CN101754586A - 印刷电路板的制备方法及由该方法制备的印刷电路板 - Google Patents

印刷电路板的制备方法及由该方法制备的印刷电路板 Download PDF

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Publication number
CN101754586A
CN101754586A CN200910224596A CN200910224596A CN101754586A CN 101754586 A CN101754586 A CN 101754586A CN 200910224596 A CN200910224596 A CN 200910224596A CN 200910224596 A CN200910224596 A CN 200910224596A CN 101754586 A CN101754586 A CN 101754586A
Authority
CN
China
Prior art keywords
printed circuit
circuit board
pcb
printing
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200910224596A
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English (en)
Chinese (zh)
Inventor
许顺永
朴成实
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sonid Inc
Original Assignee
Exax Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Exax Inc filed Critical Exax Inc
Publication of CN101754586A publication Critical patent/CN101754586A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN200910224596A 2008-12-05 2009-11-19 印刷电路板的制备方法及由该方法制备的印刷电路板 Pending CN101754586A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080122951A KR100983219B1 (ko) 2008-12-05 2008-12-05 직접인쇄방식에 의한 인쇄회로기판의 제조방법 및 이에 의하여 제조된 인쇄회로기판
KR10-2008-0122951 2008-12-05

Publications (1)

Publication Number Publication Date
CN101754586A true CN101754586A (zh) 2010-06-23

Family

ID=41402403

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910224596A Pending CN101754586A (zh) 2008-12-05 2009-11-19 印刷电路板的制备方法及由该方法制备的印刷电路板

Country Status (6)

Country Link
US (1) US20100263917A1 (https=)
EP (1) EP2200410A1 (https=)
JP (1) JP2010135752A (https=)
KR (1) KR100983219B1 (https=)
CN (1) CN101754586A (https=)
TW (1) TW201031307A (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102186305A (zh) * 2011-05-06 2011-09-14 沈李豪 印制线路板、多层印制线路板及其制造方法
CN102856638A (zh) * 2011-06-30 2013-01-02 晶钛国际电子股份有限公司 形成天线的方法
CN104527246A (zh) * 2014-12-23 2015-04-22 睿芯(大连)股份有限公司 一种含有rfid电子标签的彩色包装产品的凹版印刷方法
CN107474724A (zh) * 2016-06-07 2017-12-15 鹏鼎控股(深圳)股份有限公司 覆铜基板的制备方法
CN109548270A (zh) * 2018-11-09 2019-03-29 广东洲明节能科技有限公司 线路板及其制作方法
CN111613888A (zh) * 2020-06-02 2020-09-01 华中科技大学 一种多层互联立体电路的一体化共形制造方法以及产品

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* Cited by examiner, † Cited by third party
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WO2011132346A1 (ja) * 2010-04-22 2011-10-27 シャープ株式会社 表示装置
CN102303464A (zh) * 2011-07-04 2012-01-04 昆山兴协和光电科技有限公司 笔记型键盘线路板的全自动卷式印刷工艺及印刷组件
KR20130066929A (ko) 2011-12-13 2013-06-21 한국전자통신연구원 패턴 형성 조성물 및 이를 이용한 패턴 형성 방법
CN104144873B (zh) 2012-03-05 2017-12-05 英派尔科技开发有限公司 柔性电路
DE102012221940B4 (de) * 2012-11-30 2022-05-12 Robert Bosch Gmbh Modul zur drahtlosen Kommunikation und Verfahren zum Herstellen eines Moduls zur drahtlosen Kommunikation
KR101489206B1 (ko) * 2013-03-27 2015-02-04 하이쎌(주) 도금층을 포함하는 양면 연성 인쇄회로기판 및 이의 제조방법
WO2015162546A1 (en) * 2014-04-22 2015-10-29 Sabic Global Technologies B.V. Ultraviolet curable transfer coating for applying nanometer sized metal particles to polymer surface
CN106661255A (zh) 2014-08-07 2017-05-10 沙特基础工业全球技术有限公司 用于热成型应用的导电多层片材
TWI574595B (zh) 2015-10-28 2017-03-11 財團法人工業技術研究院 多層線路的製作方法與多層線路結構
DE202017100537U1 (de) * 2017-02-01 2017-02-20 ASTRA Gesellschaft für Asset Management mbH & Co. KG Elektrischer Leiter
CN115241135A (zh) * 2021-04-23 2022-10-25 北京梦之墨科技有限公司 一种晶圆级封装结构及工艺

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CN101236797A (zh) * 2007-01-24 2008-08-06 三之星机带株式会社 铜导体浆料、导体电路板和电子部品
CN101291808A (zh) * 2005-08-19 2008-10-22 旭化成株式会社 层叠体及其制造方法

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JPH04222889A (ja) * 1990-12-25 1992-08-12 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト
JP3341311B2 (ja) * 1992-10-05 2002-11-05 松下電器産業株式会社 フレキシブル配線板およびその製造方法
US5461202A (en) * 1992-10-05 1995-10-24 Matsushita Electric Industrial Co., Ltd. Flexible wiring board and its fabrication method
US5508228A (en) * 1994-02-14 1996-04-16 Microelectronics And Computer Technology Corporation Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same
JP2928223B2 (ja) * 1997-04-04 1999-08-03 オクシデンタル ケミカル コーポレイション 集積回路チップのサーキットリーへの結合方法
JP3520031B2 (ja) * 1999-06-11 2004-04-19 株式会社日本触媒 ポリアミド酸含有微粒子分散組成物およびその製造方法
US6528145B1 (en) * 2000-06-29 2003-03-04 International Business Machines Corporation Polymer and ceramic composite electronic substrates
US6576493B1 (en) * 2000-10-13 2003-06-10 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
JP3768104B2 (ja) * 2001-01-22 2006-04-19 ソニーケミカル株式会社 フレキシブルプリント基板
US20040178391A1 (en) * 2003-01-29 2004-09-16 Conaghan Brian F. High conductivity inks with low minimum curing temperatures
US7211205B2 (en) * 2003-01-29 2007-05-01 Parelec, Inc. High conductivity inks with improved adhesion
US7169330B2 (en) * 2004-02-25 2007-01-30 E. I. Du Pont De Nemours And Company Composition of conductive paste
US7745516B2 (en) * 2005-10-12 2010-06-29 E. I. Du Pont De Nemours And Company Composition of polyimide and sterically-hindered hydrophobic epoxy
KR100734234B1 (ko) * 2006-05-29 2007-07-02 전자부품연구원 다층 인쇄회로기판 및 그 제조방법
KR100815251B1 (ko) 2006-10-17 2008-03-19 이종욱 인터페이스에프피씨비
KR20080082365A (ko) * 2007-03-08 2008-09-11 삼성전자주식회사 금속 코어를 사용한 ｐｃｂ, 그 제조방법 및 반도체 패키지제조방법

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101291808A (zh) * 2005-08-19 2008-10-22 旭化成株式会社 层叠体及其制造方法
CN101236797A (zh) * 2007-01-24 2008-08-06 三之星机带株式会社 铜导体浆料、导体电路板和电子部品

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102186305A (zh) * 2011-05-06 2011-09-14 沈李豪 印制线路板、多层印制线路板及其制造方法
CN102856638A (zh) * 2011-06-30 2013-01-02 晶钛国际电子股份有限公司 形成天线的方法
CN104527246A (zh) * 2014-12-23 2015-04-22 睿芯(大连)股份有限公司 一种含有rfid电子标签的彩色包装产品的凹版印刷方法
CN107474724A (zh) * 2016-06-07 2017-12-15 鹏鼎控股(深圳)股份有限公司 覆铜基板的制备方法
CN107474724B (zh) * 2016-06-07 2019-10-18 鹏鼎控股(深圳)股份有限公司 覆铜基板的制备方法
CN109548270A (zh) * 2018-11-09 2019-03-29 广东洲明节能科技有限公司 线路板及其制作方法
CN111613888A (zh) * 2020-06-02 2020-09-01 华中科技大学 一种多层互联立体电路的一体化共形制造方法以及产品

Also Published As

Publication number Publication date
KR100983219B1 (ko) 2010-09-20
EP2200410A1 (en) 2010-06-23
TW201031307A (en) 2010-08-16
KR20100064494A (ko) 2010-06-15
JP2010135752A (ja) 2010-06-17
US20100263917A1 (en) 2010-10-21

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Application publication date: 20100623