TWI379387B - - Google Patents

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Publication number
TWI379387B
TWI379387B TW094142400A TW94142400A TWI379387B TW I379387 B TWI379387 B TW I379387B TW 094142400 A TW094142400 A TW 094142400A TW 94142400 A TW94142400 A TW 94142400A TW I379387 B TWI379387 B TW I379387B
Authority
TW
Taiwan
Prior art keywords
rewiring
semiconductor device
external electrode
external
electrode
Prior art date
Application number
TW094142400A
Other languages
English (en)
Chinese (zh)
Other versions
TW200620574A (en
Inventor
Yuki Iwata
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of TW200620574A publication Critical patent/TW200620574A/zh
Application granted granted Critical
Publication of TWI379387B publication Critical patent/TWI379387B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/49—Adaptable interconnections, e.g. fuses or antifuses

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW094142400A 2004-12-03 2005-12-02 Semiconductor device TW200620574A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004350882 2004-12-03

Publications (2)

Publication Number Publication Date
TW200620574A TW200620574A (en) 2006-06-16
TWI379387B true TWI379387B (https=) 2012-12-11

Family

ID=36564981

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094142400A TW200620574A (en) 2004-12-03 2005-12-02 Semiconductor device

Country Status (6)

Country Link
US (1) US20090166856A1 (https=)
JP (1) JP5039384B2 (https=)
KR (1) KR20070088266A (https=)
CN (2) CN101814458B (https=)
TW (1) TW200620574A (https=)
WO (1) WO2006059547A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102244021B (zh) * 2011-07-18 2013-05-01 江阴长电先进封装有限公司 Low-k芯片封装方法
JP2013026481A (ja) * 2011-07-22 2013-02-04 Teramikros Inc 半導体装置及び半導体装置の実装構造
US9343418B2 (en) 2013-11-05 2016-05-17 Xilinx, Inc. Solder bump arrangements for large area analog circuitry
US10115706B2 (en) * 2015-10-02 2018-10-30 Samsung Electronics Co., Ltd. Semiconductor chip including a plurality of pads
CN105575935A (zh) * 2016-02-25 2016-05-11 中国电子科技集团公司第十三研究所 Cmos驱动器晶圆级封装及其制作方法
JP7462089B1 (ja) 2023-03-13 2024-04-04 株式会社フジクラ 半導体パッケージ及びフェーズドアレイアンテナモジュール
JP7462088B1 (ja) 2023-03-13 2024-04-04 株式会社フジクラ 高周波モジュール及びフェーズドアレイアンテナモジュール

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0639454Y2 (ja) * 1988-09-20 1994-10-12 三洋電機株式会社 半導体集積回路
EP0460554A1 (en) * 1990-05-30 1991-12-11 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
JPH09107048A (ja) * 1995-03-30 1997-04-22 Mitsubishi Electric Corp 半導体パッケージ
JP2000100814A (ja) * 1998-09-18 2000-04-07 Hitachi Ltd 半導体装置
TW577152B (en) * 2000-12-18 2004-02-21 Hitachi Ltd Semiconductor integrated circuit device
DE10139985B4 (de) * 2001-08-22 2005-10-27 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip sowie Verfahren zu seiner Herstellung
TW577160B (en) * 2002-02-04 2004-02-21 Casio Computer Co Ltd Semiconductor device and manufacturing method thereof
US6734472B2 (en) * 2002-04-25 2004-05-11 Synplicity, Inc. Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device
CN1180474C (zh) * 2002-06-13 2004-12-15 威盛电子股份有限公司 芯片封装结构及结构中的基底板
JP2004031790A (ja) * 2002-06-27 2004-01-29 Hitachi Maxell Ltd 半導体チップ
JP2004079701A (ja) * 2002-08-14 2004-03-11 Sony Corp 半導体装置及びその製造方法
JP5183186B2 (ja) * 2007-12-14 2013-04-17 ルネサスエレクトロニクス株式会社 半導体装置

Also Published As

Publication number Publication date
CN101814458A (zh) 2010-08-25
JP5039384B2 (ja) 2012-10-03
WO2006059547A1 (ja) 2006-06-08
KR20070088266A (ko) 2007-08-29
CN101814458B (zh) 2012-05-30
CN1922728B (zh) 2010-05-05
CN1922728A (zh) 2007-02-28
TW200620574A (en) 2006-06-16
JPWO2006059547A1 (ja) 2008-06-05
US20090166856A1 (en) 2009-07-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees