet resin or PEN resin, polytrimethylene phthalate ester resin and with these Biaxially oriented polyester films as the copolymer polyester resin of substrate skeleton, it is added man-hour as FPC, be not heated to be the above temperature of fusing point.

In addition, in FPC of the present invention, by etch processes, thermal adhesive layer is exposed in the part that is removed metal forming.The thermal adhesive layer maintaining heat cementability that this exposes, therefore, can not use bonding agent and with other resin sheets or film heat bonding, constitute FPC or introduce sheet, RFID media.In the goods that constitute like this, do not use bonding agent, therefore, can reduce electrical characteristics is the inequality of dielectric constant or dielectric absorption.

In the thermal adhesive layer that utilization is exposed, adhering resin sheet or film and under the stacked situation, the preferred 1～50N/cm of its adhesive strength, preferred 3～20N/cm.Do not satisfy in adhesive strength under the situation of this scope, when using as goods such as FPC or RFID media, because bending or friction etc. are peeled off, goods destroy, thereby not preferred sometimes.In addition, surpassing under the situation of this scope, special problem not taking place, but be the bonding force that surpasses the intensity of base material self actually, becomes superfluous quality, therefore not preferred.

Also have, as the method that adhesive strength is adjusted to this scope, except thermal adhesive layer being formed into the suitable design of back narration, the temperature in the time of can be with heat bonding is made as 90～200 ℃, preferably regulates in 130 ℃～180 ℃ scope and realizes.

In addition, in FPC of the present invention, table back of the body two sides is opposed and coefficient of friction of rest when overlapping is preferred 0.1～0.6, and more preferably 0.3～0.5.Do not satisfy at coefficient of friction of rest under the situation of this scope, smooth property is too high, therefore, piles up FPC and causes that goods collapses or the skew of reeling when reeling during keeping or as roller, is difficult to operate.In addition, under coefficient of friction of rest surpasses the situation of above-mentioned scope, the FPC of fracture is utilized operating sheet (Mei Leaf) during operation or when being wound as roller, lump sometimes.

[introducing sheet or RFID media]

Introduce sheet and be and be used to make the intermediate that the surface that is included in film substrate utilizes the RFID media of antenna loop that conductor such as metal forms and connected capacitor or IC etc.

Introducing sheet of the present invention be with FPC of the present invention as antenna loop, it has been disposed aforesaid electronic unit forms.About its structure, do not limit especially, but preferred thermal adhesive layer is exposed at its at least one side surface.Therefore the thermal adhesive layer maintaining heat cementability that this exposes, can not use bonding agent and bonding with other resin sheets or film, constitutes the RFID media.In the goods that constitute like this, do not use bonding agent, therefore, can reduce electrical characteristics is the inequality of dielectric constant or dielectric absorption.

In the thermal adhesive layer that utilization is exposed, adhering resin sheet or film and under the stacked situation, the preferred 1～50N/cm of its adhesive strength, more preferably 3～20N/cm.Do not satisfy in adhesive strength under the situation of this scope, when using, because bending or friction etc. are peeled off, destroy goods sometimes as goods such as FPC or RFID media, thus not preferred.In addition, surpassing under the situation of this scope, special problem not taking place, but be the bonding force that surpasses the intensity of base material self actually, becomes superfluous quality, therefore not preferred.

In addition, RFID media of the present invention is so long as use introducing sheet of the present invention with regard to not limiting especially, for bonding at stacked other resin sheets of introducing sheet of the present invention or film.Stacked resin sheet and film do not limit especially, but viewpoint from the environment adaptability, preferably include the sheet or the film of polyester based resin, from viewpoints such as thermal endurance or resistance to chemical reagents, mechanical strengths, more preferably use biaxially stretched polyester, and then the white polyester film of Chinese white or fine emptying aperture is contained in preferred portion within it.

Under the situation that stacked white polyester film uses, can improve the disguised or white property of RFID media, be preferred embodiment.Thus, under situation from printing to the surface that implemented, can make beautiful media.In addition, by hiding built-in electronic unit or circuit, can intensified safety.

In addition, using the situation that contains the film of fine emptying aperture in inside is most preferred execution mode.Except effect by fine emptying aperture; give resiliency to the RFID media; outside the loop of protection inside; can also obtain a large amount of following advantages; that is: RFID becomes pliable and tough, can improve operability, and the notes of charging to card under the situation of mark are superior; reduce dielectric constant or dielectric absorption, what can increase RFID can communication distance etc.

In addition, under by the hot sticky situation that fetches laminated biaxially-stretched polyester film, use the situation of the film that has the improved in adhesion layer on the surface effective when improving adhesive strength.

[structure of film]

In FPC of the present invention, it is characterized in that, use by extruding the Biaxially oriented polyester film that has been pre-formed thermal adhesive layer jointly.Be described in detail this Biaxially oriented polyester film.

The Biaxially oriented polyester film of Shi Yonging comprises base material and the stacked structure of the thermal adhesive layer on the one or both sides of described base material in the present invention.As base material, the situation of using Biaxially oriented polyester film is except environment adaptability (not comprising halogen compounds), and is important from aspects such as thermal endurance or resistance to chemical reagents, intensity, rigidity.Thus, compare, improve these characteristics by leaps and bounds with the PVC sheet of used nothing orientation in the past or PEG sheet etc.

In addition, importantly, the Biaxially oriented polyester film of Shi Yonging has thermal adhesive layer at its one or both sides in the present invention.Thermal adhesive layer described herein is under heating condition, can with the layer of the plastic film that constitutes IC-card or IC tag or sheet, metal film, the various overlay heat bondings that form on these surfaces.By this thermal adhesive layer is laminated in base material, can give with as identical thermal bondings such as the raw-material PVC of in the past IC-card or IC tag or PETG.

Importantly, the thickness of this thermal adhesive layer is more than the 5 μ m and below the 30 μ m at each layer.Under the situation of thickness less than 5 μ m of thermal adhesive layer, thermal bonding and concavo-convex absorbability are insufficient.On the other hand, surpass under the situation of 30 μ m at the thickness of thermal adhesive layer, with in the past the card that the PETG sheet is used as material in the same manner, thermal endurance or resistance to chemical reagents reduce.The preferred 8 μ m of the lower limit of the thickness of thermal adhesive layer, more preferably 10 μ m.On the other hand, the preferred 8 μ m of the upper limit of the thickness of thermal adhesive layer, more preferably 10 μ m.On the other hand, the preferred 25 μ m of the upper limit of the thickness of thermal adhesive layer, more preferably 20 μ m.

As the surface at base material the scheme of thermal adhesive layer is set, is extruding the raw material of fusion, make in the operation of drawing sheet not, using the method for extruding with the stacked two kinds of resins of molten condition is so-called common extrusion molding.Just utilize the stacked thermal adhesive layer of this method, the change of the thickness in each one in the plane is little, therefore, with compare based on the adhesive linkage of bonding agent etc., dielectric property in each position uneven little can realize using electrical characteristics even the phenomenon of leakage current or the raising of communication distance of the FPC or the RFID media of its manufacturing.

In addition, in the Biaxially oriented polyester film of Shi Yonging, thermal adhesive layer is set in the present invention on the two sides of base material, but from the aspect of batching that suppresses film for preferred embodiment.In the present invention, thermal adhesive layer mainly comprises amorphous resin, thermal coefficient of expansion with based on the base material of crystalline polyester resin a great difference is arranged.Therefore, only the one side at base material is provided with under the situation of thermal adhesive layer, according to processing conditions or service condition, has the time image bimetallic equally to batch, and may cause the defective of flatness or operability.

Be provided with on the two sides of base material under the situation of thermal adhesive layer, the thickness ratio of the thermal adhesive layer of the table back of the body is preferred more than 0.5 and below 2.0.Under the situation that breaks away from this scope, owing to above-mentioned reason, batch sometimes.Also have, taking place under the situation of batching, also as long as under the state of no loading, the value of batching of having carried out after 110 ℃, 30 minutes the heat treated is below the 5mm, just not break down basically on operability.Deng the preferred value of batching is below the 3mm, below the especially preferred 1mm.

In addition, as another method that suppresses to batch, have on temperature of giving on the surface of film and the back side or heat difference is set on one's own initiative, its result makes the value of batching near zero method.Specifically, by in stretch orientations such as longitudinal stretching or cross directional stretch and heat fixation operation, the temperature or the heat of the film table back of the body are made as value inequality, and the surface of independent control film and the degree of orientation at the back side make the structure or the rerum natura equilibrium at the surface and the back side of film.Its result can reduce and batch.Using under the situation of this method, in the heating of the operation of longitudinal stretching film, cooling procedure, surface and the roller at the back side or the temperature of infrared heater of regulating the heating film easily are preferable methods.

In addition, the thickness of the Biaxially oriented polyester film preferred film integral body of using in the present invention is more than the 25 μ m and below the 350 μ m.The lower limit of the thickness of film integral is 38 μ m more preferably, and then preferred 50 μ m.In addition, the upper limit of the thickness of film integral is 280 μ m more preferably, and then preferred 200 μ m.Under the situation of thickness less than 25 μ m of film integral, it is unstable that the process stability when mechanical strength or operability, FPC or RFID media are made becomes, therefore not preferred.On the other hand, surpass under the situation of 350 μ m, in the thickness (for example, the IC-card in the JIS specification is 0.76mm) of the standard of RFID media, be restricted with other the sheet or the combination of film, circuit at the thickness of film integral, therefore, not preferred.

In addition, in the present invention in the Biaxially oriented polyester film of Shi Yonging, in order further to improve thermal bonding or smooth property, or give preventing property of static electrification or the like other functions, also can overlay be set on the surface of film.As the resin or the additive that constitute overlay, can enumerate resin that mylar, polyurethane resin, polyester urethane resin, acrylic resin etc. use for the cementability that improves common polyester film or the static electrification that improves preventing property of static electrification and prevent agent etc.As the standard of from these resins or additive, selecting preferred material, preferably with the Biaxially oriented polyester film that uses in the present invention be laminated in the affinity height of its material.Specifically, preferred option table surface tension or approaching resin or the additive of solubility parameter.But, under the situation that has applied curable resin etc., also may be to bringing fault as the thermal bonding of important effect of the present invention, the selection of material be should be noted that.

As the method that overlay is set, can be suitable for gravure coating method, contact coating mode, impregnation method, dash coat mode, curtain and be coated with normally used methods such as mode, air knife application pattern, scraper plate application pattern, twist rollers application pattern.Can also use stage, the method that before the stretching of film, applies, the method that behind longitudinal stretching, applies, in the arbitrary method such as method of the film surface coating of the orientation process that is through with as coating.

[thermal adhesive layer]

In FPC of the present invention, importantly,, use by extruding jointly as base material, be pre-formed the Biaxially oriented polyester film of thermal adhesive layer, importantly, in this thermal adhesive layer, contain wax.

As this wax, except comprising that polyolefin-based resins or polyester based resin, polyethers are the wax of synthetic high polymer system of resin, acrylic resin, silicone-based resin etc., can use natural minerals such as montan wax is the wax of departments of botany such as wax, Brazil wax, but together process with mylar, therefore, importantly has thermal endurance.Wherein, preferred what use is that synthetic high polymer is a wax, from viewpoints such as softening temperature or surface tension, operability, and more preferably polyolefin wax.

At this, as the method that contains wax in thermal adhesive layer,, add polyvinyl resin or resinous principles such as acrylic resin, polyethylene glycol resin by except the aforesaid wax of direct interpolation, its result also can contain the low molecular weight compositions that contains in this resin as wax.Contain wax in right amount also according to its kind and therefore difference, is difficult to limit without exception.For example, use under the situation of polyolefin wax or polyethylene glycol resin, with respect to preferred 0.03～3 quality % of thermal adhesive layer, more preferably 0.1～0.8 quality %.In addition, add polyvinyl resin, under the situation of its low molecular weight compositions, preferably add 1～20 quality %, more preferably add 3～10 quality % as polyvinyl resin as the wax utilization.With regard to the suitable addition in other waxes, can be with when the film surface that cleaned wiping fully with acetone, coefficient of friction of rest increases by about 0.1～0.5 addition and designs as target.

In addition, as wax, preferably using fusing point is 40～150 ℃ wax, more preferably 50～120 ℃ wax.Do not satisfy at fusing point under the situation of this scope, it is unstable that the operation that melt extrudes becomes, or the thermal degradation when thing is easy to generate, or ooze out on the surface of film and separate out, therefore not preferred.In addition, surpass under the situation of this scope at fusing point, the effect that reduces to rub reduces, or hinders thermal bonding, and is therefore not preferred.

In addition, preferred thermal adhesive layer is that the amorphous polyester resin A below the 20mJ/mg is the main composition composition with the melting caloric.At this, melting caloric uses the DSC device according to putting down in writing " the critical heat quantity measuring methods of plastics " among the JIS-K7122, under blanket of nitrogen, and the melting caloric of measuring with 10 ℃/minute speed heating.

In the present invention, below the preferred 10mJ/mg of above-mentioned melting caloric, more preferably do not observe the fusion peak basically.Under melting caloric was situation below the 20mJ/mg, in the heat bonding operation, the thermal adhesive layer easy deformation absorbed the concavo-convex of metal forming or electronic unit etc. more well, the superior FPC of flatness can be provided or introduce sheet, RFID media.

In addition, importantly, the vitrification point of amorphous polyester resin A is more than 50 ℃ and below 95 ℃.Also have, above-mentioned vitrification point is meant: " the conversion temperature assay methods of plastics " according to record among the JIS-K 7121, use the DSC device, under blanket of nitrogen, with the heating of 10 ℃/minute speed, the intermediate point vitrification point of obtaining based on the DSC curve that obtains (Tmg).Preferred 60 ℃ of the lower limit of the vitrification point of amorphous polyester resin A, more preferably 70 ℃.On the other hand, preferred 90 ℃ of the upper limit of vitrification point, more preferably 85 ℃.Vitrification point less than 50 ℃ situation under, when using as FPC or RFID media, thermal endurance is not enough and be out of shape, or because small heating, thermal adhesive layer is peeled off again.On the other hand, surpass under 95 ℃ the situation, when making FPC or RFID media, need therefore, reduce speed of production with higher temperature heating, or become big, so not preferred to the burden of circuit in vitrification point.

The kind of amorphous polyester resin A does not limit especially, but, preferably use to the amorphous polyester resin that has imported various copolymer compositions with PETG as the molecular skeleton of the aromatic polyester resins of representative from versatility or cost, durability or concerning the viewpoint of the thermal bonding of PETG sheet etc.In the copolymer composition that imports,, can enumerate ethylene glycol or diethylene glycol, neopentyl glycol (NPG), cyclohexanedimethanol (CHDM), propylene glycol, butanediol etc. as diol component.On the other hand, as sour composition, can enumerate phthalandione or isophathalic acid, naphthalene dicarboxylic acids etc.As copolymer composition, selection can reduce vitrification point, improves the monomer of the thermal bonding under the low temperature.As such copolymer composition, can enumerate the composition of the big non-linear structure of long glycol of straight chain composition or steric hindrance.The latter's composition is used in the crystallinity that desire reduces thermal adhesive layer effectively, improves in the concavo-convex absorbefacient situation.In the present invention, from concerning the viewpoint of the thermal bonding of PETG sheet, preferred CHDM or NPG, more preferably NPG.

In addition,, also have usually and develop as the bonding agent purposes as amorphous polyester resin A, and commercially available amorphous polyester resin.Using such bonding agent with under the situation of resin owing to be originally as the resin of bonding agent exploitation, therefore, have can be bonding with large-scale raw material possibility.Yet such bonding agent is difficult to stably extrude jointly in the manufacturing process of biaxially oriented film with resin sometimes.Stably carrying out under the situation about extruding jointly, the inequality of the thickness of the thermal adhesive layer of one of main points of the present invention reduces deficiently, the electrical characteristics of damage IC-card or IC tag.Under these circumstances, need regulate the temperature controlling of extruder or the thickness of thermal adhesive layer etc. fully, the thickness distribution of homogenization thermal adhesive layer.

In addition, in the present invention, thermal adhesive layer comprises amorphous polyester resin A and the amorphism that mix non-with it or crystalline thermoplastic resin B, forms island structure.Thermoplastic resin B exists as dispersion (island structure) in thermal adhesive layer.In addition, the projection that the island structure of this island structure causes has: give smooth property to the thermal bonding polyester film, in the operation of heat bonding, flat burst of this projection and become smooth do not hindered the action effect of thermal bonding.

Below, explanation can be as the amorphism thermoplastic resin and the crystalline thermoplastic resin of thermoplastic resin B use.

Above-mentioned non-crystalline thermoplastic resin is that melting caloric is the following thermoplastic resin of 20mJ/mg.Also have,, use the DSC device, under blanket of nitrogen, measure melting caloric with 10 ℃/minute speed heating according to JIS K 7122 " the critical heat quantity measuring methods of plastics ".

With regard to non-crystalline thermoplastic resin, in the inside of thermal adhesive layer, in amorphous polyester resin, form island structure, the protrusion-shaped that causes thus is formed in the surface of thermal adhesive layer.Need this projection at room temperature to keep sufficient hardness, improve the smooth property of film.Therefore, in the present invention, as the thermoplastic resin B that becomes island component, use under the situation of non-crystalline thermoplastic resin, importantly, the vitrification point of resin is more than-50 ℃ and below 150 ℃.Also have, above-mentioned vitrification point is meant: " the conversion temperature assay methods of plastics " according to shown in the JIS K 7121, utilize the DSC device, and under blanket of nitrogen, the intermediate point vitrification point of in 10 ℃/minute heating process, measuring.

Preferred-20 ℃ of the lower limit of the vitrification point of non-crystalline thermoplastic resin, more preferably 0 ℃.The vitrification point of non-crystalline thermoplastic resin less than-50 ℃ situation under, when the operation film, can not get necessary smooth property, or after having made FPC or RFID media, the thermoplastic resin composition oozes out on the surface sometimes.

In addition, based on the projection of this island structure flat bursting and become smooth in the heat bonding operation, do not play a role with not hindering thermal bonding.That carries out when in the present invention, making FCP or RFID media is stacked preferably 100～200 ℃ of enforcements down.Therefore, more preferably 130 ℃ of the upper limits of the vitrification point of above-mentioned non-crystalline thermoplastic resin, so that preferred below 100 ℃.On the other hand, surpass under 150 ℃ the situation, cause under common bonding temp, can not get sufficient thermal bonding, become big problem with the burden to circuit etc. under the situation of heat bonding under the higher temperature in the vitrification point of non-crystalline thermoplastic resin.

On the other hand, in the present invention,, can use crystalline thermoplastic resin as making an addition to the thermoplastic resin B that thermal adhesive layer is used.Above-mentioned crystalline thermoplastic resin is the thermoplastic resin that melting caloric surpasses 20mJ/mg.Also have, " the critical heat quantity measuring methods of plastics " according to record among the JIS K 7122 use the DSC device, under blanket of nitrogen, measure melting caloric with 10 ℃/minute programming rate heating.

Therefore this crystalline thermoplastic resin, forms island structure as dispersion for to mix with amorphous polyester resin A is non-in amorphous polyester resin, the protrusion-shaped that causes thus is formed in the thermal adhesive layer surface.Need this projection at room temperature to keep sufficient hardness, improve the smooth property of film.Therefore, importantly, the crystalline thermoplastic resin is that fusing point is more than 50 ℃ and the resin below 200 ℃.Also have, " the conversion temperature assay methods of plastics " according to record among the JIS K 7121 utilize the DSC device, under blanket of nitrogen, measure crystalline thermoplastic resin 10 ℃ of/minute speed heating.

More preferably 70 ℃ of the lower limits of the fusing point of crystalline thermoplastic resin, and then preferred 90 ℃.In addition, in the operation of heat bonding, flat burst and become smooth do not hindered thus and played a role bondingly, and the maximum temperature in the fusing point specific heat bonding process of preferred resin is not high more than 30 ℃.More particularly, more preferably 180 ℃ of the upper limits of the fusing point of resin, and then preferred 160 ℃.

In the present invention, the thermoplastic resin that uses in thermal adhesive layer does not limit especially, but mixes use with amorphous polyester resin, and therefore, the difference and the PETG of solubility parameter that suitable is are in a ratio of 2.0 (J/cm ³) ^1/2Above resin.

As amorphism and the high resin of versatility, can enumerate polystyrene or Merlon, crylic acid resin, cyclic olefin resin class or its copolymer, legislate low low-density polypropylene or olefines such as polyethylene or its copolymer etc., but it is because high to the stability of heat or ultraviolet ray, oxygen, more general, preferred polystyrene or TPO, from the high aspect of thermal endurance, preferred polystyrene or cyclic olefin copolymer.

In addition, as crystallinity and the high resin of versatility, can enumerate polyethylene or polypropylene, polybutadiene, skep, PLA, polyformaldehyde etc.Wherein, high from stability to heat or ultraviolet ray, oxygen, more general aspect, preferably polyethylene or polypropylene are from the aspect that fusing point is fit to, more preferably polyethylene.Also have, in polyethylene, from crystalline aspect, preferred density surpasses 0.90g/cm ³High density polyethylene (HDPE) or straight chain shape low density polyethylene (LDPE).

In addition, in the present invention, the amount of the thermoplastic resin B that contains in thermal adhesive layer is more than the 1 quality % and below the 30 quality % with respect to the material that constitutes thermal adhesive layer.The preferred 3 quality % of the lower limit of the content of thermoplastic resin B, more preferably 5 quality %.On the other hand, the preferred 25 quality % of the upper limit of the content of thermoplastic resin B, more preferably 20 quality %.Under the situation of content of thermoplastic resin B, can not get necessary smooth property less than 1 quality %.On the other hand, the content of thermoplastic resin B surpasses under the situation of 30 quality %, becomes thick projection, and the surface from film comes off sometimes, the opposite variation of smooth property, or planarization deficiently in the heat bonding operation, thermal bonding variation.

In addition, in the present invention, the maximum height on the surface of thermal adhesive layer is more than the 1.0 μ m, and below the 10 μ m.The lower limit of the maximum height on the surface of thermal adhesive layer and then preferred 1.2 μ m, especially preferred 1.5 μ m.On the other hand, the upper limit of the maximum height on the surface of thermal adhesive layer is 8.0 μ m more preferably, especially preferred 5.0 μ m.Under the situation of the maximum height on the surface of thermal adhesive layer less than 1.0 μ m, can not get sufficient smooth property, it is difficult that the operability of film becomes.On the other hand, the maximum height on the surface of thermal adhesive layer surpasses under the situation of 10 μ m, because wiping, the projection on the surface of film comes off, and pollutes operation, or smooth property variation on the contrary.

In addition, in the present invention, the ratio (St1/Sa1) of maximum height on the surface of thermal adhesive layer (St1) and arithmetic mean surface roughness (Sa1) is preferred more than 3.0 and below 20.The lower limit of St1/Sa1 more preferably 5.0, especially preferred 7.0.On the other hand, the upper limit of St1/Sa1 more preferably 16, especially preferred 12.St1/Sa1 less than 3.0 situation under, be difficult to improve smooth property.On the other hand, surpass under 20 the situation, be difficult to obtain thermal bonding at St1/Sa1.

Be adjusted to the method for suitable scope as maximum height, can enumerate (1) and select the method for the melt viscosity of amorphous polyester resin A or vitrification point, melt viscosity that (2) select thermoplastic resin B or vitrification point, fusing point, surface tension, solubility parameter, the method for addition, (3) to select the method for temperature of resin when film surface is extruded of thermal adhesive layer etc. the projection in the surface of thermal adhesive layer.In these methods, the method for the vitrification point of adjusting amorphous polyester resin and the kind of thermoplastic resin or addition, extrusion temperature is easy and reliable.

In addition, in the present invention, the surface that makes thermal adhesive layer is opposed and clamp with glass plate level and smooth and cleaning, and it is above and below the 3 μ m to have carried out the preferred 0.001 μ m of maximum rising height (St2) on surface of the thermal adhesive layer after the hot-pressing processing (100 ℃, 1MPa, 1 minute).The lower limit of St2 is 0.005 μ m more preferably, most preferably 0.01 μ m.In addition, the upper limit of St2 is 2.5 μ m more preferably, most preferably below the 2 μ m.

Under the situation of St2 less than 0.005 μ m, when heat lamination, constitute the resin flows of thermal adhesive layer, processing stability may be insufficient.In addition, surpass under the situation of 0.01 μ m at St2, behind heat bonding, projection is also residual a plurality of, and the bonding interface of the stable bonding force that is not in full use is therefore not preferred.Also have,, effectively, the fusing point of crystalline thermoplastic resin is regulated in 50～200 ℃ scope, or the content of crystalline thermoplastic resin is regulated in the scope of 1～30 quality % for St2 being adjusted to the scope of 0.001～3 μ m.

In addition, the thermal bonding polyester film of Shi Yonging preferably makes the surface of film and the back side opposed in the present invention, and the confficient of static friction in its interface is more than 0.1 and below 0.6.The lower limit of coefficient of friction more preferably 0.2.On the other hand, the upper limit of coefficient of friction more preferably 0.7, and then preferred 0.6, especially preferred 0.5.In technical scope of the present invention, be difficult to make the surface of film and the confficient of static friction between the back side less than 0.1.On the other hand, surpass under 0.8 the situation the remarkable variation of the operability of film at above-mentioned confficient of static friction.For confficient of static friction being adjusted to 0.1～0.8 scope, preferably as mentioned above, regulating the maximum height on the surface of thermal adhesive layer, or regulate the modulus of elasticity or the surface tension of thermal adhesive layer.

In addition, as the method that is used for confficient of static friction is adjusted to above-mentioned scope, add wax to thermal adhesive layer.Thermal adhesive layer is an amorphism, and therefore, modulus of elasticity is low, and viscosity is high relatively.In such thermal adhesive layer, even add the non-thermoplastic resin that mixes or inorganic particulate, organic filler, can not reduce coefficient of friction fully, therefore, add wax.

In addition, the concavo-convex thermal adhesive layer by the Biaxially oriented polyester film that uses in the present invention that causes such as the IC chip of the internal configurations of circuit on FPC or RFID media absorbs.This concavo-convex absorbability can be used as the standard based on the giving property of shape of heat bonding operation, and the parameter of gradient of giving the outer rim of rate or shape assigning unit with so-called shape shows.At this, the shape rate of giving is meant: at the surperficial mounting antenna loop or the copper foil of thermal adhesive layer, after carrying out hot pressing, when having removed antenna loop or copper foil at normal temperatures and pressures, the degree of depth of the depression of the thermal adhesive layer that is produced by antenna loop or copper foil, the gradient of the outer rim of shape assigning unit is meant: the gradient of the wall in the outer rim of this depression.

In addition, in the Biaxially oriented polyester film of Shi Yonging, the shape rate of giving that is preferably based on hot pressing is more than 40% and below 105% in the present invention.The present invention is from absorbing the concavo-convex viewpoint of IC chip or circuit, and more preferably shape is given the following of rate and is limited to 50%, and then preferred 60%.

Certainly from this viewpoint, the upper limit that shape is given rate is high more, unreasonablely thinks.Yet, give rate in order to improve shape, under the situation of resin that will when heating, soften terrifically easily as the thermal adhesive layer use, in the heat bonding operation, the thermal adhesive layer generation is mobile etc., may cause processing stability to reduce, therefore, more preferably: be below 102%, to be limited to below 98% more realistically realistically.Also have, as the method that the shape rate of giving is adjusted to below 40～105%, the thickness adjusted that can enumerate thermal adhesive layer is more than the 5 μ m, or make the vitrification point of the amorphous polyester resin A that constitutes thermal adhesive layer or thermoplastic resin B or fusing point, or suitably regulate the method etc. of blending ratio, viscosity, modulus of elasticity etc. near the heat bonding temperature.

In addition, in the present invention, preferred more than 20% and below 1000% based on the gradient of the outer rim of the shape assigning unit of hot pressing.In the present invention, absorb the concavo-convex viewpoint of IC chip or circuit from thermal adhesive layer, preferably the profile with circuit etc. is consistent to give the shape of depression of shape.Be meant protuberance in the gradient of the outer rim of shape assigning unit less than 20% situation, be affected till its periphery and be out of shape, or do not absorb the state of the shape of protuberance fully for circuit etc.This gradient is more preferably more than 50%, and then preferred more than 100%.

In addition, big more certainly from concavo-convex absorbefacient viewpoint based on the gradient of the outer rim of the shape assigning unit of hot pressing, be desirable distortion more, most preferably infinitely great geometrically.Yet, realize realistically in the disclosed in the present invention technical scope be the upper limit 1000% till, what can realize realistically in manufacturing procedure more generally is below 500%.Also have, as the method that will be adjusted to based on the gradient of the outer rim of the shape assigning unit of hot pressing in 20～1000% the scope, more than the thickness adjusted with thermal adhesive layer is 5 μ m, can enumerates and to constitute the method that the vitrification point of the amorphous polyester resin A of thermal adhesive layer or amorphism thermoplastic resin B or blending ratio, viscosity, modulus of elasticity etc. are suitably regulated and so on.

In addition, in the present invention in the Biaxially oriented polyester film of Shi Yonging, especially as white and need under the situation that the raw material of concealed card or label use, the situation that contains Chinese white in thermal adhesive layer is for one of preferred embodiment.As the Chinese white that in thermal adhesive layer, contains, preferably include titanium oxide, calcium carbonate, barium sulfate and these complex, from the viewpoint of hidden effect, more preferably use titanium oxide.These inorganic particulates preferably contain with the scope below the 30 quality % with respect to the constituent material of the Biaxially oriented polyester film of base material, more preferably below the 20 quality %.Under the situation that surpasses above-mentioned scope interpolation, in the manufacturing process of Biaxially oriented polyester film, the fracture of film takes place, and causes production efficiency to reduce, or the dielectric constant of film or dielectric absorption rising, causes the electrical characteristics of FPC or RFID to reduce, so not preferred.

In addition, in the Biaxially oriented polyester film of Shi Yonging, in not hindering thermal bonding or smooth property, concavo-convex absorbefacient scope, it is also harmless to contain organic filler in thermal adhesive layer in the present invention.By in thermal adhesive layer, containing organic filler, can form projection on the surface of thermal adhesive layer, by heat lamination, make its heat bonding, when making FPC or RFID media, can discharge the bubble between film effectively.

As organic filler, preferred melamine resin or cross-linked polystyrene resin, crosslinked acrylic resin reach the compound particle based on these.Also have, these inorganic particulates preferably contain with the scope below the 30 quality % with respect to the constituent material of thermal adhesive layer, more preferably below the 20 quality %.Under the situation of adding surpassing above-mentioned scope, in the manufacturing process of Biaxially oriented polyester film, the fracture of film sometimes takes place, and causes production efficiency to reduce, and is therefore not preferred.

[overlay]

The Biaxially oriented polyester film of Shi Yonging is characterised in that in the present invention, has the adhesive linkage that forms by applying on the surface.The purpose that forms overlay is except the anchoring effect that thermal adhesive layer has, and is the chemical bond that forms between the resin in order to utilize the principal component at metal and overlay, obtains more firm adhesive strength.

As the resin that uses in overlay, the expectation thermoplastic resin contains the functional group that hydroxyl, carboxyl etc. can be realized coordinate bond with metal.In addition, water is with below preferred 80 degree of the contact angle of the Biaxially oriented polyester film that has formed overlay, more preferably below 75 degree, and then below preferred 70 degree.As the resin that satisfies such condition, the preferred resin that uses polyurethane resin, acrylic resin, vistanex, mylar, polyester urethane resin etc. to use for the cementability that improves common polyester film, more preferably use polyurethane resin, vistanex, mylar, and then optimization polyurethane resin, vistanex.Wherein, in etch processes operation, resist lift-off processing operation, impregnated in acid, the aqueous slkali, therefore, the more preferably superior resin of hydrolytic resistance.

In addition, as the resin of the principal component of overlay by applying heat, with substrate bondings such as film, metals.If becoming the base material and the resin of bonding object is bonding beginning temperature with the lower limit that peel strength becomes the bonding temp more than the 3N/cm, then when making FPC or RFID, stacked 100～200 ℃ of preferred down enforcements, therefore, the preferred bonding beginning temperature of overlay is below 130 ℃, more preferably below 100 ℃.Bonding beginning temperature at overlay surpasses under 160 ℃ the situation, and the resin of overlay is softening deficiently, becomes bonding bad, therefore not preferred.

Overlay is in the film making process of Biaxially oriented polyester film, behind the coating liquid coating, forms through drying process, stretching process, heat fixation treatment process.As the method that overlay is set, can be suitable for gravure coating method, contact coating mode, impregnation method, dash coat mode, curtain and be coated with normally used methods such as mode, air knife application pattern, scraper plate application pattern, twist rollers application pattern.Can also use stage as coating, the method that before the stretching of film, applies, the method that behind longitudinal stretching, applies, in the arbitrary method such as method of the film surface coating of the orientation process that is through with, but aspect from the flatness of keeping film, preferably after coating, the method that stretches along the single shaft direction at least.

Preferred 0.005～1 μ m of the thickness of overlay, more preferably 0.01～0.5 μ m, most preferably 0.02～0.1 μ m.Do not satisfy at thickness under the situation of this scope, can not keep cementability, therefore not preferred.In addition, under the situation of thickness greater than this scope, the concavo-convex absorbability that thermal adhesive layer has reduces, and is therefore not preferred.

With regard to applicator surface, under overlay and situation that heated roll surface contacts, because roller and film are bonding, therefore, the situation of one side that is made as the Biaxially oriented polyester film that does not contact with roll surface is for preferred embodiment.

Coating liquid can not damage the advantage with the Biaxially oriented polyester film headed by disguise, the resiliency.In addition, on Biaxially oriented polyester film, apply thinly, therefore, also can not exert an influence concavo-convex absorbability.In addition, after coating, stretch along the single shaft direction at least, therefore, can not damage the flatness of Biaxially oriented polyester film.

[substrate layer of Biaxially oriented polyester film]

The Biaxially oriented polyester film that uses in the present invention is base material with one deck Biaxially oriented polyester film layer at least.With regard to this layer, can utilize known method in the past, easily regulate optical characteristics or mechanical characteristic.

Under the situation that the Biaxially oriented polyester film that uses in the present invention uses as the raw material of white or high hidden FPC or RFID media, as base film, what a plurality of fine emptying apertures were contained in preferred portion within it contains the emptying aperture polyester film.Preferably utilize a plurality of fine emptying aperture of film inside, the apparent density of film is controlled to be 0.7g/cm ³More than and 1.3g/cm ³Below.The preferred 0.8g/cm of the lower limit of the apparent density of film ³, and then preferred 0.9g/cm ³On the other hand, more preferably 1.2g/cm of the upper limit of the apparent density of film ³, and then preferred 1.1g/cm ³In the apparent density of film less than 0.7g/cm ³Situation under, the intensity of film or anti-bending, compression recovery reduce, and can not get suitable mechanical property when the manufacturing of FPC or RFID media or when using.On the other hand, the apparent density at film surpasses 1.2g/cm ³Situation under, as FPC or RFID media, can not get necessary flexibility or resiliency, light weight.

As the method that contains emptying aperture in the inside of film, can enumerate (1) and contain blowing agent, when utilization is extruded or the heat of system during film, foam, or utilize chemical breakdown, the method, (2) that make its foaming are when extruding or after extruding, the material that gases such as interpolation carbon dioxide maybe can gasify, the method that foams, (3) to polyester and with the thermoplastic resin of the non-intermiscibility of this polyester, after melt extruding, add organic or inorganic particles along single shaft or biaxial stretch-formed method, (4), after melt extruding, along single shaft or biaxial stretch-formed method etc.

Contain in the inside of above-mentioned film in the method for emptying aperture, the method for preferably above-mentioned (3) is promptly added the thermoplastic resin with the non-intermiscibility of polyester, after melt extruding, and biaxial stretch-formed method behind the single shaft.As with the non-thermoplastic resin that mixes of mylar, do not limit especially, but illustration is that polyolefin-based resins, polystyrene resin, polyacrylic resin, polycarbonate resin, the polysulfones of representative is that resin, cellulose-based resin, polyphenylene oxide are resin etc. with polypropylene or polymethylpentene.

The independent use of these thermoplastic resins also can, in addition, make up a plurality of thermoplastic resins and use and also can.Contain preferred 3～20 quality % of resin of emptying aperture polyester layer and then preferred 5～15 quality % with the content of the thermoplastic resin of the non-intermiscibility of these mylar with respect to formation.Also have, the resin that contains the emptying aperture polyester layer with respect to formation with the content of the thermoplastic resin of the non-intermiscibility of mylar tails off at the inner emptying aperture content that forms of film less than under 3% the situation, therefore, and disguised the reduction.On the other hand, the content of the thermoplastic resin of non-intermiscibility surpasses under the situation of 20 quality % with respect to the resin that forms the white polyester layer, the fracture pilosity in the thin film fabrication operation.Also have, contain preferred 10～50 volume % of emptying aperture containing ratio of the inside of emptying aperture polyester film, more preferably 20～40 volume %.

In addition, under the situation that the Biaxially oriented polyester film that uses is in the present invention used as the raw material of white or high hidden FPC or RFID media, as base film, the white polyester film that contains Chinese white at the biaxially stretched polyester layer is also for one of preferred embodiment.Chinese white does not limit especially as used herein, but from the viewpoint of versatility, preferably includes titanium oxide, calcium carbonate, barium sulfate and these complex, from the viewpoint of hidden effect, more preferably uses titanium oxide.

These inorganic particulates preferably contain with the scope below the 25 quality % with respect to the constituent material of white polyester layer, more preferably below the 20 quality %.Surpassing under the situation of above-mentioned scope, when thin film fabrication, fracture sometimes is multiple, and it is difficult that the steady production of industrial level becomes.

In addition, under the situation that the Biaxially oriented polyester film that uses is in the present invention used as the raw material of white or high hidden FPC or RFID media, the preferred content of suitably regulating fine emptying aperture or Chinese white, making optical concentration is more than 0.5 and below 0.3.The lower limit of optical concentration more preferably 0.7, and then preferred 0.9.In addition, the upper limit of optical concentration more preferably 2.5, and then preferred 2.0.Do not satisfy at optical concentration under the situation of above-mentioned scope, when forming IC-card or IC tag, because concealed deficiency, see through sometimes and see internal structures such as IC chip or circuit, in the appearance design and not preferred on the safety.In addition, make film, have to make the content of the fine emptying aperture of film inside or Chinese white very many, reductions such as film strength in order to make optical concentration surpass above-mentioned scope ground.

Also have, under the situation that the Biaxially oriented polyester film that uses is in the present invention used as the raw material of white or high hidden FPC or RFID media, most preferably share and cooperate and the non-thermoplastic resin that mixes of mylar the method for the method of the method for formation emptying aperture and cooperation Chinese white.

In the present invention in the Biaxially oriented polyester film of Shi Yonging, except each layer of thermal adhesive layer is that main body constitutes with crystalline polyester preferably.Crystalline polyester resin described herein is the mylar that melting caloric surpasses 20mJ/mg.The assay method of melting caloric is same as described above.

Such crystallinity polyester is aromatic dicarboxylic acid such as polycondensation terephalic acid, isophathalic acid, naphthalene dicarboxylic acids or its ester and ethylene glycol, diethylene glycol, 1 in the proper ratio, ammediol, 1, glycol such as 4-butanediol, neopentyl glycol and the polyester made.These polyester are except the direct polymerization that makes the direct reaction of aromatic dicarboxylic acid and glycol, after Arrcostab that can also be by making aromatic dicarboxylic acid and glycol carry out ester exchange reaction, carry out the ester-interchange method of polycondensation or the method for two diol ester polycondensations and so on of aromatic dicarboxylic acid is made.

As the typical example of above-mentioned crystallinity polyester, can enumerate PETG, polytrimethylene phthalate ester, polybutylene terephthalate (PBT) or polyethylene-2,6-naphthoic acid ester.Above-mentioned polyester can be homopolymers, also can be the polyester with the 3rd composition copolymerization.Assign to for the three one-tenth reduce under the situation of crystalline resin by combined polymerization in use, in the operation of heat bonding, the distortion of appropriateness takes place, can relax the concavo-convex situation that is apparent in product surface at antenna loop or integrated circuit.

[manufacture method of RFID media]

In the manufacture method of RFID media of the present invention, stacked when at first will roll out with a plurality of reticulated film that the roller shape is reeled.In the normally used manufacturing that utilizes mold pressing procedure in the past, with operating sheet stacked base film, but in the method for the invention, use net (web) the shape base material of reeling, therefore with the roller shape, increase substantially operability, and, also do not need the substrate sheets group is kept flat required wide site of storage, in keeping or operation, cause that goods caves in, or the risk of sneaking into foreign matter etc. between piecemeal is also little, can alleviate numerous and diverse degree of operation significantly.

At this, with the use of introducing sheet of the present invention as stacked reticulated film, stacked other resin sheets or film come bonding.This resin sheet and film be so long as be wound as the continuous netted material of roller and just do not limit especially, from the thermal endurance or the viewpoints such as resistance to chemical reagents, environment adaptability of RFID media, and preferred Biaxially oriented polyester film.In addition, in Biaxially oriented polyester film, also, preferably use white polyester film,, more preferably contain the white polyester film of fine emptying aperture from aspects such as resiliency or light weight, flexibility, notes from the aspect of disguise or appearance design.

In addition; introduce sheet and form the state that antenna loop or wire coil, IC chip stretch out usually; therefore; the thermal adhesive layer that use will be used in FPC of the present invention is laminated in the film on surface, also is preferred execution mode with the situation that thermal adhesive layer and the opposed form of these circuit is stacked with protecting these.Thermal adhesive layer can easily be out of shape in the heat lamination operation, effectively mitigation circuits or chip cause concavo-convex, can make rakish card or label thus.

Also have, in the present invention, from the viewpoint of the high speed of processing, preferred lamination adhesive sheet etc. not, as with the layer of antenna loop adjacency, under the situation of lamination adhesive layer, cause the inequality of electrical characteristics, therefore not preferred.

In addition, in the manufacture method of RFID media of the present invention, utilize the stacked roller bonding process do not have mold pressing procedure, carry out heat lamination continuously and bonding by the above-mentioned a plurality of reticulated film that roll out.

Bonding preferred at this stacked roller that carries out by guiding in a pair of above stacked a plurality of reticulated film of stacked roller of heating, utilize the temperature pressure dressing more than the softening temperature of thermal adhesive layer to carry out.In the present invention, as the thermal bonding film, use Biaxially oriented polyester film to carry out, therefore, it is next bonding to be heated to be the high fully temperature of specific heat bonding temp, compares with the known method in the past of stacked not drawing sheet group, can be at high temperature bonding with high speed.

As being used to carry out stacked warm-up mill, not limiting especially, but, preferably use silicone rubber the same heat-resistant resin roller or metallic roll in order to alleviate the bonding of thermal adhesive layer.In addition, for minute surface fine finishining thermal adhesive layer, the also preferred roller that uses the metallic roll of mirror finish or utilize plating such as evanohm.

As carrying out bonding temperature, used under the situation of thermal adhesive layer of mylar system, need under than the high temperature of its vitrification point, carry out, preferably, under the situation of carrying out more than 90 ℃, enhance productivity and adhesive strength to carry out more than 70 ℃, therefore, more preferably.

In addition, in the present invention, important aim be the to be fully used RFID media of characteristic (thermal endurance or resistance to chemical reagents, dimensional stability etc.) of Biaxially oriented polyester film, therefore, needing bonding temp is low-melting temperature than polyester film, more particularly, more preferably to carry out below 200 ℃, more preferably to carry out below 160 ℃.Under the situation about heating surpassing these temperature, except the characteristic of losing above-mentioned film, deformation of thin membrane, or change on the tension force of the film in conveying, or on the RFID media of making, batch, therefore, not preferred.

Heat by stacked roller and by pressure dressing in the reticulated film of carrying out carrying when stacked, but under the situation about only heating sharp with pair of rolls, occurrence temperature is uneven or follow its bonding inequality, distortion, also preferably preheating before importing stacked roller sometimes.The method of carrying out this preheating does not limit especially, but when passing through successively except the roller that makes heating, makes outside the method that film temperature rises, and can also utilize and use the noncontact heater of hot blast or infrared ray etc. to carry out preheating.From the simplicity aspect of manufacturing installation, preferably will utilize the preheating of warm-up mill, the distortion of RFID media prevent or the minimizing of disqualification rate on, preferably utilize the method for noncontact heater.

The reticulated film of carrying to stacked roller prevents batching of the card made or label, and therefore, preferably after preheating, to remain the state on plane, stacked roller leads.For example,, use under the situation of ployester series film, preferably after roughly 70 ℃ below remain lower than its vitrification point rolls out, carry out stacked planely as reticulated film.

In addition, manufacturing method according to the invention can be reeled the netted non-individual body that utilizes the RFID media of stacked roller heat bonding and be taken care of, or operate as can be known with the roller shape.But, the duplexer of caking is not cooled off fully and be wound as under the situation of roller shape, after severing, during use, indeterminable batching taken place sometimes.In order to prevent this batching, preferably after stacked, remove before the tension force, keep cooling fully under the original state on plane.The target temperature of cooling depends on appointed condition etc., therefore, cannot treat different things as the same, but as reticulated film, uses under the situation of Biaxially oriented polyester film, requires to be cooled to roughly below 70 ℃, more preferably is cooled to below 50 ℃, more preferably is cooled to room temperature.

Preferably the reticulated film of carrying is applied the tension force of controlling in order to keep flatness and keep when stacked.As the tension force that applies this moment, from the viewpoint that flatness keeps, more than the preferred 1N/m, more preferably more than the 10N/m.In addition, from the strain that prevents film even the viewpoint of batching of IC-card or label, below the preferred 1KN/m, more preferably below the 200N/m.

In addition, to batch in order control positively, to improve the flatness of IC-card or IC tag, also can on the heating-up temperature on two sides difference be set when stacked, its result obtains plane earth and regulates.Batch under the situation about producing owing to the thermal expansion of carrying on the back the film of fitting at table, the heating-up temperature that preferably result is become the inboard face of reeling is set lowly and stacked with respect to opposing face.

In addition, the preferred 0.1～20MPa of the pressure during heat lamination, more preferably 0.3～10MPa.Under the situation of pressure when heat lamination less than 0.1MPa, the flatness of card or label is insufficient, can not get beautiful outward appearance.On the other hand, the pressure when heat lamination surpasses under the situation of 20MPa, even use to contain the thermal bonding polyester film of emptying aperture polyester film as base material, resiliency that it is superior or concavo-convex absorbefacient effect are also owing to high pressure diminishes.Its result, the burden that puts on the loop of IC chip etc. becomes excessive, and electric fault takes place easily.

The RFID media of Zhi Zaoing one of preferred embodiment is to use that (apparent density is 0.7～1.3g/cm with the Biaxially oriented polyester film that the emptying aperture film is a base material that contains that contains a large amount of fine emptying apertures in film inside in the present invention ³), apparent density is made as 0.7g/cm ³More than and less than 1.3g/cm ³The RFID media.The lower limit of this apparent density is 0.8g/cm more preferably ³, and then preferred 0.9g/cm ³On the other hand, more preferably 1.2g/cm of the upper limit of the card or the apparent density of label ³, and then preferred 1.1g/cm ³In addition, in this apparent density less than 0.7g/cm ³Situation under, the intensity of RFID media or resistance to bend(ing), compression recovery reduce, and can not get suitable mechanical property when adding man-hour or using.On the other hand, the apparent density at card or label is 1.3g/cm ³Under the above situation, can not get light weight or flexibility as the RFID media.In addition, apparent density is made as 0.7g/cm ³More than and less than 1.3g/cm ³The RFID media when heavy water accident, keep afloat, or during till the sinking, can access the time of reclaiming fully.Therefore, the card of the manner for example is suitable as its information of personal record, the registration card of the daily personal information that portably uses.

[embodiment]

Secondly, by embodiment and comparative example, illustrate in greater detail being closely connected of technology important document of the present invention and effect.Also have, use following method, estimated the characteristic value that uses in the present invention.

[evaluation method]

(1) fusing point of resin and vitrification point

" the conversion temperature assay methods of plastics " by record among the JIS K 7121 have carried out DSC mensuration.With regard to sample, use: use is had the slicing machine (Mikrotom) of magnifying glass, and the about 10mg of small pieces that has cut thermal adhesive layer from film is sealed in aluminum pot, 300 ℃ of following fusions 30 minutes, with the diaphragm of liquid nitrogen quenching.In analyzer, use differential scanning calorimeter (Seiko instrument company system, EXSTAR6200DSC), under dry nitrogen atmosphere, implement.From room temperature with the heating of 10 ℃/minute speed, obtained the intermediate point vitrification point after, obtained fusion peak temperature (fusing point).

(2) melting caloric of resin

By " the critical heat quantity measuring methods of plastics " of record among the JIS K 7122, obtained melting caloric.The details that DSC measures is identical with above-mentioned Measurement of melting point.

(3) intrinsic viscosity of mylar

By put down in writing among the JIS K 7367-5 " used plastics-capillary type densimeter the polymer dilute solution viscosity the method for obtaining-", use phenol/1,1,2,2-tetrachloroethanes (60/40; Mass parts) mixed solvent is measured under 30 ℃.

(4) average grain diameter of particle

Observe particle with scanning electron microscope (Hitachi, S2500),, suitably change multiplying power, it is taken pictures, and amplify copy according to the size of particle.Secondly, about the particle more than at least 200 of random selection, described the periphery of each particle.Utilize image analysis apparatus, describe picture by these and measure circles of particle diameter that matches, with those mean value as average grain diameter.

(5) film thickness

By " foamed plastic-film and the sheet-thickness measuring method " of record among the JIS K 7130, measure.Analyzer has used electronic gauge (horse Shandong corporate system, millibar 1240).Cut 4 of the square films of 5cm from four positions arbitrarily of the film that should measure, each sheet respectively measured 5 points (amounting to 20 points), with mean value as thickness.

(6) the stacked thickness of film

Small pieces have been cut from three positions arbitrarily of the film that should measure.Use slicing machine, cut this small pieces, made film section with the film surface quadrature.To this section sputter platinum-nickel alloys, as sample, use scanning electron microscope (Hitachi, S2500), checked section.The suitable multiplying power that is included in a visual field with overall film thickness is observed, and has measured the thickness of each layer.Mensuration is to carry out with three places in each visual field, adopts the mean value that amounts to 9 places, as mensuration thickness.

(7) apparent density of film

About from 5 in the square sample of 5 100mm that cut arbitrarily, measure by " mensuration of foamed plastic and rubber-apparent density " of record among the JIS K 7222.Mensuration is at room temperature to carry out, and adopts mean value, as apparent density.Also have, easy in order to make mark, unit conversion is g/cm ³

(8) value of batching of film

For the film that should measure, cut out from the 3 operation sheets of sentencing long side direction 100mm, Width 50mm arbitrarily, under the state of no loading, carrying out heat treated under 110 ℃ after 30 minutes, the protuberance of film towards the below, is being statically placed on the glass plate of level, vertical range for the lower end of four jiaos of the films of glass plate and rising, with minimum scale 0.5m unit, use scale to measure, with the mean value of the measured value at this 4 place as the value of batching.About 3, measure, with its mean value as the value of batching.

(9) shape of film is given the gradient of rate and shape assigning unit outer rim

FPC about making has cautiously peeled off the bonding plane between loop and the thermal adhesive layer.In the release surface of this thermal adhesive layer, select the part of interface peel, the step of the impression in loop is included in the visual field, obtained the image of 3D shape in the same manner with above-mentioned (5).By the section analytical capabilities of same software, obtained section shape profile with the step quadrature of impression.Obtain the degree of depth of impression by this profile,, obtained shape and given rate divided by the height in original loop based on the printing loop.In addition, in the peripheral edge portion of impression,, obtain gradient (comprising the step central portion, the gradient in about 1/3 part of step), as the gradient of shape assigning unit outer rim about arrive the step of non-impression portion from impression portion.Also have,, observe, estimated the mean value that amounts to 15 profiles for three visuals field.

(10) optical concentration of film and light penetration

Use to see through optical concentration meter (mark's bass company, RD-914), measured the optical concentration under the white light.About from 5 in the square sample of 5 50mm that cut arbitrarily of the sample that should measure, measure, with its mean value as optical concentration.

(11) confficient of static friction of FPC

" test method of foamed plastic-film and sheet-coefficient of friction " by record among the JIS K 7125 measured.Analyzer has used pulling test machine (Shimadzu Seisakusho Ltd.'s system, AG1KNI).Make the table back of the body two sides of the FPC sample that should measure opposed, the loading that slide is applied is made as 1500g, and the mean value that amounts to 5 times is made as confficient of static friction.

(12) peel strength of FPC

About FPC or the metal foil laminated body of making, utilize the method for JIS X 6305-1 to measure the peel strength of metal forming and film.Also have, in an embodiment, peeling off in bonding interface do not taken place and film substrate destroys is labeled as " material damage ", is judged as sufficient bonding force (peel strength).

(13) outward appearance of FPC or RFID media

With visual, the FPC of making or the outward appearance of RFID media have been estimated.Observation to the residual or wrinkle of the bubble of bonding plane, significant perk, wave (flatness), integrated circuit etc. cause concavo-convex, do not have be made as " well " of obstacle, no problem being made as " bad " in appearance design in the practicality.

(14) thermal endurance of FPC or RFID media

The FPC that makes or RFID media are statically placed on cleaning and the smooth stainless-steel sheet (SUS304, thickness 0.8mm), use baking box, under air atmosphere, 110 ℃ down heating kept 24 hours.With visual, estimated the test portion outward appearance (loss of gloss or variable color, dimness, crack, distortion, fusion, deposited) before and after the heating, what will not find differences before and after heating is made as zero, for what find differences, according to degree, be made as △ or *.

(15) the defective item generation rate of RFID media

About the RFID media of making, use the big Mo Jite of RF-ID (Omron software company system, L720-H01T-W001), carried out communication test.About 50 marks or card, estimate, obtained the generation rate of the defective item that can communicate by letter.The defective item generation rate is made as zero less than 1% situation, will be made as △ more than 1% and less than 5% situation, the situation more than 5% is made as *.

(16) inequality of the communication distance of IC-card or IC tag

About IC tag or the IC-card of making, use the big Mo Jite of RF-ID (Omron software company system, L720-H01T-W001), carried out communication test.With the keeper of nonmetal system, keep the end of 10 labels or card, from the close gradually communication antenna of the distance beginning of about 50cm, measured the longest distance of identification.The communication distance of Unidentified situation has been obtained average communication distance and inequality by the situation of farthest identification and the most nearby.

The material resin of Shi Yonging and female particle are as described below in an embodiment.

[PETG (PET resin)]

Used intrinsic viscosity to be 0.62dl/g, Sb content is 144ppm, and Mg content is 58ppm, and P content is 40ppm, is substantially devoid of the pet resin of inert particle and inner precipitation particles.

[PEN (PEN resin)]

Used intrinsic viscosity to be 0.63dl/g, Sb content is 250ppm, and Mg content is 58ppm, and P content is 40ppm, is substantially devoid of the PEN resin (PEN resin) of inert particle and inner precipitation particles.

[amorphous polyester resin]

Amorphous polyester resin A1: used diol component to be ethylene glycol/neopentyl glycol=70/30 mol ratio, intrinsic viscosity is 0.62dl/g, and Sb content is 150ppm, and Mg content is 60ppm, and P content is the combined polymerization pet resin of 40ppm.In the analysis based on the DSC device of this resin, do not observe fusing point, vitrification point is 74 ℃.

Amorphous polyester resin A2: used the dicarboxylic acids composition to be terephalic acid/naphthalene dicarboxylic acids=60/40 mol ratio, intrinsic viscosity is 0.62dl/g, Sb content is 150ppm, Mg content is 60ppm, P content is 40ppm, contains the combined polymerization pet resin of the amorphous silica particle 500ppm of 1.5 μ m.In the analysis based on the DSC device of this resin, do not observe fusing point, vitrification point is 98 ℃.

Amorphous polyester resin A3: used the dicarboxylic acids composition to be terephalic acid/decanedioic acid=90/10 mol ratio, diol component is ethylene glycol/neopentyl glycol=90/10 mol ratio, intrinsic viscosity is 0.62dl/g, Sb content is 150ppm, Mg content is 60ppm, and P content is the combined polymerization pet resin of 40ppm.In the analysis based on the DSC device of this resin, do not observe fusing point, vitrification point is 52 ℃.

[containing the preparation that emptying aperture forms the female particle of agent]

Polystyrene resin (Japanese polystyrene corporate system, G797N) the 20 quality % of melt turnover 1.5, gas phase polymerization acrylic resin (bright dipping petrochemistry corporate system, F300SP) the 20 quality % of melt turnover 3.0 and polymethylpentene resin (Mitsui Chemicals corporate system, TPX DX820) the 60 quality % of melt turnover 180 are mixed with particle; extrude to biaxial extruder; mixing fully; with tow cooling, cut off, regulated and contain emptying aperture and form the female particle of agent.

[containing the preparation of the female particle of titanium oxide]

To mix the material of the anatase titanium dioxide 50 quality % of average grain diameter 0.3 μ m (electron microscope method) in above-mentioned pet resin 50 quality % supplies with to the aeration type biaxial extruder, prepare mixing after, molten polymer is supplied with continuously to ventilation (vent) formula single shaft mixing roll, carry out mixingly, regulated and contain the female particle of titanium oxide.

[preparation of the female particle of the content of wax]

The material that the above-mentioned amorphous polyester resin A1 of 95 quality % and the Tissuemat E of 5 quality % (105 ℃ of Mitsui Chemicals corporate systems, high wax NL500, fusing point) mix is supplied with to the aeration type biaxial extruder, and preparation is mixing down at 285 ℃.This molten polymer is supplied with continuously to the single shaft extruder, carried out mixingly, regulated the female particle W1 of the content of wax.

The material that the above-mentioned amorphous polyester resin A1 of 80 quality % and the polyethylene glycol of 20 quality % (56 ℃ of Dong Bang chemical company systems, PEG10000, fusing point) mix is supplied with to the aeration type biaxial extruder, and preparation is mixing down at 270 ℃.This molten polymer is supplied with continuously to the single shaft extruder, carried out mixingly, regulated the female particle W2 of the content of wax.

(embodiment 1)

[manufacturing of thermal bonding Biaxially oriented polyester film]

To comprise 8 quality % above-mentioned contain that emptying aperture forms female particle of agent and 8 quality % above-mentioned contain the female particle of titanium oxide, and the mixture of the above-mentioned PET resin of 84 quality % as raw material M.In addition, will comprise the above-mentioned amorphous polyester resin A1 of 80 quality % and random isotactic polystyrene resin (Japanese polystyrene corporate system, the G797N of 10 quality %; 95 ℃ of vitrification points), the mixture of the female particle W1 of the content of wax is as raw material C.

With raw material M and raw material C vacuumize to moisture rate 80ppm, supply with to other extruder respectively, make its fusion, the guide feeding device structure, the stacked thermal adhesive layer that forms by raw material C in the two sides of the intermediate layer that forms by raw material M (base material) utilize feed mechanism to engage after, upward extrude to the cold wind drum that is adjusted to 20 ℃ from the T pattern, made the non-stretched film of the three-decker of thickness 2.4mm with film like.Also have, when non-stretched film is made, be adjusted to 20 ℃ cold wind, cool off to the opposing face injection of drum cooler.

Use warm-up mill, the non-stretched film that obtains is heated to be 70 ℃ equably, and then, use infrared heater, film temperature is become when 95 ℃ heating, between roller, utilize speed difference, longitudinally be stretched as 3.4 times.The two ends that utilize anchor clamps to keep the vertical single ax oriented film obtain like this after making film surface temperature become about 100 ℃ of ground to utilize hot-air pre-heating, when being heated to about 140 ℃, are 3.8 times along cross directional stretch.Then, under the state that thin-film width is fixing, utilize dry-heat air, be heated to about 230 ℃, carry out heat fixation, when being cooled to about 200 ℃, on Width, carried out 5% slow heat treatment.Then, cool off lentamente, 45 ℃ the state that the surface temperature of film becomes the temperature lower fully than the vitrification point of thermal adhesive layer excises the film end down, secondly, film is reeled with the roller shape.

By above method, obtained the thermal bonding polyester film of thickness 200 μ m.Also have, observed the result of film section with scanning electron microscope, the thickness of each layer (thermal adhesive layer Aa/ intermediate layer (base material)/thermal adhesive layer Ab) is about 20/160/20 (unit: μ m).

[manufacturing of flexible printed circuit board]

Use the thermal bonding Biaxially oriented polyester film that obtains in above-mentioned,, made FPC by following method.

At first, the roller of the film that obtains in above-mentioned is chopped up processing, obtained the roller of the reticulated film of width 400mm, coiling length 100m.On the one side of this film, stacked when rolling out the aluminium foil (1N30-O, thickness 20 μ m) of same widths from roller, it is bonding to have implemented heat lamination.

The schematic diagram of stacked bonding process illustrates in Fig. 1 as used herein.

To pass through guide roller from the netted thermal bonding Biaxially oriented polyester film that roller rolls out, leading with 10m/ minute speed is heated to be the preheat roll of 100 ℃ of surface temperatures, carries out preheating when tension adjustment is 20N/m.On the other hand, aluminium foil by guide roller, is rolled out when tension adjustment is 50N/m, utilize to be heated to be 160 ℃ stacked roller, stacked above-mentioned thermal bonding polyester film has carried out stacked bonding.Netted duplexer after stacked is through the cooling in the chill roll of 20 ℃ of aerial heat radiation and surface temperatures, be cooled to 40 ℃ of surface temperatures after, by guide roller, reel with the roller shape.

Secondly, the aluminium foil on this duplexer surface of etching has formed antenna loop.

At first, on aluminium foil surface, use ultraviolet hardening etching resist China ink liquid (Japan's textile company system, ER225N), printed circuit design continuously, irradiation (500mJ/cm ²) ultraviolet ray, make black liquid-solidization.Use aqueous sodium carbonate (1 quality %), after resist is developed, utilize the ferric chloride in aqueous solution (39 quality %) that has added hydrochloric acid to carry out etching, utilize sodium hydrate aqueous solution (3 quality %) to clean, removed resist layer.After its washing,, obtained FPC at 140 ℃ of following continuous dryings.

[introducing the manufacturing of sheet and RFID media]

Use has been made the introducing sheet by the above-mentioned FPC that obtains.That is,,, use dielectric ink liquid (Japan's textile company system, SR610C) and conductive ink liquid (Japan's textile company system, DW545), printed the cross-over connection loop in the position that its IC should be installed about the netted FPC non-individual body that rolls out from roller.This conductivity China ink liquid as bonding agent, is fixed in RFID on the FPC with IC chip (according to ISO15693,13.56MHz).It is reeled with the roller shape, obtained the RFID media with introducing sheet.

Secondly, use, utilize the heat lamination operation, made the RFID media by the above-mentioned introducing sheet that obtains.The schematic diagram of manufacturing process illustrates in Fig. 2.

To pass through guide roller from the netted introducing sheet that roller rolls out, leading with 10m/ minute speed is heated to be the preheat roll of 120 ℃ of surface temperatures, carries out preheating when tension adjustment is 30N/m.On the other hand, netted contained fine emptying aperture polyester film (Japan's textile company system, Chris are afraid of K2323,250 μ m) by guide roller, roll out when tension adjustment is 30N/m, utilize preheat roll to carry out preheating same as described abovely.These film utilizations are heated to be the two sides that 160 ℃ stacked roller is laminated in above-mentioned introducing sheet, have carried out stacked bonding.Netted RFID media after stacked is through the cooling in the chill roll of 20 ℃ of aerial heat radiation and surface temperatures, be cooled to 40 ℃ of surface temperatures after, by guide roller, reel as RFID media goods roller.Goods roller for the RFID media that obtains utilizes prescriptive procedure, carries out stamping-out processing, has obtained the RFID media (IC-card) of 86mm * 54mm.

(embodiment 2)

The mixture that will comprise the above-mentioned described amorphous polyester resin A2 that contains the female particle of titanium oxide and the above-mentioned PET resin of 35 quality %, 35 quality % of 30 quality % is as raw material M.In addition, (space portion ball is apt to polyethylene corporate system, beautiful Mei Lite 2040F will to comprise the above-mentioned amorphous polyester resin A2 of 85 quality % and the straight chain shape ldpe resin of 15 quality %; 116 ℃ of fusing points) mixture is as raw material C.In addition, the thickness of each layer that change is extruded when making non-stretched film jointly is that the thickness of each layer of thermal adhesive layer Aa/ intermediate layer/thermal adhesive layer Ab is made as 12/26/12 (unit: μ m) with thickness 250 μ m.Other and embodiment have made the thermal bonding Biaxially oriented polyester film in the same manner.

In addition, the surface of the metal foil laminated body that will obtain in the same manner with embodiment 1 is carried out resist and is handled and etch processes, has made 10 width 0.5mm, the multiple bar chart case of 0.4mm at interval.Forming on the metal foil laminated body in this loop, using the stacked operation of Fig. 3, the stacked identical thermal bonding Biaxially oriented polyester film that in base material, uses.

That is, the heating furnace that will lead from the netted metal foil laminated body (mode of FPC) that roller rolls out by utilizing the heating of hot blast, is preheated to 100 ℃ of surface temperatures.In addition, the loop of this metal foil laminated body side surface stacked film.Other and embodiment 1 carry out the stacked of film in the same manner, and loop feature is chopped up with 10mm, have made the flexible flat cable that has disposed polyester film on the two sides in loop.

(embodiment 3)

To comprise that the above-mentioned emptying aperture that contains of 6 quality % forms the mixture of female particle of agent and the above-mentioned PET resin of 94 quality % as raw material M.In addition, will comprise that the mixture of the female particle W2 of the content of wax of the above-mentioned amorphous polyester resin A2 of 87 quality % and the combined polymerization acrylic resin of 3 quality % (138 ℃ of prepolymer corporate system, fusing points), 10 quality % is as raw material C.In addition, the thickness of each layer that change is extruded when making non-stretched film jointly is that the thickness of each layer of thermal adhesive layer Aa/ intermediate layer/thermal adhesive layer Ab is made as 10/100/15 (unit: μ m) with thickness 125 μ m.Other and embodiment have made the thermal bonding Biaxially oriented polyester film in the same manner.

Use has been made FPC at this film that obtains in the same manner with embodiment 1.But, as metal forming, replace aluminium foil, use Copper Foil (CU-JIS C 6515-E2-S-2 specification product, 35 μ m), be provided with the loop at the film surface of thermal adhesive layer Ab layer side.In addition, use, made the RFID media in the same manner with introducing sheet with embodiment 1 at this FPC that obtains.

Secondly, use, utilize the heat lamination operation, made the RFID media by the above-mentioned introducing sheet that obtains.The schematic diagram of manufacturing process illustrates in Fig. 4.

To pass through guide roller from the netted introducing sheet that roller rolls out, and be heated to be between the infrared heater of 300 ℃ of surface temperatures with 10m/ minute speed guiding, preheating was 100 ℃ of surface temperatures when tension adjustment was 30N/m.On the other hand, the netted fine emptying aperture polyester film (Japan's textile company system, Chris are afraid of K2323,50 μ m) that contains is passed through guide roller, when being 10N/m, tension adjustment rolls out, utilization is heated to be 160 ℃ stacked roller, be laminated in the two sides that above-mentioned heat is introduced sheet, carried out stacked bonding.Netted RFID media after stacked is through the cooling in the chill roll of 20 ℃ of aerial heat radiation and surface temperatures, be cooled to 40 ℃ of surface temperatures after, by guide roller, reel as RFID media goods roller.After having implemented adhesion processing for the one side of this RFID media, carry out stamping-out processing, obtained the RFID media (IC-card) of 120mm * 54mm.

(embodiment 4)

To comprise that the above-mentioned emptying aperture that contains of 15 quality % forms the mixture of female particle of agent and the above-mentioned PET resin of 85 quality % as raw material M.In addition, will comprise that the mixture of the female particle W1 of the content of wax of the above-mentioned amorphous polyester resin A3 of 88 quality % and the cyclic polyolefin resin of 6 quality % (70 ℃ of Mitsui Chemicals corporate systems, APL8008T, vitrification point), 6 quality % is as raw material C.In addition, the thickness of each layer that change is extruded when making non-stretched film jointly is that the thickness of each layer of thermal adhesive layer Aa/ intermediate layer/thermal adhesive layer Ab is made as 15/220/15 (unit: μ m) with thickness 125 μ m.Other and embodiment have made the thermal bonding Biaxially oriented polyester film in the same manner.

Secondly, in one side by the above-mentioned film that obtains, with the stacked in the same manner Copper Foil of embodiment 3, made metal foil laminated body after, carried out resist in the same manner with embodiment 2 and handled and etch processes.And then, carry out the tin plating at the loop of the metal foil laminated body that has formed loop side surface and handle, made flexible flat cable (mode of FPC).

(embodiment 5)

Only with above-mentioned PET resin as raw material M.In addition, will comprise that the mixture of the female particle W1 of the content of wax of straight chain shape ldpe resin, 20 quality % of random isotactic polystyrene resin, the 5 quality % of the above-mentioned amorphous polyester resin A1 of 70 quality % and 5 quality % is as raw material C.In addition, the thickness of each layer that change is extruded when making non-stretched film jointly is that the thickness of each layer of thermal adhesive layer Aa/ intermediate layer/thermal adhesive layer Ab is made as 20/40/20 (unit: μ m) with thickness 80 μ m.Other and embodiment have made the thermal bonding Biaxially oriented polyester film in the same manner.Other and embodiment 1 have made FPC, have introduced sheet and RFID media (IC-card) in the same manner.

(embodiment 6)

The above-mentioned emptying aperture that contains that will comprise 8 quality % forms the mixture of above-mentioned PEN resin of female particle of agent and 92 quality % as raw material M.In addition, will comprise that the mixture of random isotactic polystyrene resin, the female particle W1 of the content of wax of the above-mentioned amorphous polyester resin A2 of 80 quality % and 10 quality % is as raw material C.

With raw material M and raw material C vacuumize to moisture rate 80ppm, supply with to other extruder respectively, make its fusion, the guide feeding device structure, the stacked thermal adhesive layer that comprises raw material C in the two sides of the intermediate layer that comprises raw material M (base material) utilize feed mechanism to engage after, upward extrude to the cold wind drum that is adjusted to 20 ℃ from the T pattern, made the non-stretched film of the three-decker of thickness 2.4mm with film like.Also have, when non-stretched film is made, be adjusted to 20 ℃ cold wind, cool off to the opposing face injection of drum cooler.

Use warm-up mill, the non-stretched film that obtains is heated to be 100 ℃ equably, and then, use infrared heater, film temperature is become when 120 ℃ heating, between roller, utilize speed difference, longitudinally be stretched as 3.0 times.The two ends that utilize anchor clamps to keep the vertical single ax oriented film obtain like this after making film surface temperature become about 140 ℃ of ground to utilize hot-air pre-heating, when being heated to about 170 ℃, are 3.4 times along cross directional stretch.Then, under the state that thin-film width is fixing, utilize dry-heat air, be heated to about 240 ℃, carry out heat fixation, when being cooled to about 200 ℃, on Width, carried out 5% slow heat treatment.Then, cool off lentamente, the surface temperature of film becomes than after the low fully temperature of the vitrification point of thermal adhesive layer, and secondly, reel film excision film end with the roller shape.

Use is by the above-mentioned film that obtains, with embodiment 3 in the same manner, made FPC, introduced sheet and RFID media (IC tag).

(comparative example 1)

The above-mentioned emptying aperture that contains that will comprise 8 quality % forms the mixture of the above-mentioned PET resin that contains female particle of titanium oxide and 84 quality % of the female particle of agent, 8 quality % as raw material M.In addition, will comprise that the mixture of acrylic resin of the above-mentioned amorphous polyester resin A1 of 95 quality % and 5 quality % is as raw material C.Other and embodiment 1 have made FPC, have introduced sheet and RFID media (IC-card) in the same manner.

(comparative example 2)

The mixture of the above-mentioned above-mentioned PET resin that contains female particle of titanium oxide and 70 quality % that will comprise 30 quality % is as raw material M.In addition, will comprise that the mixture of random isotactic polystyrene resin of the above-mentioned amorphous polyester resin A2 of 94 quality % and 6 quality % is as raw material C.Other and embodiment 2 have made flexible flat cable (mode of FPC) in the same manner.

(comparative example 3)

In the one side that does not contain the transparent Biaxially oriented polyester film of fine emptying aperture (Japan's textile company system, Ke Simo refreshing A4300, thickness 100 μ m), layered manner is extruded in utilization, coating hot-melt adhesive (Japan's textile company system, Bai Yilong GM920), having made the thickness (thermal adhesive layer Aa/ intermediate layer (base material)/thermal adhesive layer Ab) with each layer is about 10/100/15 (unit: the Biaxially oriented polyester film of bond layer μ m).

The coefficient of friction of this film is big, and in addition, the surface is level and smooth significantly, therefore, is difficult to utilize the heat lamination of metal forming of roller bonding.Therefore, by known punching press adherence process in the past, made FPC.That is, with above-mentioned film cut out into 30cm square after, be layered in the Copper Foil that embodiment 3 uses at described thermal adhesive layer Ab layer side surface, with Teflon (registered trade mark) sheet protection upper and lower surface, it is bonding to utilize hot pressing (140 ℃, 0.3MPa, 10 minutes) to carry out.About this metal foil laminated body, in the batch operation, implement resist processing and the etch processes identical with embodiment 1, made FPC.

Secondly, use this FPC, made introducing sheet and RFID media.Promptly, about above-mentioned FPC, with embodiment 1 in the same manner, made the introducing sheet after, contain emptying aperture polyester film (Japan's textile company system, Chris are afraid of K2323,50 μ m) in the two sides configuration of introducing sheet, it is bonding to utilize hot pressing (140 ℃, 0.3MPa, 10 minutes) to carry out.Other and embodiment 3 have obtained RFID media (IC tag) in the same manner.

(comparative example 4)

Stacked when enumerating the transparent Biaxially oriented polyester film (Japan's textile company system, E5000, thickness 250 μ m) that do not contain fine emptying aperture and above-mentioned aluminium foil from roller, it is bonding to have implemented heat lamination.That is, use the stacked bonding process of Fig. 3, will pass through guide roller from the netted transparent Biaxially oriented polyester film that roller rolls out, leading with 10m/ minute speed is heated to be the hot baking box of 180 ℃ of temperature, when tension adjustment is 5N/m, has carried out preheating.On the other hand, aluminium foil by guide roller, is rolled out when tension adjustment is 10N/m, utilize the folded roller of Teflon (registered trade mark) preparative layer that is heated to be 290 ℃, stacked above-mentioned Biaxially oriented polyester film has carried out stacked bonding.Netted duplexer after stacked is through the cooling in Teflon (registered trade mark) the system chill roll of 60 ℃ of aerial heat radiation and surface temperatures, be cooled to 40 ℃ of surface temperatures after, by guide roller, reel with the roller shape.

About the metal foil laminated body that obtains, implement resist processing, etch processes and the tin plating processing identical with embodiment 4, made flexible flat cable (mode of FPC).

(comparative example 5)

To comprise 10 quality % above-mentioned contain the female particle of titanium oxide, and the mixture of the above-mentioned amorphous polyester resin A of 90 quality % as raw material M.This raw material M vacuumize to moisture rate 80ppm, is supplied with to an extruder.This prepared using extruder inside is heated to 280 ℃, after the melting mixing, extrudes to the drum cooler that is adjusted to 20 ℃, made the amorphism white polyester resin sheet (thickness 0.3mm) that does not stretch from the T pattern.Also have, spray to the opposing face of drum cooler and be adjusted to 20 ℃, the cold wind of relative humidity 30%, cool off.

The thermal endurance of the sheet that obtains is insufficient, therefore, can not the time apply sufficient tension force in heating, is difficult to utilize the heat lamination of the metal forming of roller.Therefore, with comparative example 3 in the same manner, utilize known in the past punching press adhesion (ヒ one トプレス) method, in the batch operation, made FPC, introduced sheet, RFID media (IC tag).

(comparative example 6)

One side containing emptying aperture polyester film (Japan's textile company system, Chris are afraid of 1212, thickness 100 μ m) will contain the epoxy polyester polyurethane adhesive with 3g/m ²Thickness coating after, when rolling out above-mentioned aluminium foil from roller, in series-operation, it is stacked bonding to have carried out dry type.In addition, about this metal foil laminated body, with embodiment 1 in the same manner, made FPC and introduced sheet.Secondly, about by the above-mentioned introducing sheet that obtains, use above-mentioned bonding agent, it is stacked bonding to carry out dry type, has made the RFID media.

That is, the loop side surface at the netted introducing sheet that rolls out from roller will contain the epoxy polyester polyurethane adhesive with 3g/m ²Thickness coating after, roll out nettedly when containing fine emptying aperture polyester platinum (Japan's textile company system, Chris are afraid of 2323,250 μ m) from roller, dry type is stacked bonding, has made RFID media (IC-card).

The structure and the characteristic of the thermal bonding Biaxially oriented polyester film that will obtain at the foregoing description and comparative example are illustrated in the table 1, will use the characteristic of its FPC that obtains and RFID media to be illustrated in the table 2.

The disqualification rate of FPC that in embodiment 1～6, obtains and RFID media and communication distance uneven little, the outward appearance of goods, superior for heat resistance.In addition, as reticulated film, can process continuously, productivity ratio is superior.

On the other hand, in comparative example 1 and 2, the smooth property between film and the metal forming is insufficient, therefore, when metal foil laminated, produces fine wrinkle, in the problem that produced in appearance of goods.In addition, cause disqualification rate also high thus, the not properly situation generation that the inequality of communication distance is also big.

In addition, in comparative example 3, the smooth property between film and the metal forming is poor, therefore, produces significant wrinkle and bubble, can not unavoidably utilize the bonding of punching press adherence process adherence process by the continuous stacked goods of making.Therefore, not only productivity ratio is low, and disqualification rate is also big.And then because the uneven thickness of hot-melt adhesive layer, it is big that the inequality of communication distance becomes.

In addition, in comparative example 4, in the lamination process operation after the loop forms, film generation thermal deformation, the forfeiture flatness has taken place to batch or bad order such as wrinkle at FPC.This be because, when making metal foil laminated body by heat lamination is bonding, the thin layer fusion, substrate layer becomes and does not have the non-crystalline polyester sheet basically.

In addition, in comparative example 5, substrate layer uses the non-crystalline polyester sheet that does not have orientation basically.Therefore, be difficult under the state that has applied tension force, heat, and heat lamination, can not be by the continuous stacked goods of making.Therefore, used the punching press adherence process, but in utilizing punching press adherence process bonding, speed of production is low, can't reduce disqualification rate.

In the manufacturing process of comparative example 6, big problem does not take place.Yet, need be the method that on numerous and diverse degree of environment adaptability or flow chart, should improve therefore through the stacked processing of dry type of twice use solvent.Also have, the thickness of bond layer is insufficient, and the concavo-convex absorbability of integrated circuit or antenna loop is insufficient, and its result needs to improve on the inequality of the outward appearance of goods and communication distance.

[table 1]

[table 2]

Ellipsis in the table is as described below.PS: random isotactic polystyrene resin, PP: acrylic resin, LLDPE: straight chain shape ldpe resin, COC: cyclic polyolefin resin, PE: Tissuemat E, PEG: polyethylene glycol, Al: aluminium foil, Cu: Copper Foil.

(embodiment 7)

Use warm-up mill, the non-stretched film that will obtain in embodiment 1 is heated to be 70 ℃ equably, and then, use infrared heater, film temperature is become when 95 ℃ heating, between roller, utilize speed difference, longitudinally be stretched as 3.4 times.On the surface of the vertical single ax oriented film that obtains like this, with urethane resin 1 (big Japanese ink chemical company system, HW-345; 95 ℃ of softening temperatures, nonvolatile component 25%, viscosity 14mPas) make wet coating amount become 20g/m ²The ground coating, dry 30 seconds down at 80 ℃.After coating, the two ends that utilize anchor clamps to keep the vertical single ax oriented film after making film surface temperature become about 100 ℃ of ground to utilize hot-air pre-heating, when being heated to about 140 ℃, are 3.8 times along cross directional stretch.Then, under the state that thin-film width is fixing, utilize dry-heat air, be heated to about 230 ℃, carry out heat fixation, when being cooled to about 200 ℃, on Width, carried out 5% slow heat treatment.Then, cool off lentamente, 45 ℃ the state that the surface temperature of film becomes the temperature lower fully than the vitrification point of thermal adhesive layer excises the film end down, secondly, film is reeled with the roller shape, obtain the thermal bonding polyester film of thickness 200 μ m, with embodiment 1 in the same manner, made flexible printed circuit board, introduced sheet and RFID media.

(embodiment 8～12, and comparative example 8,9)

With embodiment 7 in the same manner, use warm-up mill, the non-stretched film that will obtain in embodiment 2～6 and comparative example 2,3 is heated to be 70 ℃ equably, and then, use infrared heater, film temperature is become when 95 ℃ heating, between roller, utilize speed difference, longitudinally be stretched as 3.4 times.On the surface of the vertical single ax oriented film that obtains like this, with urethane resin 1 (big Japanese ink chemical company system, HW-345; 95 ℃ of softening temperatures, nonvolatile component 25%, viscosity 14mPas) make wet coating amount become 20g/m ²The ground coating, dry 30 seconds down at 80 ℃.After coating, the two ends that utilize anchor clamps to keep the vertical single ax oriented film after making film surface temperature become about 100 ℃ of ground to utilize hot-air pre-heating, when being heated to about 140 ℃, are 3.8 times along cross directional stretch.Then, under the state that thin-film width is fixing, utilize dry-heat air, be heated to about 230 ℃, carry out heat fixation, when being cooled to about 200 ℃, on Width, carried out 5% slow heat treatment.Then, cool off lentamente, 45 ℃ the state that the surface temperature of film becomes the temperature lower fully than the vitrification point of thermal adhesive layer excises the film end down, secondly, film is reeled with the roller shape, obtain the thermal bonding polyester film of thickness 200 μ m, with embodiment 1 in the same manner, made flexible printed circuit board, introduced sheet and RFID media.

The disqualification rate of FPC that obtains in embodiment 7～12 and RFID media and the layout of communication distance are little, the outward appearance of goods, superior for heat resistance, and the cementability of film and metal forming (peel strength) is superior.

[table 3]

[table 4]

Utilize possibility on the industry

With regard to FPC of the present invention, can by jointly extruding the good thermal adhesive layer of smooth property be set having on the stable on heating base material, utilize continuous stacked operation, the film that heat bonding is netted and metal forming are made FPC. Therefore, not only obtain high speed of production, but also can use it, utilize continuous stacked operation, with high speed of production, make the RFID media. In addition, utilize the RFID media of continuous stacked operation manufacturing to compare with the mold pressing procedure in the past that uses bonding agent, can improve the inequality of defective work generation rate, electric quality. Thereby the present invention plays big contribution function to RFID media universal.

Claims

1. flexible printed circuit board, it is characterized in that, this flexible printed circuit board is to by carrying out etch processes and make by extruding the Biaxially oriented polyester film that is formed with thermal adhesive layer and substrate layer jointly and being adhered to duplexer that the metal forming on this Biaxially oriented polyester film surface forms via thermal adhesive layer

Substrate layer in the Biaxially oriented polyester film has fusing point at 200～300 ℃, and thermal adhesive layer is to be formed by the mylar that contains wax.

2. flexible printed circuit board according to claim 1 is characterized in that,

3. flexible printed circuit board according to claim 1 and 2 is characterized in that,

Thermal adhesive layer be by amorphous polyester resin A, with this amorphous polyester resin A be that the non-thermoplastic resin B that mixes and the mixture of wax form.

4. according to each described flexible printed circuit board in the claim 1～3, it is characterized in that,

All features of thermal adhesive layer has following (1)～(4), that is:

(1) vitrification point of amorphous polyester resin A is 50～95 ℃;

(4) thickness of thermal adhesive layer is 5～30 μ m.

5. according to each described flexible printed circuit board in the claim 1～4, it is characterized in that,

Be formed with the overlay that utilizes coating to form by the thermal adhesive layer surface of extruding formation jointly, and be included in the bonding metal forming of this coating aspect.

6. according to each described flexible printed circuit board in the claim 1～5, it is via the thermal adhesive layer of exposing by etch processes and then the bonding film that is formed by other resins and stacked formation.

7. a RFID media is used and is introduced sheet, wherein,

Its flexible printed circuit board in claim 1～6 has disposed integrated circuit.

8. RFID media, wherein,

It is to use the described introducing sheet of claim 7 to constitute.

9. the manufacture method of a flexible printed circuit board, it comprises when rolling out the reticulated film of reeling with the roller shape and metal forming, carries out the operation of heat lamination continuously, it is characterized in that,

As reticulated film, use the Biaxially oriented polyester film that has formed the thermal adhesive layer that forms by the mylar of extruding formation jointly at 200～280 ℃ of polyester base material layers with fusing point by containing wax.

10. the manufacture method of a RFID media, it has when rolling out a plurality of reticulated film and the flexible printed circuit board of reeling with the roller shape or introducing sheet, carries out the operation of heat lamination continuously, it is characterized in that,

Use each described flexible printed circuit board or introducing sheet in the claim 1～7.

11. the manufacture method of RFID media according to claim 10 is characterized in that,

Antenna loop is disposed at each described flexible printed circuit board in the claim 1～7 or introduces the heat bonding aspect of the Biaxially oriented polyester film of sheet.