CN101814458B - 半导体装置 - Google Patents

半导体装置 Download PDF

Info

Publication number
CN101814458B
CN101814458B CN2010101293355A CN201010129335A CN101814458B CN 101814458 B CN101814458 B CN 101814458B CN 2010101293355 A CN2010101293355 A CN 2010101293355A CN 201010129335 A CN201010129335 A CN 201010129335A CN 101814458 B CN101814458 B CN 101814458B
Authority
CN
China
Prior art keywords
semiconductor device
rewiring
circuit
external
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010101293355A
Other languages
English (en)
Chinese (zh)
Other versions
CN101814458A (zh
Inventor
岩田悠贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN101814458A publication Critical patent/CN101814458A/zh
Application granted granted Critical
Publication of CN101814458B publication Critical patent/CN101814458B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/49—Adaptable interconnections, e.g. fuses or antifuses

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN2010101293355A 2004-12-03 2005-11-25 半导体装置 Expired - Fee Related CN101814458B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP350882/04 2004-12-03
JP2004350882 2004-12-03

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2005800052715A Division CN1922728B (zh) 2004-12-03 2005-11-25 半导体装置

Publications (2)

Publication Number Publication Date
CN101814458A CN101814458A (zh) 2010-08-25
CN101814458B true CN101814458B (zh) 2012-05-30

Family

ID=36564981

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2010101293355A Expired - Fee Related CN101814458B (zh) 2004-12-03 2005-11-25 半导体装置
CN2005800052715A Expired - Fee Related CN1922728B (zh) 2004-12-03 2005-11-25 半导体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2005800052715A Expired - Fee Related CN1922728B (zh) 2004-12-03 2005-11-25 半导体装置

Country Status (6)

Country Link
US (1) US20090166856A1 (https=)
JP (1) JP5039384B2 (https=)
KR (1) KR20070088266A (https=)
CN (2) CN101814458B (https=)
TW (1) TW200620574A (https=)
WO (1) WO2006059547A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102244021B (zh) * 2011-07-18 2013-05-01 江阴长电先进封装有限公司 Low-k芯片封装方法
JP2013026481A (ja) * 2011-07-22 2013-02-04 Teramikros Inc 半導体装置及び半導体装置の実装構造
US9343418B2 (en) 2013-11-05 2016-05-17 Xilinx, Inc. Solder bump arrangements for large area analog circuitry
US10115706B2 (en) * 2015-10-02 2018-10-30 Samsung Electronics Co., Ltd. Semiconductor chip including a plurality of pads
CN105575935A (zh) * 2016-02-25 2016-05-11 中国电子科技集团公司第十三研究所 Cmos驱动器晶圆级封装及其制作方法
JP7462089B1 (ja) 2023-03-13 2024-04-04 株式会社フジクラ 半導体パッケージ及びフェーズドアレイアンテナモジュール
JP7462088B1 (ja) 2023-03-13 2024-04-04 株式会社フジクラ 高周波モジュール及びフェーズドアレイアンテナモジュール

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5321299A (en) * 1990-05-30 1994-06-14 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
CN1250227A (zh) * 1998-09-18 2000-04-12 株式会社日立制作所 半导体装置
US6498396B1 (en) * 1995-03-30 2002-12-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor chip scale package and ball grid array structures
CN1389912A (zh) * 2002-06-13 2003-01-08 威盛电子股份有限公司 芯片封装结构及结构中的基底板
JP2004031790A (ja) * 2002-06-27 2004-01-29 Hitachi Maxell Ltd 半導体チップ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0639454Y2 (ja) * 1988-09-20 1994-10-12 三洋電機株式会社 半導体集積回路
TW577152B (en) * 2000-12-18 2004-02-21 Hitachi Ltd Semiconductor integrated circuit device
DE10139985B4 (de) * 2001-08-22 2005-10-27 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip sowie Verfahren zu seiner Herstellung
TW577160B (en) * 2002-02-04 2004-02-21 Casio Computer Co Ltd Semiconductor device and manufacturing method thereof
US6734472B2 (en) * 2002-04-25 2004-05-11 Synplicity, Inc. Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device
JP2004079701A (ja) * 2002-08-14 2004-03-11 Sony Corp 半導体装置及びその製造方法
JP5183186B2 (ja) * 2007-12-14 2013-04-17 ルネサスエレクトロニクス株式会社 半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5321299A (en) * 1990-05-30 1994-06-14 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
US6498396B1 (en) * 1995-03-30 2002-12-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor chip scale package and ball grid array structures
CN1250227A (zh) * 1998-09-18 2000-04-12 株式会社日立制作所 半导体装置
CN1389912A (zh) * 2002-06-13 2003-01-08 威盛电子股份有限公司 芯片封装结构及结构中的基底板
JP2004031790A (ja) * 2002-06-27 2004-01-29 Hitachi Maxell Ltd 半導体チップ

Also Published As

Publication number Publication date
CN101814458A (zh) 2010-08-25
JP5039384B2 (ja) 2012-10-03
WO2006059547A1 (ja) 2006-06-08
KR20070088266A (ko) 2007-08-29
CN1922728B (zh) 2010-05-05
CN1922728A (zh) 2007-02-28
TW200620574A (en) 2006-06-16
JPWO2006059547A1 (ja) 2008-06-05
TWI379387B (https=) 2012-12-11
US20090166856A1 (en) 2009-07-02

Similar Documents

Publication Publication Date Title
US11901251B2 (en) Semiconductor device having electrode pads arranged between groups of external electrodes
US7242093B2 (en) Semiconductor device
CN100550365C (zh) 电子器件及其承载衬底
JP2001351983A (ja) 半導体装置及びその製造方法
JP4776861B2 (ja) 半導体装置
CN101814458B (zh) 半导体装置
CN101142676B (zh) 电子器件和载体基板
JP4904601B2 (ja) 集積回路チップ上における電源及びグランドラインルーティングのための受動集積基板を有する集積回路組立体
WO1999013509A1 (fr) Dispositif a semi-conducteur
JP4890827B2 (ja) 半導体装置
JP3951788B2 (ja) 表面実装型電子部品
JP2003229428A (ja) 半導体装置
JP2014096504A (ja) 半導体装置
JP2010263234A (ja) 半導体集積回路装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120530

Termination date: 20181125