JP5039384B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

Info

Publication number
JP5039384B2
JP5039384B2 JP2006547854A JP2006547854A JP5039384B2 JP 5039384 B2 JP5039384 B2 JP 5039384B2 JP 2006547854 A JP2006547854 A JP 2006547854A JP 2006547854 A JP2006547854 A JP 2006547854A JP 5039384 B2 JP5039384 B2 JP 5039384B2
Authority
JP
Japan
Prior art keywords
semiconductor device
rewiring
external electrode
external
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006547854A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2006059547A1 (ja
Inventor
悠貴 岩田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2006547854A priority Critical patent/JP5039384B2/ja
Publication of JPWO2006059547A1 publication Critical patent/JPWO2006059547A1/ja
Application granted granted Critical
Publication of JP5039384B2 publication Critical patent/JP5039384B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/49—Adaptable interconnections, e.g. fuses or antifuses

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2006547854A 2004-12-03 2005-11-25 半導体装置 Expired - Fee Related JP5039384B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006547854A JP5039384B2 (ja) 2004-12-03 2005-11-25 半導体装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004350882 2004-12-03
JP2004350882 2004-12-03
PCT/JP2005/021686 WO2006059547A1 (ja) 2004-12-03 2005-11-25 半導体装置
JP2006547854A JP5039384B2 (ja) 2004-12-03 2005-11-25 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2006059547A1 JPWO2006059547A1 (ja) 2008-06-05
JP5039384B2 true JP5039384B2 (ja) 2012-10-03

Family

ID=36564981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006547854A Expired - Fee Related JP5039384B2 (ja) 2004-12-03 2005-11-25 半導体装置

Country Status (6)

Country Link
US (1) US20090166856A1 (https=)
JP (1) JP5039384B2 (https=)
KR (1) KR20070088266A (https=)
CN (2) CN101814458B (https=)
TW (1) TW200620574A (https=)
WO (1) WO2006059547A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024190254A1 (ja) 2023-03-13 2024-09-19 株式会社フジクラ 高周波モジュール及びフェーズドアレイアンテナモジュール
WO2024190784A1 (ja) 2023-03-13 2024-09-19 株式会社フジクラ 半導体パッケージ及びフェーズドアレイアンテナモジュール

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102244021B (zh) * 2011-07-18 2013-05-01 江阴长电先进封装有限公司 Low-k芯片封装方法
JP2013026481A (ja) * 2011-07-22 2013-02-04 Teramikros Inc 半導体装置及び半導体装置の実装構造
US9343418B2 (en) 2013-11-05 2016-05-17 Xilinx, Inc. Solder bump arrangements for large area analog circuitry
US10115706B2 (en) * 2015-10-02 2018-10-30 Samsung Electronics Co., Ltd. Semiconductor chip including a plurality of pads
CN105575935A (zh) * 2016-02-25 2016-05-11 中国电子科技集团公司第十三研究所 Cmos驱动器晶圆级封装及其制作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09107048A (ja) * 1995-03-30 1997-04-22 Mitsubishi Electric Corp 半導体パッケージ
JP2000100814A (ja) * 1998-09-18 2000-04-07 Hitachi Ltd 半導体装置
JP2004031790A (ja) * 2002-06-27 2004-01-29 Hitachi Maxell Ltd 半導体チップ

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0639454Y2 (ja) * 1988-09-20 1994-10-12 三洋電機株式会社 半導体集積回路
EP0460554A1 (en) * 1990-05-30 1991-12-11 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
TW577152B (en) * 2000-12-18 2004-02-21 Hitachi Ltd Semiconductor integrated circuit device
DE10139985B4 (de) * 2001-08-22 2005-10-27 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip sowie Verfahren zu seiner Herstellung
TW577160B (en) * 2002-02-04 2004-02-21 Casio Computer Co Ltd Semiconductor device and manufacturing method thereof
US6734472B2 (en) * 2002-04-25 2004-05-11 Synplicity, Inc. Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device
CN1180474C (zh) * 2002-06-13 2004-12-15 威盛电子股份有限公司 芯片封装结构及结构中的基底板
JP2004079701A (ja) * 2002-08-14 2004-03-11 Sony Corp 半導体装置及びその製造方法
JP5183186B2 (ja) * 2007-12-14 2013-04-17 ルネサスエレクトロニクス株式会社 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09107048A (ja) * 1995-03-30 1997-04-22 Mitsubishi Electric Corp 半導体パッケージ
JP2000100814A (ja) * 1998-09-18 2000-04-07 Hitachi Ltd 半導体装置
JP2004031790A (ja) * 2002-06-27 2004-01-29 Hitachi Maxell Ltd 半導体チップ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024190254A1 (ja) 2023-03-13 2024-09-19 株式会社フジクラ 高周波モジュール及びフェーズドアレイアンテナモジュール
WO2024190784A1 (ja) 2023-03-13 2024-09-19 株式会社フジクラ 半導体パッケージ及びフェーズドアレイアンテナモジュール
EP4682950A1 (en) 2023-03-13 2026-01-21 Fujikura Ltd. High-frequency module and phased array antenna module
EP4682951A1 (en) 2023-03-13 2026-01-21 Fujikura Ltd. Semiconductor package and phased array antenna module

Also Published As

Publication number Publication date
CN101814458A (zh) 2010-08-25
WO2006059547A1 (ja) 2006-06-08
KR20070088266A (ko) 2007-08-29
CN101814458B (zh) 2012-05-30
CN1922728B (zh) 2010-05-05
CN1922728A (zh) 2007-02-28
TW200620574A (en) 2006-06-16
JPWO2006059547A1 (ja) 2008-06-05
TWI379387B (https=) 2012-12-11
US20090166856A1 (en) 2009-07-02

Similar Documents

Publication Publication Date Title
US8310034B2 (en) Semiconductor device
US11901251B2 (en) Semiconductor device having electrode pads arranged between groups of external electrodes
US20080237645A1 (en) Semiconductor device
JP3221415B2 (ja) アナログ信号パッドのシールド法、および半導体集積回路
JP5039384B2 (ja) 半導体装置
JP4776861B2 (ja) 半導体装置
US5365103A (en) Punchthru ESD device along centerline of power pad
JP4904601B2 (ja) 集積回路チップ上における電源及びグランドラインルーティングのための受動集積基板を有する集積回路組立体
CN101950744A (zh) 半导体器件
JP2007059449A (ja) 半導体装置
JP2009194022A (ja) チップサイズパッケージ及び半導体装置
JP4890827B2 (ja) 半導体装置
JP2006202866A (ja) 半導体装置
US8427797B2 (en) ESD networks for solder bump integrated circuits
US8772915B2 (en) Mask programmable interface selection
JP3403981B2 (ja) 半導体装置
JP2009111333A (ja) 半導体装置
CN112992868B (zh) 具静电放电防护功能的半导体装置及静电放电的测试方法
JP2003229428A (ja) 半導体装置
JP2005142281A (ja) 半導体集積回路チップ及び半導体集積回路装置
WO2005053028A1 (ja) 静電破壊保護素子を備えた半導体装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20081023

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120110

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120307

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120703

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120709

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150713

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 5039384

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees