CN101826452B - 基片上载装置 - Google Patents
基片上载装置 Download PDFInfo
- Publication number
- CN101826452B CN101826452B CN2010101393527A CN201010139352A CN101826452B CN 101826452 B CN101826452 B CN 101826452B CN 2010101393527 A CN2010101393527 A CN 2010101393527A CN 201010139352 A CN201010139352 A CN 201010139352A CN 101826452 B CN101826452 B CN 101826452B
- Authority
- CN
- China
- Prior art keywords
- substrate
- vacuum
- gate valve
- vacuum tube
- substrate box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 189
- 230000007246 mechanism Effects 0.000 claims abstract description 14
- 238000007789 sealing Methods 0.000 claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims abstract description 5
- 230000008520 organization Effects 0.000 claims description 14
- 230000004888 barrier function Effects 0.000 claims description 13
- 238000005452 bending Methods 0.000 claims description 10
- 230000009471 action Effects 0.000 claims description 7
- 230000007306 turnover Effects 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 20
- 230000008569 process Effects 0.000 abstract description 10
- 238000001514 detection method Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 14
- 238000005086 pumping Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 238000013507 mapping Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
Abstract
Description
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101393527A CN101826452B (zh) | 2010-03-30 | 2010-03-30 | 基片上载装置 |
PCT/CN2011/071920 WO2011120385A1 (zh) | 2010-03-30 | 2011-03-17 | 基片上载装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101393527A CN101826452B (zh) | 2010-03-30 | 2010-03-30 | 基片上载装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101826452A CN101826452A (zh) | 2010-09-08 |
CN101826452B true CN101826452B (zh) | 2011-09-07 |
Family
ID=42690295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010101393527A Expired - Fee Related CN101826452B (zh) | 2010-03-30 | 2010-03-30 | 基片上载装置 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN101826452B (zh) |
WO (1) | WO2011120385A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101826452B (zh) * | 2010-03-30 | 2011-09-07 | 东莞宏威数码机械有限公司 | 基片上载装置 |
CN108735586B (zh) * | 2017-06-30 | 2021-05-28 | 上海微电子装备(集团)股份有限公司 | 一种抽真空装置及抽真空方法 |
JP6885980B2 (ja) * | 2019-03-28 | 2021-06-16 | 平田機工株式会社 | 駆動装置及び搬送装置 |
EP3976999A4 (en) | 2019-05-31 | 2023-06-28 | Greene, Tweed Technologies, Inc. | Smart seals for monitoring and analysis of seal properties useful in semiconductor valves |
CN115584485A (zh) * | 2022-10-11 | 2023-01-10 | 拓荆科技股份有限公司 | 一种用于薄膜沉积设备的密封结构以及反应腔室 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6403322B1 (en) * | 2001-03-27 | 2002-06-11 | Lam Research Corporation | Acoustic detection of dechucking and apparatus therefor |
CN101648649A (zh) * | 2009-09-03 | 2010-02-17 | 东莞宏威数码机械有限公司 | 真空基片传送系统 |
CN201638801U (zh) * | 2010-03-30 | 2010-11-17 | 东莞宏威数码机械有限公司 | 密封式基片上载装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08124916A (ja) * | 1994-10-27 | 1996-05-17 | Touyoko Kagaku Kk | 複数チャンバ真空熱処理装置 |
JP2004014586A (ja) * | 2002-06-04 | 2004-01-15 | Nec Kansai Ltd | ウェハー搬送機構 |
KR100669111B1 (ko) * | 2005-06-16 | 2007-01-15 | 삼성전자주식회사 | 챔버 어셈블리 및 이를 갖는 기판 가공 장치 |
US20060285944A1 (en) * | 2005-06-21 | 2006-12-21 | Varian Semiconductor Equipment Associates, Inc. | FOUP loading load lock |
US20100047053A1 (en) * | 2008-08-19 | 2010-02-25 | Silverbrook Research Pty Ltd | Die picker for picking printhead die from a wafer |
CN101673699B (zh) * | 2009-09-03 | 2011-05-11 | 东莞宏威数码机械有限公司 | 基片盒载台 |
CN101826452B (zh) * | 2010-03-30 | 2011-09-07 | 东莞宏威数码机械有限公司 | 基片上载装置 |
-
2010
- 2010-03-30 CN CN2010101393527A patent/CN101826452B/zh not_active Expired - Fee Related
-
2011
- 2011-03-17 WO PCT/CN2011/071920 patent/WO2011120385A1/zh active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6403322B1 (en) * | 2001-03-27 | 2002-06-11 | Lam Research Corporation | Acoustic detection of dechucking and apparatus therefor |
CN101648649A (zh) * | 2009-09-03 | 2010-02-17 | 东莞宏威数码机械有限公司 | 真空基片传送系统 |
CN201638801U (zh) * | 2010-03-30 | 2010-11-17 | 东莞宏威数码机械有限公司 | 密封式基片上载装置 |
Non-Patent Citations (1)
Title |
---|
JP特开2004-14586A 2004.01.15 |
Also Published As
Publication number | Publication date |
---|---|
WO2011120385A1 (zh) | 2011-10-06 |
CN101826452A (zh) | 2010-09-08 |
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