CN101801586B - 用于产生具有线形射束横截面的激光射束的方法和装置 - Google Patents
用于产生具有线形射束横截面的激光射束的方法和装置 Download PDFInfo
- Publication number
- CN101801586B CN101801586B CN2008801070697A CN200880107069A CN101801586B CN 101801586 B CN101801586 B CN 101801586B CN 2008801070697 A CN2008801070697 A CN 2008801070697A CN 200880107069 A CN200880107069 A CN 200880107069A CN 101801586 B CN101801586 B CN 101801586B
- Authority
- CN
- China
- Prior art keywords
- laser beam
- imaging
- axis
- aperture
- minor axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
- G02B27/0966—Cylindrical lenses
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Lenses (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
- Microscoopes, Condenser (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007044298A DE102007044298B3 (de) | 2007-09-17 | 2007-09-17 | Verfahren und Anordnung zum Erzeugen eines Laserstrahls mit einem linienhaften Strahlquerschnitt |
| DE102007044298.1 | 2007-09-17 | ||
| PCT/DE2008/001181 WO2009036716A1 (de) | 2007-09-17 | 2008-07-18 | Verfahren und anordnung zum erzeugen eines laserstrahls mit einem linienhaften strahlquerschnitt |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101801586A CN101801586A (zh) | 2010-08-11 |
| CN101801586B true CN101801586B (zh) | 2013-12-11 |
Family
ID=40070896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801070697A Expired - Fee Related CN101801586B (zh) | 2007-09-17 | 2008-07-18 | 用于产生具有线形射束横截面的激光射束的方法和装置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5548127B2 (enExample) |
| KR (1) | KR101529344B1 (enExample) |
| CN (1) | CN101801586B (enExample) |
| DE (1) | DE102007044298B3 (enExample) |
| WO (1) | WO2009036716A1 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010027196B4 (de) * | 2010-07-07 | 2012-03-08 | Carl Zeiss Laser Optics Gmbh | Optisches System zum Erzeugen eines Linienfokus sowie Vorrichtung zum Behandeln eines Substrats mit einem solchen optischen System |
| DE102010045620B4 (de) * | 2010-09-17 | 2016-09-01 | Limo Patentverwaltung Gmbh & Co. Kg | Vorrichtung zur Erzeugung einer linienförmigen Intensitätsverteilung in einer Arbeitsebene |
| KR101257827B1 (ko) * | 2012-09-20 | 2013-04-29 | (주)프로비전 | 라인형 레이저 빔 형성 장치 및 이를 이용한 터치 패널 제조 방법 |
| DE102012111098B4 (de) * | 2012-11-19 | 2016-03-03 | Scanlab Ag | Divergenzänderungsvorrichtung |
| DE102014213775B4 (de) * | 2014-07-15 | 2018-02-15 | Innolas Solutions Gmbh | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten |
| DE102015002537B4 (de) * | 2015-02-27 | 2017-11-09 | Innovavent Gmbh | Optisches System und optisches Verfahren zum Homogenisieren der Intensität von Laserstrahlung sowie Anlage zur Bearbeitung von Dünnfilmschichten |
| KR102440115B1 (ko) | 2015-11-13 | 2022-09-05 | 삼성디스플레이 주식회사 | 엑시머 레이저 어닐링 방법 |
| PL3491450T3 (pl) * | 2016-07-27 | 2024-06-24 | Trumpf Laser Gmbh | Naświetlanie linią laserową |
| DE102017115964B4 (de) | 2017-07-14 | 2020-04-02 | LIMO GmbH | Vorrichtung zur Erzeugung einer linienförmigen Intensitätsverteilung einer Laserstrahlung |
| US11366331B2 (en) * | 2017-12-05 | 2022-06-21 | Panasonic Intellectual Property Management Co., Ltd. | Beam converting optical system and light source device |
| DE102018216940A1 (de) | 2018-10-02 | 2020-04-02 | 3D-Micromac Ag | Laserbearbeitungssystem |
| DE102019102511B4 (de) * | 2019-01-31 | 2020-08-20 | Trumpf Laser- Und Systemtechnik Gmbh | Lasersystem |
| DE102019206976B3 (de) * | 2019-05-14 | 2020-11-12 | Trumpf Laser Gmbh | Optisches System zum Erzeugen zweier Laserfokuslinien sowie Verfahren zum gleichzeitigen Bearbeiten zweier einander gegenüberliegender, paralleler Werkstückseiten eines Werkstücks |
| DE102019118676B4 (de) * | 2019-07-10 | 2021-10-21 | Innovavent Gmbh | Optisches System zur Homogenisierung der Intensität von Lichtstrahlung und Anlage zur Bearbeitung einer Halbleitermaterialschicht |
| DE102020126267A1 (de) * | 2020-10-07 | 2022-04-07 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung zum Erzeugen einer Laserlinie auf einer Arbeitsebene |
| DE102020130651B3 (de) | 2020-11-19 | 2022-05-05 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung zum Erzeugen einer definierten Laserbeleuchtung auf einer Arbeitsebene |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1201154A (zh) * | 1997-05-29 | 1998-12-09 | 中国科学院上海光学精密机械研究所 | 超精细结构的光学测量系统 |
| US6215595B1 (en) * | 1996-02-06 | 2001-04-10 | Semiconductor Energy Laboratory Co., Ltd | Apparatus and method for laser radiation |
| CN1374562A (zh) * | 2001-02-22 | 2002-10-16 | 石川岛播磨重工业株式会社 | 照明光学系统及配备该光学系统的激光器处理装置 |
| US6583937B1 (en) * | 1998-11-30 | 2003-06-24 | Carl-Zeiss Stiftung | Illuminating system of a microlithographic projection exposure arrangement |
| JP2005079470A (ja) * | 2003-09-02 | 2005-03-24 | Nikon Corp | 照明光学系の調整方法、露光装置及び方法、並びにデバイス製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7009140B2 (en) * | 2001-04-18 | 2006-03-07 | Cymer, Inc. | Laser thin film poly-silicon annealing optical system |
| JPWO2004017392A1 (ja) * | 2002-08-13 | 2005-12-08 | 株式会社東芝 | レーザ照射方法 |
| WO2005085935A1 (de) * | 2004-03-06 | 2005-09-15 | Hentze-Lissotschenko Gmbh & Co. Kg | Vorrichtung zur homogenisierung von licht sowie anordnung zur beleuchtung oder fokussierung mit einer derartigen vorrichtung |
| KR20070090246A (ko) * | 2004-12-22 | 2007-09-05 | 칼 짜이스 레이저 옵틱스 게엠베하 | 선형 빔을 형성하기 위한 광 조명 시스템 |
| WO2007049525A1 (en) * | 2005-10-26 | 2007-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus and manufacturing method of semiconductor device |
-
2007
- 2007-09-17 DE DE102007044298A patent/DE102007044298B3/de not_active Expired - Fee Related
-
2008
- 2008-07-18 JP JP2010524341A patent/JP5548127B2/ja not_active Expired - Fee Related
- 2008-07-18 WO PCT/DE2008/001181 patent/WO2009036716A1/de not_active Ceased
- 2008-07-18 CN CN2008801070697A patent/CN101801586B/zh not_active Expired - Fee Related
- 2008-07-18 KR KR1020107005492A patent/KR101529344B1/ko not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6215595B1 (en) * | 1996-02-06 | 2001-04-10 | Semiconductor Energy Laboratory Co., Ltd | Apparatus and method for laser radiation |
| CN1201154A (zh) * | 1997-05-29 | 1998-12-09 | 中国科学院上海光学精密机械研究所 | 超精细结构的光学测量系统 |
| US6583937B1 (en) * | 1998-11-30 | 2003-06-24 | Carl-Zeiss Stiftung | Illuminating system of a microlithographic projection exposure arrangement |
| CN1374562A (zh) * | 2001-02-22 | 2002-10-16 | 石川岛播磨重工业株式会社 | 照明光学系统及配备该光学系统的激光器处理装置 |
| JP2005079470A (ja) * | 2003-09-02 | 2005-03-24 | Nikon Corp | 照明光学系の調整方法、露光装置及び方法、並びにデバイス製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101529344B1 (ko) | 2015-06-16 |
| WO2009036716A1 (de) | 2009-03-26 |
| JP2011501872A (ja) | 2011-01-13 |
| DE102007044298B3 (de) | 2009-02-26 |
| KR20100065326A (ko) | 2010-06-16 |
| CN101801586A (zh) | 2010-08-11 |
| JP5548127B2 (ja) | 2014-07-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101801586B (zh) | 用于产生具有线形射束横截面的激光射束的方法和装置 | |
| CN103658978B (zh) | 激光加工装置 | |
| TWI635923B (zh) | 雷射處理設備 | |
| JP2022058942A (ja) | 電子光学システム | |
| TWI546147B (zh) | 用於照射半導體材料之裝置及其用途 | |
| JP6083284B2 (ja) | レーザ加工装置 | |
| JP5241129B2 (ja) | レーザ加工装置及びレーザ加工方法 | |
| WO2009154074A1 (ja) | レーザ加工装置 | |
| JP2012030267A (ja) | レーザビーム照射装置、およびレーザビーム照射方法 | |
| JP7590821B2 (ja) | 光放射の強度を均質化するための光学システム | |
| US20230236431A1 (en) | Device for generating a laser line on a work plane | |
| Li et al. | Nanostructuring in submicron-level waveguides with femtosecond laser pulses | |
| JP5205035B2 (ja) | 光ビーム分岐装置、照射装置、光ビームの分岐方法、電子デバイスの製造方法、および精密部品の製造方法 | |
| JP7513845B2 (ja) | 画定されたレーザ照射を作業面に生成するための装置 | |
| JP4721798B2 (ja) | 電子線装置 | |
| JP2008027965A5 (enExample) | ||
| TW202043849A (zh) | 在工作平面上產生線性強度分佈的裝置 | |
| JP4665241B2 (ja) | ビーム整形光学装置 | |
| JP2004361481A (ja) | 均一照射装置及び照射方法 | |
| JP2008105046A (ja) | ビーム照射方法、及び、ビーム照射装置 | |
| JP2008218601A (ja) | ビーム照射装置、及び、ビーム照射方法 | |
| CN112236837B (zh) | 电子束装置 | |
| Fan et al. | Fully utilizing high power diode lasers by synergizing diode laser light sources and beam shaping micro-optics | |
| JP2003266192A (ja) | レーザ加工装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131211 Termination date: 20200718 |