WO2011120385A1 - 基片上载装置 - Google Patents

基片上载装置 Download PDF

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Publication number
WO2011120385A1
WO2011120385A1 PCT/CN2011/071920 CN2011071920W WO2011120385A1 WO 2011120385 A1 WO2011120385 A1 WO 2011120385A1 CN 2011071920 W CN2011071920 W CN 2011071920W WO 2011120385 A1 WO2011120385 A1 WO 2011120385A1
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WO
WIPO (PCT)
Prior art keywords
substrate
vacuum
gate valve
vacuum tube
plate
Prior art date
Application number
PCT/CN2011/071920
Other languages
English (en)
French (fr)
Inventor
杨明生
郭业祥
刘惠森
范继良
王勇
王曼媛
Original Assignee
东莞宏威数码机械有限公司
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Filing date
Publication date
Application filed by 东莞宏威数码机械有限公司 filed Critical 东莞宏威数码机械有限公司
Publication of WO2011120385A1 publication Critical patent/WO2011120385A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber

Definitions

  • the present invention relates to a substrate uploading apparatus, and more particularly to a substrate uploading apparatus applied to a semiconductor production line. Background technique
  • Thin sheets such as glass substrates have been widely used in the manufacture of LCD-TFT displays, organic light-emitting display devices (OLED) panels, thin film solar panel applications, and the like. In such applications, thin film transistors are mostly plated on clean glass.
  • the process of such large glass substrates usually involves performing multiple successive steps, including, for example, chemical vapor deposition (CVD), physical vapor deposition (PVD), organic Material evaporation, magnetron sputtering deposition or etching processes.
  • the system for treating a glass substrate can include one or more process chambers for performing the processes described above. Current trending panel processing is moving toward large-area substrate sizes to allow more displays to be formed on the substrate, or to make larger displays and larger solar panels.
  • the deposits are vapor-like organic substances, such as air and water vapor. If it exists, it is easy to react with the organic evaporation material to change the composition of the deposit on the substrate and affect its luminescence effect. For example, during the magnetron sputtering deposition process, the plasma glow discharge is mutually inert after impacting the space.
  • the gas causes the degree of ionization to reach an avalanche state, so that a large area and a large range of impact metal targets, metal atoms or/and atomic groups are separated from the target and deposited on the substrate under magnetic guidance, but the process is not well sealed, and the vacuum environment is insufficient. Will seriously affect the degree of glow discharge, while the oxygen and water vapor in the air will also attack the target, causing the magnetron sputtering process to be interrupted or / and the deposited film is affected; such a glass substrate and other coating, film coating
  • the process must ensure the absolute reliability of the vacuum system throughout the process. Thus, in such a process, it is important to complete the substrate upload in a vacuum environment.
  • An object of the present invention is to provide a substrate uploading apparatus which can complete a substrate uploading process in a continuously stable vacuum state.
  • the present invention discloses a substrate uploading device for uploading a substrate in a substrate cassette to a production line by a robot, the substrate uploading device comprising a vacuum chamber, a vacuum control mechanism, and a base.
  • a cassette stage and a lifting device wherein a wall of the substrate of the vacuum chamber is respectively provided with a substrate inlet for the substrate to enter and exit, a substrate outlet for the robot to enter and exit, and a venting opening, the substrate inlet a sealed chamber door fitted with the substrate inlet, an outlet gate valve is mounted on the substrate outlet;
  • the vacuum control mechanism includes a vacuum tube, a vacuum gauge and a vacuum gate valve, and one end of the vacuum tube and the vent hole Connected to the other end, respectively, with an evacuation system and an inflation system, wherein the vacuum gauge and the vacuum gate valve are respectively mounted on the vacuum tube;
  • the substrate cassette stage is placed in the vacuum chamber, the substrate box
  • the stage includes a fixed plate carrying the substrate cassette and a detecting unit for detecting the state of the
  • the vacuum tube includes a first vacuum tube and a second vacuum tube
  • the vacuum gate valve includes a first gate valve and a second gate valve
  • the first vacuum tube and the second vacuum tube are both connected to the vent hole
  • the first The other end of a vacuum tube is connected to the rough evacuation system and the inflation system
  • the other end of the second vacuum tube is connected to the fine evacuation system
  • the first vacuum valve and the second vacuum tube are respectively mounted with the first gate valve and a second gate valve, the vacuum gauge being installed at a position where the vacuum tube is close to the vent hole.
  • a two-stage vacuuming operation is often used, that is, the preliminary vacuuming is performed first, and then the later vacuuming is performed until the pressure in the vacuum chamber reaches the set. Value.
  • the invention adopts a rough evacuation system and a fine evacuation system.
  • the vacuum chamber begins to evacuate, the first gate valve is opened, the rough evacuation system starts to work, and the vacuum chamber is started to be vacuumed, when the pressure in the vacuum chamber reaches When the range is within a certain range, the first gate valve is closed, and the rough evacuation system is stopped.
  • the second gate valve is opened, and the fine evacuation system starts to work until the air pressure in the vacuum chamber reaches a predetermined value.
  • This two-stage vacuuming operation allows the air pressure in the vacuum chamber to accurately reach a predetermined range, preventing the air pressure in the vacuum chamber from being too low.
  • the annular region of the sealing chamber door in contact with the vacuum chamber is sequentially provided with inner ring grooves, middle ring grooves and outer ring grooves which are parallel to each other from the inside to the outside.
  • a sealing ring is disposed in the groove and the outer ring groove, wherein the middle ring groove is respectively connected with the inner ring groove and the outer ring groove, and the vacuum control system further comprises a third vacuum tube and a third gate valve One end of the third vacuum tube is in communication with the middle ring groove, and the other end is connected to an evacuation system and an inflation system, respectively, and the third gate valve is mounted on the third vacuum tube.
  • the sealing chamber door of the invention adopts a double sealing structure, so that the sealing effect of the sealing chamber door is better, the airtightness in the vacuum chamber body is ensured, and the inner ring groove and the third vacuum tube are connected, and the third passage can be passed.
  • the vacuum tube is vacuumed or inflated to control the opening and closing of the sealed chamber door, further ensuring the airtightness of the sealed chamber door, and also allowing the sealed chamber door to be opened and closed conveniently and accurately.
  • a door sensor is further mounted on the sealed chamber door.
  • the provision of the door sensor on the sealed chamber door allows the substrate cassette to be detected for the first time outside the sealed chamber door to open the sealed chamber door for improved work efficiency.
  • the central portion of the fixing plate is provided with a groove in the direction of the sealing chamber door, and the fixing plates on both sides of the groove are provided with a plurality of positioning blocks, and the positioning block encloses a substrate box positioning area.
  • the substrate cassette transporting device transports the substrate cassette from the sealed chamber door to the substrate cassette positioning area, the positioning block positions the substrate cassette, and the placement of the substrate cassette is incorrectly positioned to be The next step is performed, and the recess allows the cassette transport device to more conveniently transport the substrate cassette into the substrate cassette positioning area above the recess.
  • the detecting unit comprises a photoelectric sensor, a sensor reflector, a sensor baffle, a baffle bracket and an elastic member; a portion of the fixing plate contacting the substrate box is provided with a through groove, and the sensor reflector
  • the photosensor is disposed directly below the sensor reflector, and the sensor baffle has a zigzag shape, and the sensor baffle includes an upper plate and a bend.
  • the upper plate of the sensor baffle protrudes obliquely upwardly from the upper end of the through groove, and the light path formed by the plate, the end of the bent plate adjacent to the upper plate is rotatably mounted on the baffle Bracket
  • the baffle bracket is fixed on the lower surface of the fixing plate, and one end of the bending plate adjacent to the lower plate is connected to the elastic member, and the other end of the elastic member is connected to the fixing plate.
  • the upper plate protruding from the through groove rotates downward along the baffle support under the gravity of the substrate, and the lower plate follows Moving in the direction of the light path until the optical path between the photosensor and the sensor reflector is intercepted, the photosensor does not sense the reflected light, and the present invention detects that the substrate is placed in position; when the substrate cassette is not placed in the substrate During the stage, the lower plate moves away from the optical channel under the action of the elastic member, the light path between the photoelectric sensor and the sensor reflector penetrates, and the photoelectric sensor receives the emitted light, and the invention detects that the substrate box is not placed in place. .
  • the lifting device comprises an elevation driving mechanism, an output shaft and a bellows, and a bottom of the vacuum chamber is provided with a mounting hole, one end of the bellows is connected to the lifting drive mechanism, and the other end is connected to the mounting
  • the holes are connected, the lifting drive mechanism is coupled to the output shaft and drives the output shaft to move in a vertical direction, and the output shaft slides through the bellows and the mounting hole and is fixedly coupled to the fixing plate.
  • the bellows structure separates the atmosphere outside the chamber from the vacuum chamber, effectively maintaining the vacuum environment in the cavity.
  • the substrate uploading device further comprises a substrate uploading control system, wherein the substrate uploading control system is electrically connected to the vacuuming control mechanism, the detecting unit and the lifting device, respectively, and controls the vacuuming control mechanism , detection unit and lifting device action.
  • a substrate uploading control system is electrically connected to the vacuuming control mechanism, the detecting unit and the lifting device, respectively, and controls the vacuuming control mechanism , detection unit and lifting device action.
  • the substrate uploading device of the present invention comprises a vacuum chamber, a vacuum control mechanism, a substrate cassette stage and a lifting device.
  • the substrate cassette containing the substrate is first transferred to the sealed chamber door of the vacuum chamber.
  • the air pressure in the vacuum chamber is brought to a predetermined range by the vacuum control mechanism, and the vacuum operation is continued to maintain the air pressure in the chamber, and the substrate inside the substrate cassette and the outlet gate valve are lifted by the lifting device.
  • the robot completes the alignment, opens the exit gate valve, the robot removes the substrate, repeats the alignment and takes the substrate action until the substrate is loaded, and finally stops the vacuum operation.
  • DRAWINGS BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing the structure of a substrate uploading device of the present invention.
  • Figure 2 is a schematic view showing the structure of the substrate loading device of the present invention from another angle.
  • Figure 3 is a partial cross-sectional view showing the substrate uploading device of the present invention.
  • Figure 4 is an enlarged view of a portion A in Figure 3.
  • Figure 5 is a schematic view showing the structure of the sealed chamber door of the present invention.
  • Figure 6 is an enlarged view of a portion B in Figure 5.
  • Figure 7 is a schematic view showing the structure of a substrate cassette stage of the present invention.
  • Figure 8 is a schematic view showing the structure of another stage of the substrate cassette stage of the present invention.
  • Figure 9 is an exploded perspective view of the substrate cassette stage of the present invention.
  • Figure 10 is a schematic view showing the structure of the sensor shutter of the present invention.
  • 11a-11c are schematic views showing the operation of the detecting unit of the present invention. detailed description
  • the substrate uploading apparatus 100 of the present invention is used for uploading a substrate in the substrate cassette 50 to a production line by a robot (not shown), and the substrate uploading apparatus 100 includes a vacuum chamber.
  • the body 10, the vacuum control mechanism 20, the substrate cassette stage 30, and the lifting device 40 are used for uploading a substrate in the substrate cassette 50 to a production line by a robot (not shown), and the substrate uploading apparatus 100 includes a vacuum chamber.
  • the cavity wall of the vacuum chamber 10 is respectively provided with a substrate inlet 11 for the substrate cassette 50 to enter and exit, a substrate outlet 12 for the robot to enter and exit, and a vent hole 13,
  • the substrate inlet 11 is fitted with a sealing chamber door 14 to which it is fitted, and an outlet gate valve 15 is mounted on the substrate outlet 12.
  • the vacuum control mechanism 20 includes a vacuum tube 21, a vacuum gauge 22, and a vacuum gate valve 23. One end of the vacuum tube 21 is in communication with the vent hole 13 and the other end is connected to an evacuation system and an inflation system, respectively.
  • a vacuum gate valve 23 is mounted on the vacuum tube 21; the substrate cassette stage 30 is placed in the vacuum chamber 10, and the substrate cassette stage 30 includes a fixing plate 31 for carrying the substrate cassette 50 and a detecting unit 32 for detecting the state of the substrate cassette 50; an output shaft 42 of the lifting device 40 is sealedly connected to the substrate cassette stage 30 through the bottom of the vacuum chamber 10, and the substrate cassette is controlled
  • the stage 30 is used for lifting movements.
  • the vacuum tube 21 includes a first vacuum tube 211 and a second vacuum tube 212.
  • the vacuum gate valve 23 includes a first gate valve 231 and a second gate valve 232.
  • the first vacuum tube 211 is connected to the vent hole 13.
  • the first gate valve 231 is mounted on the first vacuum tube 211; one end of the second vacuum tube 212 is connected to the vent hole 13, and the other end of the second vacuum tube 212 is Connected to the fine evacuation system, the second gate valve 232 is mounted on the second vacuum tube 212; the vacuum gauge 22 is mounted on the vacuum tube 21 at a position close to the vent hole 13.
  • the first gate valve 231 is opened, and the rough evacuation system starts to work.
  • the first gate valve 231 is closed, and the rough evacuation system stops working.
  • the second gate valve 232 is opened and the fine evacuation system begins to operate until the air pressure in the vacuum chamber 10 reaches a predetermined value.
  • the first gate valve 231 is opened, and the inflation system starts to operate until the air pressure in the vacuum chamber 10 is equal to the outside, the first gate valve is closed, and the inflation system is stopped.
  • the annular region of the sealing chamber door 14 contacting the cavity wall of the vacuum chamber 10 is sequentially provided with inner ring grooves 141 and middle ring grooves which are parallel to each other from the inside to the outside. a groove 142 and an outer ring groove 143.
  • the inner ring groove 141 and the outer ring groove 143 are respectively provided with a sealing ring 144, and the middle ring groove 142 is respectively concave with the inner ring groove 141 and the outer ring groove.
  • a communication hole 146 is defined between the slots 143 to communicate with the inner ring groove 141 and the outer ring groove 143, and the vacuum control system 20 further includes a third vacuum tube 213 and a third The gate valve 233, the middle ring groove 142 is provided with a through hole 145, one end of the third vacuum tube 213 is connected with the through hole 145, and the other end is connected to the vacuuming system and the inflation system, respectively, and the third gate valve 233 is installed. On the third vacuum tube 213.
  • the third gate valve 233 When the sealing chamber door 14 is opened, the third gate valve 233 is opened, and the inflation system starts to work until the air pressure in the vacuum chamber 10 is equal to the air pressure outside the vacuum chamber 10, the third gate valve 233 is closed, the inflation system stops working, and the sealed chamber is opened.
  • the through hole communicating with the third vacuum tube 213 is opened at a position on the vacuum chamber 10 opposite to the middle ring groove after the sealing chamber door 14 is closed, and the sealing chamber door 14 can also be inflated by the middle ring groove 142 or Pumping to open and close; in order to simplify the structure of the entire substrate uploading device, the third vacuum tube 213 and the third gate valve 233 may also be omitted, directly on the vacuum chamber 10 opposite to the middle ring groove after the sealing chamber door 14 is closed.
  • a through hole is formed in the place to penetrate the inside of the vacuum chamber 10.
  • the sealed chamber door 14 also has a door The sensor is used to sense whether the sealed chamber door 14 is fitted.
  • a door sensor (not shown) is further mounted on the sealed chamber door 14.
  • the provision of the door sensor on the sealed chamber door 14 allows the first time before the substrate cassette 50 reaches the sealed chamber door 14 to be detected, improving work efficiency.
  • the central portion of the fixing plate 31 is provided with a groove 33 in the direction of the sealing chamber door 14 , and the fixing plates on both sides of the groove 33 are divided into a first supporting plate 311 and a second support.
  • a plurality of positioning blocks 34 are disposed on the support plate 311 and the second support plate 312, and the positioning block 34 defines a substrate positioning area.
  • the detecting unit 32 includes a photosensor 321, a sensor reflector 322, a sensor shutter 323, a baffle bracket 324, and an elastic member 325; the fixing plate 31 and the substrate
  • a slot 313 is defined in the portion where the box 50 is in contact with the slot 313.
  • the slot 313 is disposed on the second support plate 312.
  • the sensor reflector 322 is mounted on the lower surface of the second support plate 312 adjacent to the slot 313.
  • the photo sensor 321 is disposed directly below the sensor reflector 322.
  • the sensor baffle 323 has a zigzag shape.
  • the sensor baffle 323 includes an upper plate 3231, a bent plate 3232, and a lower plate 3233.
  • the upper plate 3231 of the sensor baffle 323 protrudes obliquely upward to the light path formed by the upper reflective plate 322 and the sensor reflective plate 322.
  • the bent plate 3232 is rotatably mounted adjacent to one end of the upper plate 3231.
  • the baffle bracket 324 is fixed on the lower surface of the second support plate 312, and one end of the bent plate 3232 adjacent to the lower plate 3233 is connected to the elastic member 325, and the elastic The other end of the member 325 is fixed in the house The outer surface of the fixing plate 31. Specifically, referring to FIG.
  • the bent plate 3232 of the sensor baffle 323 includes a first bent portion 3234 and a second bent portion 3235, and the upper plate 3231 is connected to the first bent portion 3234, and the lower plate 3233 and the The two bent portions 3235 are connected. Since the longitudinal directions of the first bent portion 3234 and the second bent portion 3235 are not in a straight line, the mapping of the upper plate 3231 and the lower plate 3233 connected thereto on the second support plate 312 does not coincide.
  • the mounting position of the sensor reflector 322 is adjacent to the mapping position of the lower plate 3233 on the second support plate 312.
  • the second bending portion 3235 is provided with a spring mounting hole. One end of the elastic member 325 is installed in the spring mounting hole, and the baffle bracket 324 is supported at the connection between the first bending portion 3234 and the upper plate, so that the sensor can be blocked. board The 323 rotates around the baffle bracket 324.
  • Figure 11a is a positional relationship between the photosensor 321, the sensor reflecting plate 322 and the sensor shutter 323 when the substrate cassette 50 is not placed.
  • the photosensor 321 is connected to the sensor reflector 322
  • FIG. 1 ib when the substrate cassette 50 is placed on the substrate cassette 30, under the gravity of the substrate cassette 50, The upper plate 3231 rotates downward along the baffle bracket 324, and the lower plate 3233 moves in the direction of the light path until the optical path between the photosensor 321 and the sensor reflector 322 is intercepted (see FIG. 11c).
  • the photosensor 321 does not sense the reflected light, and the detecting unit 32 detects that the substrate cassette 50 is placed in position; when the substrate cassette 50 leaves the substrate cassette stage 30, the lower plate 3233 is moved away from the optical path by the elastic member 325. The direction moves, the optical path between the photosensor 321 and the sensor reflector 322 passes through, the photosensor 321 receives the emitted light (see FIG. 11a), and the detecting unit 32 detects that the substrate cassette 50 is not placed. Bit.
  • the lifting device 40 includes an elevation driving mechanism 41, an output shaft 42 and a bellows 43.
  • the bottom of the vacuum chamber 10 is provided with a mounting hole 331, the bellows 43-end and the lifting drive mechanism. 41 is connected, the other end is connected to the mounting hole 331, the lifting drive mechanism 41 is connected to the output shaft 42 and drives the output shaft 42 to move in a vertical direction, and the output shaft 42 slides through the bellows 43 and
  • the mounting hole 331 is fixedly coupled to the fixing plate 31.
  • the bellows 43 separates the atmosphere outside the vacuum chamber 10 from the inside of the vacuum chamber 10, effectively maintaining the vacuum environment within the vacuum chamber 10.
  • the lifting device 40 is used to drive the movement of the substrate cassette stage 30 in the vertical direction so that the substrate in the substrate cassette 50 is aligned with the height of the external robot, facilitating the removal of the substrate by the robot through the outlet gate valve 15.
  • the lifting drive mechanism 41 includes a sensor and a servo motor. The height of the substrate in the substrate cassette 50 is detected by the sensor, and the lifting and positioning of the substrate cassette 30 is realized by a servo motor. The lifting and positioning is a common technical means in the prior art, and will not be described again.
  • the sensor of the elevation drive mechanism 41 detects the height of the substrate in the substrate cassette 50 (generally detecting the lower bottom surface height or the uppermost end of the lowermost end substrate of the substrate cassette) The height of the upper end surface of the substrate, and then the servo motor acts to push the fixed plate 31 to move, so that the height of the detected substrate coincides with the height of the external manipulator of the vacuum chamber 10, and the alignment operation of the robot and the substrate is completed.
  • the substrate uploading apparatus 100 further includes a substrate uploading control system, and the substrate uploading control system is electrically connected to the vacuuming control mechanism 20, the detecting unit 32, and the lifting device 40, respectively, and controls the The vacuum control mechanism 20, the detecting unit 32, and the lifting device 40 operate.
  • the substrate upload control system is also electrically coupled to the outlet gate valve 15 and the door sensor.
  • the substrate cassette 50 is sent to the outside of the sealed chamber door 14, and the door sensor detects the arrival signal of the substrate cassette 50.
  • the first gate valve 231 and the third gate valve 233 are opened, and the inflation system starts to work until the vacuum gauge 22 detects that the air pressure inside the vacuum chamber 10 is the same as the outside, and the first gate valve 231 and the third gate valve 233 are closed, and the inflation system stops working.
  • the substrate cassette 50 is sent to the substrate cassette stage 30 through the sealed chamber door 14, and the positioning block 34 on the fixing plate 31 fixes the substrate cassette 50 to close the sealed chamber door; the first gate valve 231 and the third gate valve 233 are opened, the vacuuming system connected to the third gate valve 233, and the rough evacuation system connected to the first gate valve 231 start the preliminary vacuuming operation, when the air pressure in the vacuum chamber 10 reaches a certain value, The first gate valve 231 and the third gate valve 233 are closed, and the corresponding vacuum system is stopped, and the second gate valve 232 is opened, and the fine evacuation system starts working.
  • the vacuuming operation is performed at the beginning and the end until the air pressure in the vacuum chamber 10 reaches a predetermined value.
  • the outlet gate valve 15 When the vacuum gauge 22 detects that the air pressure in the vacuum chamber 10 is within the set range, the outlet gate valve 15 is opened; while the vacuuming continues to operate, the lifting device 40 starts to operate, and the output shaft 42 pushes the fixing plate 31 in the vertical direction. Moving, until the lower bottom surface of the first substrate from the bottom to the top of the substrate cassette 50 carried on the fixed plate 31 coincides with the height of the robot outside the vacuum chamber 10, the substrate upload control system sends a signal, and the external robot passes The outlet gate valve 15 extends into the cavity 10 to catch the substrate, and then exits the vacuum chamber 10 through the outlet gate valve 15, and the first substrate is loaded; the lifting device 40 continues to operate, and the output shaft 42 pushes the substrate cassette stage 30 down until The lower bottom surface of the first substrate from the bottom to the top of the substrate cassette 50 coincides with the height of the robot outside the vacuum chamber 10 (ie, the second alignment is completed), and the robot passes the exit gate valve 15 to take out the second substrate. The above operation is repeated until the substrate in the substrate
  • the substrates can be loaded in the order from bottom to top, and can also be uploaded from top to bottom.
  • the substrate cassette 30 is gradually raised during the substrate uploading process, thereby completing the robot and the base.
  • the alignment of the film is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, and the equivalent changes made by the scope of the present invention remain within the scope of the present invention.

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Description

基片上载装置 技术领域
本发明涉及一种基片上载装置，尤其涉及一种应用于半导体生产线上的基片 上载装置。 背景技术
玻璃基材等薄板已广泛用于制造 LCD-TFT 显示屏、 有机发光显示器件 ( OLED )面板、 薄膜太阳能面板应用及其他类似者。 于此类应用中大多在洁净 玻璃上镀覆薄膜晶体管， 这类大型玻璃基材的制程通常包含实施多个连续步骤， 包括如化学气相沉积制程（CVD )、 物理气相沉积制程（PVD )、 有机物质蒸镀、 磁控溅射沉积或蚀刻制程。 用于处理玻璃基材的系统可包括一或多个制程处理 室， 以进行前述所述制程。 目前趋势面板加工朝向大面积基材尺寸发展， 以使 基材上可形成更多显示器、 或制造更大型的显示器以及更大型的太阳能面板。
由于此类制程的工艺要求比较严格，即必须在真空状态下以及完全洁净的空 间环境中进行， 如有机发光二极管的蒸镀制程， 其沉积物为呈蒸汽状的有机物 质， 如有空气、 水汽等存在的话极易与有机蒸镀材料发生反应进而改变基材上 的沉积物成分， 影响其发光效应； 再如， 磁控溅射沉积制程过程中， 等离子体 辉光放电后相互撞击空间内惰性气体使离子化程度达到雪崩状态， 从而大面积、 大范围的撞击金属靶材， 金属原子或 /和原子团脱离靶材在磁力引导下沉积到基 底上， 然此过程如密封不好、 真空环境不足将严重影响辉光放电的程度， 同时 空气中的氧气和水汽也会将靶材侵蚀， 导致磁控溅射制程中断或 /和沉积薄膜受 到影响； 类此种种玻璃等基材的镀膜、 覆膜制程， 都必须要保证整个制程的真 空系统的绝对可靠性。 这样， 在此类制程中， 在真空环境下完成基片上载就凸 显了重要意义。
然而现有的基片上载装置中，腔体内未能保持真空状态或所设计的装置不能 完全保证腔体内的气密性， 以致影响基片的洁净度， 难以提高基片质量。 因此， 针对腔体内清洁度不高的缺陷， 急需一种保证基片上载的整个过程中， 腔体内 一直维持在稳定的真空状态下的基片上载装置。 发明内容
本发明的目的是提供一种可以在持续稳定的真空状态下完成基片上载过程 的基片上载装置。
为了实现上有目的，本发明公开了一种基片上载装置，用于将基片盒中的基 片通过机械手上载至生产线上， 该基片上载装置包括真空腔体、 抽真空控制机 构、 基片盒载台以及升降装置， 所述真空腔体的腔壁上分别开设有供所述基片 盒进出的基片入口、 供所述机械手进出的基片出口以及通气孔， 所述基片入口 安装有与该基片入口相配合的密封腔门， 所述基片出口上安装有出口闸阀； 所 述抽真空控制机构包括真空管、 真空计和真空闸阀， 所述真空管的一端与所述 通气孔相连通， 另一端分别连接有抽真空系统和充气系统， 所述真空计和真空 闸阀均安装在所述真空管上； 所述基片盒载台置于所述真空腔体内， 所述基片 盒载台包括承载基片盒的固定板和检测基片盒状态的检测单元； 所述升降装置 的输出轴密封穿过所述真空腔体的底部与所述基片盒载台固定相连， 并控制所 述基片盒载台做升降运动。
较佳地，所述真空管包括第一真空管和第二真空管，所述真空闸阀包括第一 闸阀和第二闸阀， 所述第一真空管和第二真空管一端均与所述通气孔相连， 所 述第一真空管的另一端与粗抽空系统和充气系统相连， 所述第二真空管的另一 端与所述精抽空系统相连， 且所述第一真空管和第二真空管上分别安装有所述 第一闸阀和第二闸阀， 所述真空计安装在所述真空管接近通气孔的位置上。 在 基片上载时， 为了保证真空腔体内的气压达到设定的范围， 往往釆用两阶段抽 真空操作， 即先进行前期抽真空， 然后再进行后期抽真空， 直至真空腔体内的 气压达到设定值。 本发明釆用了粗抽空系统和精抽空系统， 所述真空腔体内开 始抽真空时， 第一闸阀打开， 粗抽空系统开始工作， 对真空腔体内开始抽真空 操作， 当真空腔体内的气压达到一定范围内时， 第一闸阀关闭， 粗抽空系统停 止工作， 第二闸阀打开， 精抽空系统开始工作， 直至真空腔体内的气压达到预 定值。 这种釆用两阶段抽真空操作， 可以使得真空腔体内的气压精确地到达预 定范围内， 防止真空腔体内气压过低。
较佳地，所述密封腔门与所述真空腔体相接触的环形区域从内至外依次开设 有相互平行的内圈凹槽、 中圈凹槽及外圈凹槽， 所述内圈凹槽与外圈凹槽内均 装有密封圈， 所述中圈凹槽分别与所述内圈凹槽和外圈凹槽相连通， 所述抽真 空控制系统还包括第三真空管和第三闸阀， 所述第三真空管的一端与所述中圈 凹槽相连通， 另一端分别与抽真空系统和充气系统相连， 所述第三闸阀安装在 所述第三真空管上。 本发明密封腔门釆用了双密封结构， 使得密封腔门的密封 效果更好， 保证了真空腔体内的气密性， 而且将内圈凹槽和第三真空管相连通， 可以通过对第三真空管进行抽真空或者充气来控制密封腔门的打开与关闭， 进 一步保证了密封腔门的气密性， 也使密封腔门方便准确地打开和关闭。
较佳地，所述密封腔门上还安装有门传感器。在密封腔门上设置门传感器可 以使得基片盒到达密封腔门外的第一时间被检测到， 以便打开密封腔门， 提高 工作效率。
较佳地，所述固定板中部沿密封腔门方向开设有凹槽，所述凹槽两侧的固定 板上设有若干个定位块， 且所述定位块围成一个基片盒定位区。 基片上载装置 开始工作时， 基片盒传送装置将基片盒从密封腔门送至基片盒定位区内， 所述 定位块使基片盒定位， 放置基片盒放置位置错误以至于无法进行下一步操作， 而凹槽可以使得基片盒传送装置更加方便将基片盒送至凹槽上方的基片盒定位 区内。
较佳地， 所述检测单元包括光电传感器、 传感器反射板、 传感器挡板、 挡板 支架以及弹性部件； 所述固定板与所述基片盒接触的部位开设有通槽， 所述传 感器反射板安装在所述固定板下表面临近所述通槽的位置， 所述光电传感器设 置于所述传感器反射板正下方， 所述传感器挡板呈 Z字形， 所述传感器挡板包 括上板、 弯折板及下板， 所述传感器挡板的上板斜向上地突出所述通槽的上端， 射板形成的光通路， 所述弯折板临近所述上板的一端旋转安装在所述挡板支架 上， 所述挡板支架固定在所述固定板下表面， 所述弯折板临近所述下板的一端 与所述弹性部件相连， 所述弹性部件的另一端与所述固定板相连。 当所述基片 盒载台上放置有基片盒时， 在基片盒的重力作用下， 突出于所述通槽的上板沿 所述挡板支架向下旋转， 所述下板随之向光通路方向移动， 直至截断光电传感 器射与传感器反射板之间的光通路， 光电传感器感应不到反射光， 本发明检测 到基片盒放置到位； 当基片盒未放置在基片盒载台时， 下板在弹性部件的作用 下向远离光通道的方向移动， 光电传感器射与传感器反射板之间的光通路贯通 , 光电传感器接收到放射光， 本发明检测到基片盒未放置到位。
较佳地， 所述升降装置包括升降驱动机构、输出轴和波纹管， 所述真空腔体 的底部开设有安装孔， 所述波纹管一端与所述升降驱动机构相连， 另一端与所 述安装孔相连， 所述升降驱动机构与所述输出轴相连并驱动所述输出轴沿垂直 方向运动， 所述输出轴滑动穿过所述波纹管和安装孔并与所述固定板固定连接。 所述波纹管结构使得腔体外的大气环境和真空腔体内分隔开来， 有效地保持真 空腔体内的真空环境。
较佳地，所述基片上载装置还包括基片上载控制系统，所述基片上载控制系 统分别与所述抽真空控制机构、 检测单元和升降装置电连接， 并控制所述抽真 空控制机构、 检测单元和升降装置动作。 釆用自动化控制手段进行基片上载工 作， 节省劳动力， 工作效率高。
本发明基片上载装置包括真空腔体、 抽真空控制机构、 基片盒载台以及升 降装置， 进行基片上载时， 盛放基片的基片盒先通过真空腔体的密封腔门传送 至基片盒载台上， 然后通过抽真空控制机构使得真空腔体内的气压达到预定范 围， 持续抽真空操作以保持腔体内的气压， 通过升降装置使基片盒内的基片和 出口闸阀外的机械手完成对位， 打开出口闸阀， 机械手取出基片， 重复对位和 取基片动作， 直至基片上载完毕， 最后停止抽真空操作。 与现有技术相比， 本 发明在基片上载过程中一直维持在稳定的真空状态中， 保证了真空腔体内的气 密封和清洁度， 最终保证了基片的洁净度， 有效地提高了基片的质量。 附图说明 图 1是本发明基片上载装置的结构示意图。
图 2是本发明基片上载装置另一角度的结构示意图。
图 3是本发明基片上载装置的局部剖视图。
图 4是图 3中 A部分的放大图。
图 5是本发明密封腔门的结构示意图。
图 6是图 5中 B部分的放大图。
图 7是本发明基片盒载台的结构示意图。
图 8是本发明基片盒载台的另一角度的结构示意图。
图 9是本发明基片盒载台的立体分解图。
图 10是本发明传感器挡板的结构示意图。
图 11a-图 11c是本发明检测单元的工作示意图。 具体实施方式
为详细说明本发明的技术内容、 构造特征、 所实现目的及效果， 以下结合 实施方式并配合附图详予说明。
如图 1和图 2所示， 本发明基片上载装置 100, 用于将基片盒 50中的基片 通过机械手 （图中未示）上载至生产线上， 该基片上载装置 100 包括真空腔体 10、 抽真空控制机构 20、 基片盒载台 30以及升降装置 40。
参考图 1和图 3 , 所述真空腔体 10的腔壁上分别开设有供所述基片盒 50进 出的基片入口 11、 供所述机械手进出的基片出口 12、 以及通气孔 13 , 所述基片 入口 11安装有与之相配合的密封腔门 14, 所述基片出口 12上安装有出口闸阀 15。 所述抽真空控制机构 20包括真空管 21、 真空计 22和真空闸阀 23 , 所述真 空管 21 的一端与所述通气孔 13相连通， 另一端分别连接抽真空系统和充气系 统， 所述真空计 22和真空闸阀 23均安装在所述真空管 21上； 所述基片盒载台 30置于所述真空腔体 10内， 所述基片盒载台 30包括承载基片盒 50的固定板 31和检测基片盒 50状态的检测单元 32; 所述升降装置 40的输出轴 42密封穿 过所述真空腔体 10的底部与所述基片盒载台 30固定相连， 并控制所述基片盒 载台 30做升降运动。 较佳者， 所述真空管 21 包括第一真空管 211和第二真空管 212, 所述真空 闸阀 23包括第一闸阀 231和第二闸阀 232, 所述第一真空管 211—端与所述通 气孔 13相连， 另一端分别与粗抽空系统和充气系统相连， 所述第一闸阀 231安 装在所述第一真空管 211上； 第二真空管 212的一端与所述通气孔 13相连， 第 二真空管 212的另一端与所述精抽空系统相连， 所述第二闸阀 232安装在所述 第二真空管 212上； 所述真空计 22安装在所述真空管 21上接近通气孔 13的位 置。 所述真空腔体 10进行抽真空操作时， 第一闸阀 231打开， 粗抽空系统开始 工作， 当真空腔体 10内的气压达到一定范围内时， 第一闸阀 231关闭， 粗抽空 系统停止工作， 第二闸阀 232打开， 精抽空系统开始工作， 直至真空腔体 10内 的气压达到预定值。 真空腔体 10充气时， 第一闸阀 231打开， 充气系统开始工 作， 直至真空腔体 10内的气压与外界相等， 第一闸阀关闭， 充气系统停止工作。
较佳者， 参考图 3至图 6, 所述密封腔门 14与所述真空腔体 10的腔壁接触 的环形区域从内至外依次开设有相互平行的内圈凹槽 141、中圈凹槽 142及外圈 凹槽 143 , 所述内圈凹槽 141与外圈凹槽 143内分别设有密封圈 144, 所述中圈 凹槽 142分别与所述内圈凹槽 141和外圈凹槽 143之间开设有连通孔 146,使中 圈凹槽 142分别与所述内圈凹槽 141和外圈凹槽 143相连通， 所述抽真空控制 系统 20还包括第三真空管 213和第三闸阀 233 , 所述中圈凹槽 142上开设有通 孔 145 , 所述第三真空管 213的一端与通孔 145相连， 另一端分别与抽真空系统 和充气系统相连， 所述第三闸阀 233安装在所述第三真空管 213上。 当密封腔 门 14打开时， 打开第三闸阀 233 , 充气系统开始工作， 直至真空腔体 10内的气 压等于真空腔体 10外的气压， 第三闸阀 233关闭， 充气系统停止工作， 打开密 封腔门 14; 当需要关闭密封腔门 14时，将密封腔门 14关闭，打开第三闸阀 233 , 抽真空系统开始工作， 直至真空腔体 10内的气体达到预定值。 当然， 与第三真 空管 213相连通的通孔开设在密封腔门 14关闭后真空腔体 10上与中圈凹槽相 对的地方， 同样可以使得密封腔门 14通过中圈凹槽 142的充气或者抽气来打开 和关闭； 为了简化整个基片上载装置的结构， 也可以省略第三真空管 213 和第 三闸阀 233 ,直接在密封腔门 14关闭后真空腔体 10上与中圈凹槽相对的地方开 设一个与真空腔体 10内部贯通的通孔。 具体地， 密封腔门 14上还具有一个门 感应器， 用于感应密封腔门 14是否贴合。
较佳者， 所述密封腔门 14 上还安装有门传感器（图中未示）。 在密封腔门 14上设置门传感器可以使得基片盒 50到达密封腔门 14外的第一时间被检测到， 提高工作效率。
较佳者， 参考图 7至图 8 , 所述固定板 31中部沿密封腔门 14方向开设有凹 槽 33 , 所述凹槽 33两侧的固定板分为第一支撑板 311和第二支撑板 312, 所述 一支撑板 311和第二支撑板 312上均设有若干个定位块 34,且所述定位块 34围 成一个基片盒定位区， 当基片盒 50放置在凹槽 33的上方时， 定位块 34将基片 盒 50固定在基片盒定位区内。
较佳者， 参考图 7至图 9, 所述检测单元 32包括光电传感器 321、传感器反 射板 322、 传感器挡板 323、 挡板支架 324以及弹性部件 325; 所述固定板 31与 所述基片盒 50接触的部位开设有通槽 313 , 本实施例中通槽 313开设在第二支 撑板 312上， 所述传感器反射板 322安装在所述第二支撑板 312下表面临近所 述通槽 313的位置， 所述光电传感器 321设置于所述传感器反射板 322正下方， 所述传感器挡板 323呈 Z字形，所述传感器挡板 323包括上板 3231、弯折板 3232 及下板 3233 ,所述传感器挡板 323的上板 3231斜向上地突出所述通槽 313的上 与所述传感器反射板 322形成的光通路， 所述弯折板 3232临近所述上板 3231 的一端旋转安装在所述挡板支架 324上， 所述挡板支架 324固定在所述第二支 撑板 312下表面， 所述弯折板 3232临近所述下板 3233的一端与所述弹性部件 325相连， 所述弹性部件 325的另一端固定在所述固定板 31的外表面上。 具体 地， 参考图 10, 所述传感器挡板 323的弯折板 3232包括第一弯折部 3234和第 二弯折部 3235 , 上板 3231与第一弯折部 3234相连， 下板 3233与第二弯折部 3235相连， 由于第一弯折部 3234和第二弯折部 3235的纵向不在一条直线上， 与之相连的上板 3231和下板 3233在第二支撑板 312上的映射不重合， 传感器 反射板 322的安装位置临近下板 3233在第二支撑板 312上的映射位置。 其中， 第二弯折部 3235上开设有弹簧安装孔， 弹性部件 325的一端安装在弹簧安装孔 内， 挡板支架 324支撑在第一弯折部 3234与上板的连接处， 可以使传感器挡板 323绕挡板支架 324旋转。
参考图 11a至 11c, 描述检测单元 32检测基片盒 50的工作原理， 图 11a是 基片盒 50未放置时， 光电传感器 321、 传感器反射板 322和传感器挡板 323之 间的位置关系， 此时光电传感器 321与传感器反射板 322之间的光通连通； 参 考图 l ib, 当所述基片盒载台 30上放置有基片盒 50时， 在基片盒 50的重力作 用下， 所述上板 3231沿所述挡板支架 324向下旋转， 所述下板 3233随之向光 通路方向移动， 直至截断光电传感器射 321与传感器反射板 322之间的光通路 (见图 11c ), 光电传感器 321感应不到反射光， 检测单元 32检测到基片盒 50 放置到位； 当基片盒 50离开基片盒载台 30时， 下板 3233在弹性部件 325的作 用下向远离光通路的方向移动， 光电传感器 321与传感器反射板 322之间的光 通路贯通， 光电传感器 321接收到放射光（见图 11a ), 检测单元 32检测到基片 盒 50未放置到位。
较佳者， 所述升降装置 40包括升降驱动机构 41、 输出轴 42和波纹管 43 , 所述真空腔体 10的底部开设有安装孔 331 ,所述波纹管 43—端与所述升降驱动 机构 41相连， 另一端与所述安装孔 331相连， 所述升降驱动机构 41与输出轴 42相连并驱动所述输出轴 42沿垂直方向运动， 所述输出轴 42滑动穿过所述波 纹管 43和安装孔 331并与所述固定板 31固定连接。 所述波纹管 43使得真空腔 体 10外的大气环境和真空腔体 10内分隔开来， 有效地保持真空腔体 10内的真 空环境。 本发明中升降装置 40用于驱动基片盒载台 30在垂直方向上的运动， 使得基片盒 50中的基片与外部的机械手的高度一致， 方便机械手穿过出口闸阀 15取出基片。 其中， 升降驱动机构 41包括传感器和伺服电机， 通过传感器来检 测基片盒 50内基片的位置高度， 通过伺服电机来实现基片盒载台 30的升降定 位， 由于釆用该升降驱动机构 41来进行升降定位在现有技术中属于常用技术手 段， 再次就不予详述。 当基片盒 50在基片盒载台 30上固定好后， 升降驱动机 构 41 的传感器检测基片盒 50 内基片的高度（一般检测基片盒最下端基片的下 底面高度或者最上端基片的上端面高度）， 接着伺服电机动作， 推动固定板 31 运动， 使得被检测基片的高度与真空腔体 10外部机械手的高度一致， 完成机械 手与基片的对位操作。 较佳者， 所述基片上载装置 100还包括基片上载控制系统， 所述基片上载 控制系统分别与所述抽真空控制机构 20、 检测单元 32和升降装置 40电连接， 并控制所述抽真空控制机构 20、 检测单元 32和升降装置 40动作。 具体地， 基 片上载控制系统还与出口闸阀 15和门传感器电连接。
参考附图， 详细描述本发明基片上载装置 100进行基片上载的工作原理和 工作过程： 首先， 将基片盒 50送至密封腔门 14外部， 门传感器检测到基片盒 50的到达信号； 第一闸阀 231和第三闸阀 233打开， 充气系统开始工作， 直至 真空计 22检测到真空腔体 10内部的气压和外部相同， 关闭第一闸阀 231和第 三闸阀 233打开， 充气系统停止工作， 打开密封腔门 14; 将基片盒 50通过密封 腔门 14送至基片盒载台 30上， 固定板 31上的定位块 34将基片盒 50固定， 关 闭密封腔门； 第一闸阀 231和第三闸阀 233打开， 与第三闸阀 233相连的抽真 空系统、 以及与第一闸阀 231 相连的粗抽空系统开始进行前期抽真空操作， 当 真空腔体 10内的气压到达一定值时， 第一闸阀 231和第三闸阀 233关闭， 与之 相应的抽真空系统停止工作， 同时第二闸阀 232打开， 精抽空系统开始工作开 始后期抽真空操作， 直至真空腔体 10内的气压达到预定值。 当真空计 22检测 到真空腔体 10 内的气压为设定的范围时， 出口闸阀 15打开； 在抽真空持续操 作的同时，升降装置 40开始工作，输出轴 42推动固定板 31在垂直方向上移动， 直至承载在固定板 31上的基片盒 50从下往上的第一块基片下底面与真空腔体 10外部的机械手的高度一致， 基片上载控制系统发出信号， 外部的机械手通过 出口闸阀 15伸入腔体 10接住基片， 再经过出口闸阀 15离开真空腔体 10, 第一 基片上载完毕； 升降装置 40继续工作， 输出轴 42推动基片盒载台 30下降， 直 至基片盒 50从下往上的第一块基片下底面与真空腔体 10外部的机械手的高度 一致（即完成第二次对位）， 机械手穿过出口闸阀 15取出第二次基片， 重复上 述操作， 直至基片盒 50内的基片上载完毕， 关闭第二闸阀 232, 精抽空系统停 止工作， 完成基片上载工作。
当然， 基片除了可以由下往上的顺序上在载， 还可以由上往下的顺序上载， 基片盒载台 30在基片上载的过程中， 相应地逐步上升， 从而完成机械手与基片 的对位。 以上所揭露的仅为本发明的优选实施例而已， 当然不能以此来限定本发明 之权利范围， 因此依本发明申请专利范围所作的等同变化， 仍属本发明所涵盖 的范围。

Claims

权 利 要 求
1、 一种基片上载装置， 用于将基片盒中的基片通过机械手上载至生产线上， 其 特征在于， 包括：
真空腔体，所述真空腔体的腔壁上分别开设有供所述基片盒进出的基片入口、供 所述机械手进出的基片出口、 以及通气孔， 所述基片入口安装有与之相配合的密封 腔门， 所述基片出口上安装有出口闸阀；
抽真空控制机构， 所述抽真空控制机构包括真空管、真空计和真空闸阀， 所述真 空管的一端与所述通气孔相连通， 另一端分别连接抽真空系统和充气系统， 所述真 空计和真空闸阀均安装在所述真空管上；
基片盒载台，所述基片盒载台置于所述真空腔体内，所述基片盒载台包括承载基 片盒的固定板和检测基片盒状态的检测单元；
升降装置，所述升降装置的输出轴密封穿过所述真空腔体的底部与所述基片盒载 台固定相连， 并控制所述基片盒载台做升降运动。
2、 如权利要求 1所述的基片上载装置， 其特征在于， 所述真空管包括第一真空 管和第二真空管， 所述真空闸阀包括第一闸阀和第二闸阀， 所述第一真空管和第二 真空管一端均与所述通气孔相连， 所述第一真空管的另一端与粗抽空系统和充气系 统相连， 所述第二真空管的另一端与所述精抽空系统相连， 且所述第一真空管和第 二真空管上分别安装有所述第 ―闸阀和第二闸阀， 所述真空计安装在所述真空管接 近通气孔的位置上。
3、 如权利要求 1所述的基片上载装置， 其特征在于， 所述密封腔门与所述真空 腔体相接触的环形区域从内至外依次开设有相互平行的内圈凹槽、 中圈凹槽及外圈 凹槽， 所述内圈凹槽与外圈凹槽内分别装有密封圈， 所述中圈凹槽分别与所述内圈 凹槽和外圈凹槽相连通； 所述抽真空控制系统还包括第三真空管和第三闸阀， 所述 第三真空管的一端与所述中圈凹槽相连通， 另一端分别与抽真空系统和充气系统相 连， 所述第三闸阀安装在所述第三真空管上。
4、 如权利要求 1所述的基片上载装置， 其特征在于， 所述密封腔门上还安装有 门传感器。
5、 如权利要求 1所述的基片上载装置， 其特征在于， 所述固定板中部沿密封腔 门方向开设有凹槽， 所述凹槽两侧的固定板上设有若干个定位块， 且所述定位块围 成一个基片盒定位区。
6、 如权利要求 1所述的基片上载装置， 其特征在于， 所述检测单元包括光电传 感器、 传感器反射板、 传感器挡板、 挡板支架以及弹性部件； 所述固定板与所述基 片盒接触的部位开设有通槽， 所述传感器反射板安装在所述固定板下表面临近所述 通槽的位置， 所述光电传感器设置于所述传感器反射板正下方， 所述传感器挡板呈 Z 字形， 所述传感器挡板包括上板、 弯折板及下板， 所述传感器挡板的上板斜向上地 器与所述传感器反射板形成的光通路， 所述弯折板临近所述上板的一端旋转安装在 所述挡板支架上， 所述挡板支架固定在所述固定板下表面， 所述弯折板临近所述下 板的一端与所述弹性部件相连， 所述弹性部件的另一端与所述固定板相连。
7、 如权利要求 1所述的基片上载装置， 其特征在于， 所述升降装置包括升降驱 动机构、 输出轴和波纹管， 所述真空腔体的底部开设有安装孔， 所述波纹管一端与 所述升降驱动机构相连， 另一端与所述安装孔相连， 所述升降驱动机构与所述输出 轴相连并驱动所述输出轴沿垂直方向运动， 所述输出轴滑动穿过所述波纹管和安装 孔并与所述固定板固定连接。
8、如权利要求 1所述的基片上载装置， 其特征在于， 还包括基片上载控制系统， 所述基片上载控制系统分别与所述抽真空控制机构、 检测单元和升降装置电连接， 并控制所述抽真空控制机构、 检测单元和升降装置动作。
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