CN101764105B - 具有空洞部的电路基板及其制造方法、使用该电路基板的电路装置的制造方法 - Google Patents

具有空洞部的电路基板及其制造方法、使用该电路基板的电路装置的制造方法 Download PDF

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Publication number
CN101764105B
CN101764105B CN2009101338368A CN200910133836A CN101764105B CN 101764105 B CN101764105 B CN 101764105B CN 2009101338368 A CN2009101338368 A CN 2009101338368A CN 200910133836 A CN200910133836 A CN 200910133836A CN 101764105 B CN101764105 B CN 101764105B
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CN
China
Prior art keywords
conductive foil
upper substrate
infrabasal plate
blank part
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009101338368A
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English (en)
Chinese (zh)
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CN101764105A (zh
Inventor
成田悟郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ELEMENT ELECTRONICS KK
Element Denshi Co Ltd
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ELEMENT ELECTRONICS KK
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Publication date
Application filed by ELEMENT ELECTRONICS KK filed Critical ELEMENT ELECTRONICS KK
Publication of CN101764105A publication Critical patent/CN101764105A/zh
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48153—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/48195—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being a discrete passive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN2009101338368A 2008-12-22 2009-04-03 具有空洞部的电路基板及其制造方法、使用该电路基板的电路装置的制造方法 Expired - Fee Related CN101764105B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP324910/08 2008-12-22
JP2008324910A JP4859253B2 (ja) 2008-12-22 2008-12-22 空洞部を有する回路基板、その製造方法およびそれを用いた回路装置の製造方法

Publications (2)

Publication Number Publication Date
CN101764105A CN101764105A (zh) 2010-06-30
CN101764105B true CN101764105B (zh) 2012-06-06

Family

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Family Applications (1)

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CN2009101338368A Expired - Fee Related CN101764105B (zh) 2008-12-22 2009-04-03 具有空洞部的电路基板及其制造方法、使用该电路基板的电路装置的制造方法

Country Status (4)

Country Link
JP (1) JP4859253B2 (enExample)
KR (1) KR101074927B1 (enExample)
CN (1) CN101764105B (enExample)
TW (1) TWI371993B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5351422B2 (ja) 2007-10-30 2013-11-27 株式会社小松製作所 流体式動力伝達システム
US8519542B2 (en) * 2010-08-03 2013-08-27 Xilinx, Inc. Air through-silicon via structure
US8754529B2 (en) * 2011-03-28 2014-06-17 Miradia, Inc. MEMS device with simplified electrical conducting paths
TWI431742B (zh) * 2011-04-27 2014-03-21 Unimicron Technology Corp 線路板製造方法及基層線路板
KR101828063B1 (ko) 2011-05-17 2018-02-09 삼성전자주식회사 반도체 장치 및 그 형성방법
JP5668664B2 (ja) 2011-10-12 2015-02-12 船井電機株式会社 マイクロホン装置、マイクロホン装置を備えた電子機器、マイクロホン装置の製造方法、マイクロホン装置用基板およびマイクロホン装置用基板の製造方法
JP2016048768A (ja) * 2014-08-28 2016-04-07 日立化成株式会社 配線板及び半導体装置の製造方法
CN114466512B (zh) * 2021-12-24 2023-08-22 江苏普诺威电子股份有限公司 Mems埋容埋阻封装载板及其制作工艺

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1901758A (zh) * 2005-07-19 2007-01-24 青岛歌尔电子有限公司 电容式硅传声器
JP2008124435A (ja) * 2006-11-09 2008-05-29 Samsung Electronics Co Ltd マルチスタックパッケージ及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214819A (ja) * 1998-01-28 1999-08-06 Sony Corp 配線板及びその製造方法
US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
JP2002237682A (ja) * 2001-02-08 2002-08-23 Cmk Corp 部品実装用凹部を備えた多層プリント配線板及びその製造方法
JP2002290032A (ja) * 2001-03-24 2002-10-04 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP4899269B2 (ja) * 2001-08-09 2012-03-21 株式会社村田製作所 電子部品ユニットおよびその製造方法
JP3941463B2 (ja) * 2001-11-06 2007-07-04 凸版印刷株式会社 多層プリント配線板の製造方法
JP2007150514A (ja) * 2005-11-25 2007-06-14 Matsushita Electric Works Ltd マイクロホンパッケージ
JP2007250608A (ja) * 2006-03-14 2007-09-27 Element Denshi:Kk 中空部を有する回路基板、その製造方法およびそれを用いた回路装置の製造方法
JP4844294B2 (ja) * 2006-08-30 2011-12-28 パナソニック株式会社 複合配線基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1901758A (zh) * 2005-07-19 2007-01-24 青岛歌尔电子有限公司 电容式硅传声器
JP2008124435A (ja) * 2006-11-09 2008-05-29 Samsung Electronics Co Ltd マルチスタックパッケージ及びその製造方法

Also Published As

Publication number Publication date
CN101764105A (zh) 2010-06-30
KR20100073951A (ko) 2010-07-01
TW201026171A (en) 2010-07-01
TWI371993B (en) 2012-09-01
JP2010147955A (ja) 2010-07-01
JP4859253B2 (ja) 2012-01-25
KR101074927B1 (ko) 2011-10-18

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