CN101809767B - 带有多量子阱结构的光电子半导体芯片 - Google Patents

带有多量子阱结构的光电子半导体芯片 Download PDF

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Publication number
CN101809767B
CN101809767B CN2008801089782A CN200880108978A CN101809767B CN 101809767 B CN101809767 B CN 101809767B CN 2008801089782 A CN2008801089782 A CN 2008801089782A CN 200880108978 A CN200880108978 A CN 200880108978A CN 101809767 B CN101809767 B CN 101809767B
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quantum well
semiconductor chip
layer
well layer
layers
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CN101809767A (zh
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彼得·施陶斯
马蒂亚斯·彼得
亚历山大·沃尔特
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
    • H01S5/3086—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure doping of the active layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Led Devices (AREA)
CN2008801089782A 2007-09-26 2008-09-12 带有多量子阱结构的光电子半导体芯片 Active CN101809767B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007046027A DE102007046027A1 (de) 2007-09-26 2007-09-26 Optoelektronischer Halbleiterchip mit einer Mehrfachquantentopfstruktur
DE102007046027.0 2007-09-26
PCT/DE2008/001534 WO2009039830A1 (de) 2007-09-26 2008-09-12 Optoelektronischer halbleiterchip mit einer mehrfachquantentopfstruktur

Publications (2)

Publication Number Publication Date
CN101809767A CN101809767A (zh) 2010-08-18
CN101809767B true CN101809767B (zh) 2012-06-13

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CN2008801089782A Active CN101809767B (zh) 2007-09-26 2008-09-12 带有多量子阱结构的光电子半导体芯片

Country Status (8)

Country Link
US (1) US8173991B2 (enExample)
EP (1) EP2208240B1 (enExample)
JP (1) JP5404628B2 (enExample)
KR (1) KR101488846B1 (enExample)
CN (1) CN101809767B (enExample)
DE (1) DE102007046027A1 (enExample)
TW (1) TWI443859B (enExample)
WO (1) WO2009039830A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
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TWI496318B (zh) * 2009-06-08 2015-08-11 Epistar Corp 發光元件及其製造方法
KR100993085B1 (ko) 2009-12-07 2010-11-08 엘지이노텍 주식회사 발광 소자, 발광 소자 패키지 및 라이트 유닛
DE102009060749B4 (de) 2009-12-30 2021-12-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip
DE102009060747B4 (de) 2009-12-30 2025-01-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterchip
TWI557936B (zh) 2010-04-30 2016-11-11 美國波士頓大學信託會 具能帶結構位變動之高效率紫外光發光二極體
KR101637596B1 (ko) * 2010-07-09 2016-07-07 엘지이노텍 주식회사 발광소자
JP6005346B2 (ja) * 2011-08-12 2016-10-12 シャープ株式会社 窒化物半導体発光素子およびその製造方法
DE102013104351B4 (de) 2013-04-29 2022-01-20 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterschichtenfolge und Verfahren zum Betreiben eines optoelektronischen Halbleiterchips
JP6426359B2 (ja) * 2014-03-24 2018-11-21 株式会社東芝 半導体発光素子及びその製造方法
DE102014111058A1 (de) 2014-08-04 2016-02-04 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung
FR3028671B1 (fr) * 2014-11-19 2018-03-09 Commissariat A L'energie Atomique Et Aux Energies Alternatives Diode electroluminescente a puits quantiques dopes et procede de fabrication associe
JP6188866B2 (ja) * 2016-05-19 2017-08-30 シャープ株式会社 窒化物半導体発光素子の製造方法
DE102016120419A1 (de) 2016-10-26 2018-04-26 Osram Opto Semiconductors Gmbh Halbleiterkörper
KR20200009843A (ko) 2018-07-20 2020-01-30 홍익대학교 산학협력단 광전 소자 및 그 제조 방법
JP2020167321A (ja) * 2019-03-29 2020-10-08 旭化成株式会社 窒化物半導体発光素子
JP7469677B2 (ja) * 2019-11-26 2024-04-17 日亜化学工業株式会社 窒化物半導体素子
CN118782700B (zh) * 2024-09-11 2024-11-22 江西兆驰半导体有限公司 用于Micro-LED的外延片及其制备方法、Micro-LED

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WO2003065526A1 (en) * 2002-01-31 2003-08-07 Nec Corporation Quantum well structure and semiconductor element using it and production method of semiconductor element
WO2004051759A1 (ja) * 2002-12-03 2004-06-17 Nec Corporation 量子井戸構造を有する半導体光素子およびその製造方法

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WO2002080320A1 (fr) * 2001-03-28 2002-10-10 Nichia Corporation Element semi-conducteur a base de nitrure
WO2003065526A1 (en) * 2002-01-31 2003-08-07 Nec Corporation Quantum well structure and semiconductor element using it and production method of semiconductor element
WO2004051759A1 (ja) * 2002-12-03 2004-06-17 Nec Corporation 量子井戸構造を有する半導体光素子およびその製造方法

Also Published As

Publication number Publication date
KR101488846B1 (ko) 2015-02-03
TW200924245A (en) 2009-06-01
EP2208240A1 (de) 2010-07-21
TWI443859B (zh) 2014-07-01
CN101809767A (zh) 2010-08-18
US8173991B2 (en) 2012-05-08
KR20100056572A (ko) 2010-05-27
JP5404628B2 (ja) 2014-02-05
US20110042643A1 (en) 2011-02-24
JP2010541223A (ja) 2010-12-24
EP2208240B1 (de) 2018-08-29
WO2009039830A1 (de) 2009-04-02
DE102007046027A1 (de) 2009-04-02

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