KR20070088266A - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR20070088266A
KR20070088266A KR1020067016831A KR20067016831A KR20070088266A KR 20070088266 A KR20070088266 A KR 20070088266A KR 1020067016831 A KR1020067016831 A KR 1020067016831A KR 20067016831 A KR20067016831 A KR 20067016831A KR 20070088266 A KR20070088266 A KR 20070088266A
Authority
KR
South Korea
Prior art keywords
external electrode
redistribution
semiconductor device
external
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020067016831A
Other languages
English (en)
Korean (ko)
Inventor
유키 이와타
Original Assignee
로무 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 로무 가부시키가이샤 filed Critical 로무 가부시키가이샤
Publication of KR20070088266A publication Critical patent/KR20070088266A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/49—Adaptable interconnections, e.g. fuses or antifuses

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020067016831A 2004-12-03 2005-11-25 반도체 장치 Withdrawn KR20070088266A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004350882 2004-12-03
JPJP-P-2004-00350882 2004-12-03

Publications (1)

Publication Number Publication Date
KR20070088266A true KR20070088266A (ko) 2007-08-29

Family

ID=36564981

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067016831A Withdrawn KR20070088266A (ko) 2004-12-03 2005-11-25 반도체 장치

Country Status (6)

Country Link
US (1) US20090166856A1 (https=)
JP (1) JP5039384B2 (https=)
KR (1) KR20070088266A (https=)
CN (2) CN101814458B (https=)
TW (1) TW200620574A (https=)
WO (1) WO2006059547A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102244021B (zh) * 2011-07-18 2013-05-01 江阴长电先进封装有限公司 Low-k芯片封装方法
JP2013026481A (ja) * 2011-07-22 2013-02-04 Teramikros Inc 半導体装置及び半導体装置の実装構造
US9343418B2 (en) 2013-11-05 2016-05-17 Xilinx, Inc. Solder bump arrangements for large area analog circuitry
US10115706B2 (en) * 2015-10-02 2018-10-30 Samsung Electronics Co., Ltd. Semiconductor chip including a plurality of pads
CN105575935A (zh) * 2016-02-25 2016-05-11 中国电子科技集团公司第十三研究所 Cmos驱动器晶圆级封装及其制作方法
JP7462089B1 (ja) 2023-03-13 2024-04-04 株式会社フジクラ 半導体パッケージ及びフェーズドアレイアンテナモジュール
JP7462088B1 (ja) 2023-03-13 2024-04-04 株式会社フジクラ 高周波モジュール及びフェーズドアレイアンテナモジュール

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0639454Y2 (ja) * 1988-09-20 1994-10-12 三洋電機株式会社 半導体集積回路
EP0460554A1 (en) * 1990-05-30 1991-12-11 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
JPH09107048A (ja) * 1995-03-30 1997-04-22 Mitsubishi Electric Corp 半導体パッケージ
JP2000100814A (ja) * 1998-09-18 2000-04-07 Hitachi Ltd 半導体装置
TW577152B (en) * 2000-12-18 2004-02-21 Hitachi Ltd Semiconductor integrated circuit device
DE10139985B4 (de) * 2001-08-22 2005-10-27 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip sowie Verfahren zu seiner Herstellung
TW577160B (en) * 2002-02-04 2004-02-21 Casio Computer Co Ltd Semiconductor device and manufacturing method thereof
US6734472B2 (en) * 2002-04-25 2004-05-11 Synplicity, Inc. Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device
CN1180474C (zh) * 2002-06-13 2004-12-15 威盛电子股份有限公司 芯片封装结构及结构中的基底板
JP2004031790A (ja) * 2002-06-27 2004-01-29 Hitachi Maxell Ltd 半導体チップ
JP2004079701A (ja) * 2002-08-14 2004-03-11 Sony Corp 半導体装置及びその製造方法
JP5183186B2 (ja) * 2007-12-14 2013-04-17 ルネサスエレクトロニクス株式会社 半導体装置

Also Published As

Publication number Publication date
CN101814458A (zh) 2010-08-25
JP5039384B2 (ja) 2012-10-03
WO2006059547A1 (ja) 2006-06-08
CN101814458B (zh) 2012-05-30
CN1922728B (zh) 2010-05-05
CN1922728A (zh) 2007-02-28
TW200620574A (en) 2006-06-16
JPWO2006059547A1 (ja) 2008-06-05
TWI379387B (https=) 2012-12-11
US20090166856A1 (en) 2009-07-02

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Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000