CN101752173A - Vacuum processing apparatus, vacuum processing system and processing method - Google Patents
Vacuum processing apparatus, vacuum processing system and processing method Download PDFInfo
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- CN101752173A CN101752173A CN200910254266A CN200910254266A CN101752173A CN 101752173 A CN101752173 A CN 101752173A CN 200910254266 A CN200910254266 A CN 200910254266A CN 200910254266 A CN200910254266 A CN 200910254266A CN 101752173 A CN101752173 A CN 101752173A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
- H01J37/185—Means for transferring objects between different enclosures of different pressure or atmosphere
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Abstract
The present invention provides a vacuum processing apparatus, a vacuum processing system and a processing method, wherein the vacuum processing apparatus is capable of restraining the size of a vacuum processing container to the utmost even though an object to be processed is large, and the vacuum processing system is capable of conveying the objects to be processed to the vacuum processing apparatus without usage of large-sized conveying arms. When a substrage (S) is conveyed to a plasma processing device (100) from a first vacuum conveying device (200a), air is injected to the back face of the substrate to float the substrate through an air injection hole (207) of a conveying station (203), the substrate is held by holding components (203) of a pair of guiding devices (205), such that a movable support body (217) moves toward the plasma processing device on a track (215). The the holding components (213) is released, the substrate is floated stilly by the air injected through the air injection hole (103b) of a carrying station (103), and the substrate is transferred to the plasma processing device.
Description
Technical field
The present invention relates under vacuum state, the handled objects such as glass substrate of for example flat-panel monitor (FPD) usefulness be carried out vacuum treatment installation, vacuum flush system and the processing method of plasma treatment etc. with this vacuum treatment installation.
Background technology
In the manufacture process of FPD that with LCD (LCD) is representative, under vacuum, handled objects such as glass substrate are carried out various processing such as etching, film forming.For utilizing plasma to carry out above-mentioned processing, use vacuum treatment installation with the container handling that can vacuumize.In addition, as mechanism to vacuum treatment installation conveyance handled object, use have vacuum lower support handled object can rotary extension the vacuum carrying device of carrying arm.
In recent years, be to improve the production efficiency of FPD, the requirement of the maximization of handled object is strengthened day by day, corresponding with it, vacuum treatment installation, vacuum carrying device also have the trend of maximization.At present, also exist the situation that the huge glass substrate of the monolateral 2m of surpassing is handled as handled object, can think definitely that the maximization of handled object also can further be developed in the future.Therefore, the maximization of vacuum treatment installation and vacuum carrying device will inevitably arrive.
From the action of the mounting table of vacuum carrying device mounting handled object in container handling handing-over handled object at vacuum treatment installation be by constitute can free oscilaltion lift-pin mechanism carry out.In the handing-over of the handled object that uses this lift-pin mechanism to carry out, need enough altitude margins at the delivery position place, between handled object and mounting table, make the support unit (fork) of carrying arm can insert safely, withdraw from.Particularly under the situation of the large-scale handled object of handing-over, need the driving stroke of the deflection setting lifter pin of consideration handled object, corresponding with it, also must make the height of container handling enough big.
In addition, corresponding with the maximization of handled object, if the vacuum carrying device is maximized, then require under the state of supporting handled object, to stretch, the carrying arm of spinning movement has rigidity and the driveability higher than prior art.The vacuum carrying device need be designed to the supporting large-scale handled object state under carrying arm can rotate, therefore, need have bigger container (conveyance container), need the bigger accordingly area that is provided with.But, different with the situation of conveyance handled object under the atmospheric pressure, under the situation of the conveyance container that carries out the vacuum conveyance,, on maximizing, there is boundary because need have the rigidity of opposing external pressure.If handled object continues to maximize in the future, can envision, the making of conveyance container, transport and will surpass possible size.In addition, the maximization of carrying arm and conveyance container will inevitably cause the increase of material, processing cost.
As the method for not using carrying arm conveyance handled object, have the method for example utilize roller to come the conveyance handled object, make handled object float the method for conveyance by the rear side gas jet to handled object, it is applied in the processing unit of series system (streamline mode (in line)).The latter's floats conveyance because carry out conveyance with handled object in the noncontact mode, so problems such as particulate are given birth in difficult labour, also is applicable to the conveyance of large substrate.
As relating to the technology of floating conveyance, propose following plasma processing apparatus (patent documentation 1): this plasma processing unit has transport mechanism, this transport mechanism is by under near the pressure atmospheric pressure or the atmospheric pressure, ejection is handled and is made substrate floating carry out conveyance with gas or conveyance with gas to substrate, make the substrate floating conveyance on one side, Yi Bian carry out the formation of etch processes, ashing treatment or film.In the technology of this patent documentation 1, prerequisite is to float conveyance under near the pressure atmospheric pressure or the atmospheric pressure, does not imagine the conveyance of floating under the vacuum state.In addition, because its structure is to make substrate floating while moving processing such as side below the substrate being implemented etching, therefore is and substrate-placing is implemented the different special technique of structure of the general plasma processing apparatus handled to the upper face side of substrate under the state on the mounting table.
As relating to other technology of floating conveyance, following semiconductor-fabricating device (patent documentation 2) is proposed: under the state of two vacuum tanks that are communicated with adjacency, from a gas squit hole ejection gas with the guide plate of another vacuum tank, the pallet that will be in a vacuum tank of float state by the gas of ejection utilizes carrying arm to move on the guide plate of another vacuum tank along the length direction of guide plate, thus the substrate that carries on pallet is carried out conveyance.Though the technology of this patent documentation 2 is the technology of floating the conveyance substrate under vacuum state,, the mode that it is to use pallet and carries out conveyance under the state of mounted board thereon is not only with the technology of substrate floating conveyance.In addition, by using pallet, though conveyance substrate stably has following shortcoming but then: the temperature control of the substrate difficulty that becomes during generation reason, etching and the film forming that pallet self becomes particulate easily handled.
Patent documentation 1: TOHKEMY 2004-207708 communique
Patent documentation 2:WO2005/074020 number
Summary of the invention
The present invention finishes in view of above-mentioned actual conditions, also can do one's utmost to suppress the vacuum treatment installation of the size of vacuum treatment container even its first purpose is to provide a kind of handled object to maximize.In addition, second purpose of the present invention is to provide a kind of and can use the vacuum flush system of large-scale carrying arm to vacuum treatment installation conveyance handled object.
For solving above-mentioned problem, the vacuum treatment installation that the present invention relates to is implemented predetermined process to handled object under vacuum state, and this vacuum treatment installation comprises:
Container handling with the peristome that handled object is moved into take out of;
Mounting table at the interior support handled object of described container handling; With
To the gas supply source of described mounting table supply gas,
Described mounting table comprises:
Mounting table main body with mounting surface of mounting handled object;
Be formed on a plurality of gas jetting holes on the described mounting surface; With
Be communicated with, be formed on the gas inside stream of described mounting table main body with described gas jetting hole,
By with the regulation pressure from described gas jetting hole to the back side of handled object gas jet, make under the state that handled object floats from described mounting surface, at described vacuum treatment installation and be arranged on the handing-over of carrying out handled object between the vacuum carrying device of outside of described container handling.
In addition, the vacuum flush system that the present invention relates to comprises:
Handled object is implemented the vacuum treatment installation of predetermined process at vacuum state; With
With described vacuum treatment installation in abutting connection with the vacuum carrying device that is provided with, under vacuum condition, handled object is carried out conveyance, wherein,
Described vacuum treatment installation comprises:
Container handling with the peristome that handled object is moved into take out of;
Mounting table at the interior support handled object of described container handling; With
To the gas supply source of described mounting table supply gas,
Described mounting table comprises:
Mounting table main body with mounting surface of mounting handled object;
Be formed on a plurality of gas jetting holes on the described mounting surface; With
Be communicated with, be formed on the gas inside stream of described mounting table main body with described gas jetting hole,
By with the regulation pressure from described gas jetting hole to the back side of handled object gas jet, make under the state that handled object floats from described mounting surface, at described vacuum treatment installation and be arranged on the handing-over of carrying out handled object between the vacuum carrying device of outside of described container handling
Described vacuum carrying device comprises:
Has the conveyance that is used for the conveyance handled object conveyance container of opening;
Be arranged on the conveyance platform in the described conveyance container;
Be separately positioned on the both sides of described conveyance platform, along a pair of guiding device of conveyance direction to the handled object channeling conduct; With
To floating of described conveyance platform supply gas gas supply source,
Described conveyance platform comprises:
The platform main body;
Upper surface a plurality of that are formed on described main body are floated and are used gas jetting hole; With
Gas flow path is used in floating of being communicated with described gas jetting hole,
By with the pressure of regulation from described float to float to the injection of the back side of handled object with gas jetting hole use gas, make under the state that handled object floats from the upper surface of described main body, utilize described guiding device to the handled object channeling conduct, move into this handled object or take out of this handled object from described vacuum treatment installation to described vacuum treatment installation.
Processing method of the present invention is implemented to handle to handled object under vacuum condition, and this processing method is used vacuum flush system, and this vacuum flush system comprises: vacuum treatment installation and the vacuum carrying device that disposes in abutting connection with described vacuum treatment installation, wherein,
Described vacuum treatment installation comprises: the container handling with the peristome that handled object is moved into take out of; Mounting table at the interior support handled object of described container handling; With the gas supply source to described mounting table supply gas, and described mounting table comprises: the mounting table main body with mounting surface of mounting handled object; Be formed on a plurality of gas jetting holes on the described mounting surface; Be communicated with, be formed on the gas inside stream of described mounting table main body with described gas jetting hole,
Described vacuum carrying device comprises: have the conveyance container that opening is used in the conveyance that is used for the conveyance handled object; Be arranged on the conveyance platform in the described conveyance container; Be separately positioned on the both sides of described conveyance platform, to a pair of guiding device of conveyance direction to the handled object channeling conduct; With use the gas supply source to floating of described conveyance platform supply gas, and described conveyance platform comprises: the platform main body; Upper surface a plurality of that are formed on described main body are floated and are used gas jetting hole; Use gas flow path with floating of being communicated with described gas jetting hole,
This processing method preferably includes:
In described vacuum carrying device, by with the pressure of regulation from described float to float to the injection of the back side of handled object with gas jetting hole use gas, make under the state that handled object floats from the upper surface of described main body, utilize described guiding device to the handled object channeling conduct, to the operation of the described handled object of described vacuum treatment installation conveyance;
By with the pressure of regulation from described gas jetting hole to the back side of handled object gas jet, make under the state that handled object floats from described mounting surface, from the operation of described vacuum carrying device to described vacuum treatment installation handing-over handled object;
Be positioned in the operation of implementing predetermined process under the state on the described mounting surface at handled object; With
By with the pressure of regulation from described gas jetting hole to the back side of handled object gas jet, make under the state that handled object floats from described mounting surface, to the operation of described vacuum carrying device handing-over handled object.
According to vacuum treatment installation of the present invention, by with the pressure of regulation from gas jetting hole to the back side of handled object gas jet, it is minimum that the bending deformation of handled object is got, thereby make the miniaturization that realizes container handling become possibility.In addition, under situation about joining under the state that handled object is floated, do not need lift-pin mechanism, thereby make the miniaturization of further realization container handling become and may and can suppress cost of manufacture.Particularly, because can suppress the height of container handling, make that the processing under narrow crack (narrow gap) also becomes easy.
In addition, as the heat carrier of temperature from mounting table to handled object that transmit (for example will float with gas, back side refrigerating gas (back cooling gas)) under the situation of Shi Yonging, use gas supply mechanism owing to be also used as the feed mechanism of back side refrigerating gas and float, so can obtain above-mentioned effect with simple apparatus structure.
In addition, according to vacuum flush system of the present invention, use gas jetting hole to the back side of processed gas gas jet at pressure from the floating of conveyance platform of vacuum carrying device with regulation, handled object is in utilize under the float state guiding device to its channeling conduct and carry out conveyance, thus, can not use the carrying arm of scalable rotation, in the handing-over of under float state, carrying out handled object between vacuum carrying device and the vacuum treatment installation.So, make the miniaturization of vacuum conveyance container become possibility, particularly can save the space is set, suppress cost of manufacture.
In addition, particularly owing to adopt series system (streamline mode (in line)), therefore FPD is for example reduced with the restriction of the length of the length direction of handled objects such as glass substrate, thereby make the possibility that is treated as that has than the substrate of so far the longer size of substrate size.
In addition, float the conveyance mode because be, so can not produce the problem of breakage of the handled object that deflection caused of generation because of the stripping charge of the handled object that causes with carrying arm and fork contact or particulate, substrate, can realize the raising of the productivity ratio brought by series connection (streamline (in line)) conveyance mode.
Description of drawings
Fig. 1 is the horizontal sectional view of the brief configuration of the related vacuum flush system of expression an embodiment of the invention.
Fig. 2 is the side cross-sectional view of the vacuum flush system of Fig. 1.
Fig. 3 is the key diagram of the structure example of expression holding member.
Fig. 4 is the key diagram of other structure example of expression holding member.
Fig. 5 is the sectional view that is used to illustrate the major part of the vacuum flush system that floats servicing unit.
Fig. 6 is the horizontal sectional view of vacuum flush system that is used to illustrate other structure example of guiding device.
Fig. 7 is the side cross-sectional view of the vacuum flush system of Fig. 6.
Fig. 8 is the horizontal sectional view of major part that is used to illustrate the vacuum flush system of upper gas injection mechanism.
Fig. 9 is the side cross-sectional view that is used to illustrate the vacuum carrying device of upper gas injection mechanism.
Figure 10 is the expanded view of the major part of Fig. 9.
Figure 11 A is the figure of configuration example of holding section of the holding member of explanation guiding device.
Figure 11 B is the figure of other configuration example of holding section of the holding member of explanation guiding device.
Figure 12 A is that the figure that in the experiment substrate is carried out the state of 4 supportings is floated in explanation.
Figure 12 B is that the figure that in the experiment substrate is carried out the state of 8 supportings is floated in explanation.
Figure 13 A is the figure that the state (before floating) that utilizes the holding member supporting substrates is described.
Figure 13 B is the figure that dotted line among Figure 13 A is partly enlarged.
Figure 14 A is the figure that the gas flow that is injected in substrate back schematically is described.
Figure 14 B is the figure that the stable state that floats of substrate schematically is described.
Figure 15 schematically illustrates the not figure of the stable state that floats of substrate.
Symbol description:
1: vacuum flush system; 100: plasma processing apparatus; 101: container handling; 101a, 101b: peristome; 101c: exhaust outlet; 103: mounting table (lower electrode); 103b: gas jetting hole; 105: spray head (upper electrode); 107: gas flow path; 109: the gas pipe arrangement; 111: the gas supply source; 200a: the first vacuum carrying device; 200b: the second vacuum carrying device; 201: the conveyance container; 201a, 201b: conveyance opening; 201c: exhaust outlet; 203: the conveyance platform; 205: guiding device; 207: float and use gas jetting hole; 209: float and use gas flow path; 210: float and use the gas pipe arrangement; 211: float and use the gas supply source; 213: holding member; 213a: maintaining part; 213b: arm; 215: track; 217: the movable support body; GV: the family of power and influence; F: mounting surface; S: substrate
Embodiment
Describe embodiments of the present invention with reference to the accompanying drawings in detail.Fig. 1 is the horizontal sectional view of the brief configuration of the related vacuum flush system 1 of expression present embodiment, and Fig. 2 is its side cross-sectional view.
Vacuum flush system 1 comprises: the LCD (LCD) as handled object is carried out the plasma processing apparatus 100 of plasma etch process with glass substrate (following only claim " substrate ") S; The first vacuum carrying device 200a and the second vacuum carrying device 200b with the both sides that are separately positioned on this plasma device 100.The first vacuum carrying device 200a, plasma processing apparatus 100 and the second vacuum carrying device 200b are in this order in the setting that links to each other of the conveyance direction of substrate S.In addition, the conveyance direction of substrate S is represented with the arrow among Fig. 2.
Container handling 101 forms more shallow box.Container handling 101 constitutes and can bear specified vacuum degree for example 1 * 10
-4The pressure vessel of Pa, for example the aluminium of being handled (anodized) by corrosion protection by the surface constitutes.Be formed with in two mutual relative sides of container handling 101 and be used to move into peristome 101a, the 101b that takes out of substrate S.In addition, be provided with exhaust outlet 101c in the many places, bottom of container handling 101 (being 4 places among Fig. 1), each exhaust outlet 101c is connected on the vacuum pump by not shown blast pipe.
Mounting table 103 comprises: the main body 103a with mounting surface F of mounting substrate S; Be formed on a plurality of gas jetting hole 103b on the mounting surface F; Be communicated with, be formed on main body 103a gas inside stream 107 with gas jetting hole 103b.Gas jetting hole 103b double as is the heat carrier spray-hole performance function of spraying the heat carrier of the temperature of transmitting mounting table 103 to substrate S.In Fig. 1, the spread geometry of the gas jetting hole 103b of mounting surface F is to overlook down inside and outside double rectangle, but is not limited thereto.In addition, for substrate S is fixed on the mounting surface F, on mounting table 103, also can have not shown Electrostatic Absorption mechanism.
As shown in Figure 2, the internal diameter of each gas jetting hole 103b that is communicated with gas flow path 107 forms narrowlyer, thereby can make the injection at gas jetting hole 103b place press higher.Gas flow path 107 is connected with gas supply source 111 by gas pipe arrangement 109.In addition, on gas pipe arrangement 109, be equipped with valve, pump etc., but omit diagram.
From gas supply source 111 by gas jetting hole 103b with the pressure of regulation to the back side of substrate S gas jet, thus, can be under the state that substrate S is floated from mounting surface F, between the plasma device 100 and the first vacuum carrying device 200a or carry out the handing-over of substrate S between the plasma device 100 and the second vacuum carrying device 200b.Like this, in the present embodiment, because elevating mechanism is not necessarily in the handing-over of substrate S, so can under the situation of not using elevating mechanism, suppress the height of container handling 101.So, have the following advantages: can reduce material, the processing cost of container handling 101, and can implement easily to be applicable to that the distance (space G) between the mounting surface F of upper electrode (spray head 105) and mounting table 103 is the plasma treatment in narrow narrow crack (narrow gap).
In addition, by switching as from the high gas of the heat transmittings such as He of gas supply source 111 gas supplied with float the N of usefulness
2Deng non-active gas, can make gas pipe arrangement 109, gas flow path 107 and gas jetting hole 103b be also used as the supply passageway of back side refrigerating gas and the supply passageway that floats usefulness gas of substrate S.
The first vacuum carrying device 200a comprises: with the conveyance container 201 of plasma processing apparatus 100 in abutting connection with setting; Be arranged on the conveyance platform 203 in the conveyance container 201; Guide a pair of guiding device 205,205 of substrate S with the both sides that are arranged on conveyance platform 203, in the conveyance direction.
As shown in Figure 2, form narrowlyer, thereby can make the injection of floating press higher with gas jetting hole 207 places with floating each internal diameter that floats with gas jetting hole 207 that is communicated with gas flow path 209.Float with gas flow path 209 and be connected on the gas supply source 211 by floating with gas pipe arrangement 210.In addition, on floating, be equipped with valve, pump etc., but omit diagram with gas pipe arrangement 210.In addition, for spread geometry, arrangement pitch and the number with gas jetting hole 207 of floating that is formed on the platform main body 203a, as long as substrate S is floated, can be arbitrary shape, at interval, number.
As using gas, can use for example clean dry air, non-active gas etc. from floating with 211 the floating of supply of gas supply source.
Guiding device 205 comprises: the holding member 213 that keeps substrate S; The track 215 of moving direction that on the conveyance direction, be provided with, regulation holding member 213 with parallel lines; Supporting holding member 213, the movable support body 217 that on track 215, moves back and forth; With the drive source that movable support body 217 is moved back and forth (not shown).
In the present embodiment, at the Width (with the direction of the relative quadrature of conveyance direction) of substrate S, a pair of holding member 213 is with relative mutually position relation configuration.Promptly, substrate S is clipped in the middle and at a pair of holding member 213 of both sides configuration, with can be parallel and mode that synchronously move back and forth along the conveyance direction constitute, two holding members 213 clip substrate S from both sides, the moving direction of the substrate S of constrained float state.Like this, it is carried out constrained, can reduce the error of the conveyance direction of substrate S, improve the conveyance positional precision by Width from substrate S.In addition, the method of constrained substrate S is not limited to from both sides, also can only carry out constrained, but, preferably carry out constrained in both sides from improving the viewpoint of conveyance positional precision and conveyance reliability from sidepiece on one side or from front end or the rear end of substrate S.
Holding member 213 comprises: engage holding section (junction surface) 213a that keeps with the side of substrate S; With the arm 213b that is provided with in transverse direction (horizontal direction) extension in the mode that this holding section 213a can be inserted in the container handling 101.The base end side of arm 213b is fixed on the movable support body 217.As the structure of the holding section 213a of holding member 213, get final product so long as can retrain the structure of moving direction of the substrate S of float state.As the example of holding section 213a, can list clamping (clamp) mechanism (fixture) of clamping substrate S.For example, clamping device 221 as shown in Figure 3 comprises: a pair of up and down butt parts 223a, 223b; The distance that makes these butt parts 223a, 223b near or the rotating shaft 225 that separates; With the not shown drive divisions such as motor that are used to drive this rotating shaft 225.
In clamp system 221, for example utilize drive division to make rotating shaft 225 along direction shown in arrow rotation among Fig. 3, thus, the butt parts 223b of downside is risen, clamp thereby the edge part of substrate S is clamped between butt parts 223a, the 223b.In this case, by making rotating shaft 225 along opposite spin, butt parts 223b descends, and the distance expansion between the butt parts 223a, thereby the clamping of substrate S is removed.
In addition, as other example of holding section 213a, can adopt utilization is the Electrostatic Absorption mechanism of the electrostatic force absorption substrate S of representative with the Coulomb force.For example, electrostatic adsorption device 231 shown in Figure 4 comprises: the adsorption substrates 233 that is made of dielectric; Be embedded in the first electrode 235a and the second electrode 235b in this adsorption substrates 233; With the DC power supply 237a, the 237b that are used for these first electrode 235a and the second electrode 235b are applied respectively direct voltage.In addition, DC power supply 237a is electrically connected by supply lines 239a, 239b respectively with the second electrode 235b with the first electrode 235a, DC power supply 237b.Be inserted with under the state of adsorption substrates 233 between the edge part of the substrate S that floats and conveyance platform 203, this electrostatic adsorption device 231 is by applying direct voltage and utilize the edge part of Coulomb force Electrostatic Absorption substrate S and it being fixed to the first electrode 235a and the second electrode 235b.By stopping to apply voltage to the first electrode 235a, the second electrode 235b, can remove the fixing of substrate S from DC power supply 237a, 237b.In addition, in Fig. 4, enumerated bipolar system electrostatic adsorption device 231, but also can be the Electrostatic Absorption mechanism of acyclic type with pair of electrodes 235a, 235b.
The movable support body 217 of guiding device 205 has rotating mechanism 217a such as the linear guides (linear guide way) that is used for moving back and forth, roller, wheel on track 215, be used to drive from the power of not shown drive source.As the mechanism that movable support body 217 is moved, so long as the mechanism that movable support body 217 levels are moved back and forth gets final product, there is no particular restriction, for example, except that mechanical mechanisms such as coaster, gear, cylinder, also can utilize linear motor etc.The guiding device 205,205 of the both sides that conveyance platform 203 is clipped in the middle forms, and two movable support bodies 217 can link and move abreast on track 215.
In having the first vacuum carrying device 200a of above structure, use gas from floating by floating to spray to float to the back side of substrate S with the pressure of regulation with gas jetting hole 207 with gas supply source 211, thus, can be under the upper surface that makes substrate S from conveyance platform 203 floats state about several mm～several cm, utilize guiding device 205 guiding substrate S, it is carried out conveyance to plasma processing apparatus 100.
The location of the substrate S delivery position between the guiding device 205 of the first vacuum carrying device 200a and the mounting table 103 of vacuum treatment installation 100, can by utilize position testing agencies (not shown) such as linear scale for example detect holding section 213a (or movable support body 217) thus amount of movement accurately grasp.
The structure of the second vacuum carrying device 200b is that centre mirror picture symmetry is all identical outward with the first vacuum carrying device 200a divided by plasma processing apparatus 100, and therefore, the identical symbol of structure mark to identical omits explanation.
Between conveyance container 201 and container handling 101, be provided with family of power and influence GV as blocking mechanism that can switch.Family of power and influence GV interdicts the atmosphere gas of 201,201 in the conveyance container of container handling 101 and both sides institute adjacency under off status, opening the mobile possibility that becomes that makes 201,201 in container handling 101 and conveyance container be communicated with and make substrate S under the state.In addition,, also be equipped with family of power and influence GV, thereby make the vacuum flush system 1 and the blocking of the atmosphere gas of outside become possibility at the conveyance of each conveyance container 201 opening 201a.
As shown in Figure 5, in container handling 101 103 of peristome 101a and mounting tables, also can be provided with the substrate S in the conveyance way back side gas jet float servicing unit 121.Floating servicing unit 121 comprises: the gas blowing plate 125 with a plurality of gas jetting holes 123; Supporting gas blowing plate 125 also utilizes not shown driving mechanism driven drive rod 127 up and down; With the gas supply source 129 that is connected on the gas jetting hole 123.Be formed with gas flow path 127a in the inside of drive rod 127, this gas flow path 127a is connected on the gas supply source 129 with gas pipe arrangement 131 by floating to assist.In addition, in Fig. 5, symbol 133 is to be used to guarantee that the drive rod 127 and the bubble-tight O shape of the opening portion of container handling 101 are encircled.In addition, auxiliary be equipped with valve, pump etc. on gas pipe arrangement 131 floating, illustrate but omit.
With the interval linearity of regulation gas jetting hole 123 is set at the Width of substrate S (with the direction of the conveyance direction quadrature of substrate S).As using gas, can use for example clean dry air, non-active gas etc. from floating of gas jetting hole 123 injections is auxiliary.
When conveyance substrate S, utilize above-mentioned driving mechanism, as illustrated in fig. 5 gas blowing plate 125 is risen to position near substrate S, spray to float to the back side of substrate S with the pressure of stipulating from spray-hole 123 and use assist gas.Utilization is floated and auxiliary use gas, prevents that substrate S can improve the conveyance reliability because of deadweight generation deflection in the conveyance way.
When substrate S is implemented predetermined process, can utilize driving mechanism that the height of gas blowing plate 125 is dropped to below the mounting surface F of mounting table 103 for example, use as the buffer board that the processing gas flow in the container handling 101 is carried out rectification.Be also used as the rectification buffer board by the gas blowing plate 125 that will float servicing unit 121, can improve the reliability of floating conveyance and do not make the apparatus structure complexity.
Like this, float in the substrate floating of servicing unit 121 between the mounting table 103 of the conveyance platform 203 of conveyance container 201 and container handling 101 zone more weak, prevent the generation of the deflection that the deadweight by substrate S causes with gas pressure.Utilize float-up device 121, also can make the high conveyance of floating of reliability become possibility even 103 distances of the mounting table of the conveyance platform 203 of conveyance container 201 and container handling 101 are elongated.
Flow process to processing substrate in the base plate processing system with said structure describes.
At first, utilize not shown transport mechanism to move into substrate S from the outside to the first vacuum carrying device 200a.Float to the ejection of the rear side of this substrate S with gas squit hole 207 from floating of conveyance platform 203 and to use gas, substrate S is floated above conveyance platform 203.In this state, will utilize the holding member 213 of a pair of guiding device 205 to keep with respect to the rear end of the substrate S of conveyance direction.In addition, also with the pressure injection gas of regulation, float the preparation of conveyance from the gas jetting hole 103b of the mounting table 103 of plasma processing apparatus 100.Making the family of power and influence GV of 100 of the first vacuum carrying device 200a and plasma processing apparatus is open state, and making the family of power and influence GV between the plasma processing apparatus 100 and the second vacuum carrying device 200b is closed condition.
Then, on track 215, move, in the first vacuum carrying device 200a, in plasma processing apparatus 100, float conveyance substrate S to plasma processing apparatus 100 by making movable support body 217.At this moment, thereby also can float servicing unit 121 action and spray to float to the back side of substrate S and auxiliaryly use gas, prevent the deflection (with reference to Fig. 5) of substrate S by making.When movable support body 217 arrived the leading section (terminals of plasma processing apparatus 100 sides) of track 215, substrate S became the state that enters (container handling 101 inside) in the vacuum treatment installation 100, therefore, removed the maintenance of holding member 213 at this location solution.
When the maintenance of removing holding member 213, because from the gas of the gas jetting hole 103b of the mounting table 103 of processing unit 100, substrate S becomes the static state that floats.Like this, finished the handing-over to the substrate S of vacuum treatment installation 100 from the first vacuum carrying device 200a.Then, by making injection pressure reduction gradually,, substrate S makes on its mounting surface F that is positioned in mounting table 103 thereby being descended from the gas of gas jetting hole 103b.Utilize not shown electrostatic adsorption device fixing base S then.
Then, close the family of power and influence GV of 100 of the first vacuum carrying device 200a and plasma processing apparatus, under the state that is positioned in mounting table 103, substrate S carried out predetermined process such as plasma etching.In this is handled, can by from gas jetting hole 103b with the pressure of regulation for example 100～400Pa to the rear side sustainable supply gas of substrate S substrate S is carried out adjustment.In this is handled, not the non-active gas such as N2 that float usefulness from gas squit hole 103b to the rear side gas supplied of substrate S, preferably switch to the high gases of thermal conductivity such as He.
After finishing dealing with, temporarily stop from gas jetting hole 103b, remove the fixing of Electrostatic Absorption mechanism to the back side of substrate S supply gas.Then, the family of power and influence GV between the open plasma processing unit 100 and the second vacuum carrying device 200b.Then, by making injection pressure rising gradually, substrate S is floated from the mounting surface F of mounting table 103 from the gas of gas jetting hole 103b.In addition, float with the pressure injection of regulation with gas jetting hole 207 from floating of the conveyance platform 203 of the second vacuum carrying device 200b and to use gas, carry out the preparation of floating conveyance.
Under the state that the mounting surface F that makes substrate S from mounting table 103 floats, the movable support body 217 that makes the second vacuum carrying device 200b moves to the terminal of plasma processing apparatus 100 sides along track 215, the end that utilizes the holding section 213a of holding member 213 to keep substrate S front.Then, move to conveyance direction the place ahead on track 215 by the movable support body 217 that makes the second vacuum carrying device 200b, while guide the moving direction of substrate S to float conveyance substrate S to the second vacuum carrying device 200b from plasma processing apparatus 100.At this moment, thereby also can float servicing unit 121 action and spray to float to the back side of substrate S and auxiliaryly use gas, prevent the deflection (with reference to Fig. 5) of substrate S by making.The major part that arrives front end (terminal in conveyance direction downstream), the substrate S of tracks 215 when movable support body 217 enters the stage in the second vacuum carrying device 200b, substrate S should be joined to other not shown transport mechanism, remove the maintenance of the holding section 213a of holding member 213 the substrate S of float state.
As mentioned above, utilize not shown transport mechanism the substrate of conveyance to the second vacuum carrying device 200b to the outside conveyance of vacuum flush system 1.In addition, in the conveyance direction downstream of the second vacuum carrying device 200b, also further other vacuum treatment installation of alternate configurations, other vacuum carrying device carry out the processing of different content continuously.In addition, also the substrate S that finishes processing in plasma processing apparatus 100 can be floated conveyance and return the first vacuum carrying device 200a.Further, also the first vacuum carrying device 200a and the second vacuum carrying device 200b can be used as the loadlock may (load locking room) that can alternately switch atmospheric pressure state and vacuum state.
In addition, in Fig. 1 and Fig. 2, express utilization with the substrate S structure that each holding section 213a of a pair of holding member 213 of configuration keeps substrate S at two places that is clipped in the middle, but also can keep substrate S in more position.Example vacuum flush system 1a as shown in Figure 6 and Figure 7 constitutes and uses the holding member 213 with two holding section 213a, keeps substrate S in 4 corners.In this case, use is carried out constrained to one of substrate S two distolateral corners at Width at set a pair of holding section 213a, the 213a of a pair of arm 213b midway.Simultaneously, can use at the front end of a pair of arm 213b set a pair of holding section 213a, 213a constrained is carried out at Width in two corners of the other end of substrate S.Like this, by keeping substrate S in 4 corners, the directional precision that can float conveyance improves, and the conveyance reliability is further improved.In addition, as described later, aspect making that substrate S is stable and floating, the number that is more preferably the holding section 213a that makes a holding member 213 is more than three.The structure of holding section 213a can adopt for example clamping device 221 same as described above, electrostatic adsorption device 231.In addition, in Fig. 6 and Fig. 7, the structure mark identical symbol identical with Fig. 1 and Fig. 2 omits explanation.
In addition, in floating conveyance, from the gas jetting hole 207 of conveyance platform 203 under the bigger situation of gas pressure that the rear side of substrate S is sprayed, the central portion of substrate S may swell, the substrate S distortion (protuberance) that raises up.If substrate S deforms, swells, then the gas pressure that sprays from gas jetting hole 207 becomes inhomogeneous in substrate S face, and the attitude of floating of substrate S becomes unstable, falls easily in the conveyance way or generation and contacting of container etc.Be used to correct the distortion of such substrate S, the preferred construction example of protuberance with Fig. 8～10 expressions.Fig. 8 is the horizontal sectional view with first vacuum carrying device 200a of upper gas injection mechanism 241, and this upper gas injection mechanism 241 is relative with conveyance platform 203, thereby the upper surface gas jet of substrate S is corrected the distortion of substrate S.In addition, Fig. 9 is the side cross-sectional view with first vacuum carrying device 200a of upper gas injection mechanism 241, and Figure 10 is the expanded view of the major part of Fig. 9.
This upper gas injection mechanism 241 has for example nozzle arm 243 of cruciform arrangement in the mode relative with conveyance platform 203 above substrate S.In addition, the configuration shape of nozzle arm 243 is not limited to cross.Four ends of nozzle arm 243 are separately fixed at the upper surface of the holding section 213a of holding member 213.The lower surface of nozzle arm 243 is provided with a plurality of gas jetting holes 245 (with reference to Figure 10).Each gas jetting hole 245 is communicated with the gas inside stream that is formed on nozzle arm 243 (omitting diagram), and this gas flow path is connected not shown rectification with on the gas supply source by not shown flexual pipe arrangement.
Use gas by correcting to the upper surface injection of substrate S, and can correct the protuberance of the central portion of substrate S, make the shape of relative conveyance platform 203 keeping parallelisms of substrate S from the gas jetting hole 245 of nozzle arm 243.That is, upper gas injection mechanism 241 is as mechanism's performance function that the shape of float state infrabasal plate S is corrected.Like this, by being equipped with upper gas injection mechanism 241, distortion, the protuberance of the substrate S of conveyance floated in inhibition, can improve the reliability of conveyance.In addition, upper gas injection mechanism 241 is fixed on the holding member 213 of guiding device 205 and can with the same moved further of substrate S, thus, can correct this distortion, protuberance with the location independent ground that floats the substrate S in the conveyance.
In addition, upper gas injection mechanism 241 relatively is set,, can finely tunes the levitation height position of substrate S by regulating from the pressure of the gas that sprays respectively up and down of substrate S with conveyance platform 203.That is, upper gas injection mechanism 241 can be as mechanism's performance function of the levitation height position of adjusting substrate S.
Then, the method to the holding member 213 supporting substrates S that utilize guiding device 205 describes.The holding member 213 of guiding device 205 is preferably can be with the structure on the limit, the left and right sides of uniform height supporting substrates S.For example, holding section 213a more than 3 places preferably is set on the holding member 213 (arm 213b) of a side in clipping the relative a pair of holding member 213 of substrate S.Preferably be shown in the above holding section 213a in 4 places is set on the holding member 213 as Figure 11 A.In addition, as other structure example, shown in Figure 11 B, preferably by the holding section 213a of holding member 213 being formed the shape of overlength, the structure that the major part of the side of substrate S is supported.
Here, the experimental result whether attitude can produce difference because of the difference at the supporting position of holding member 213 of floating that substrate S is discussed is described.Figure 12 A represents to utilize near the situations (hereinafter referred to as " 4 supportings ") four jiaos of holding section 213a supporting substrates S of holding member 213, Figure 12 B represents also to amount to the situation (hereinafter referred to as " 8 supportings ") that support at 8 places at each two place on the side of the left and right sides of direct of travel except that substrate S four jiaos.In addition, the arrow of Figure 12 A and Figure 12 B is represented the conveyance direction of substrate.
At first, in the container handling 101 of plasma processing apparatus 100, shown in Figure 12 A, Figure 12 B difference, utilize the holding section 213a of holding member 213 that substrate S is carried out 4 supportings or 8 supportings.In this stage, as shown in FIG. 13A, because not from being formed on the gas jetting hole 103b gas jet on the mounting surface F, so thereby the mounting surface F of the central portion generation deflection of substrate S and mounting table 103 connects.In this experiment, as amplifying expression among Figure 13 B, with respect to the mounting surface F of mounting table 103, the height of the bearing position of the substrate S of holding section 213a (clearance G 1 between mounting surface F and the bearing position) is set to 5mm.Making the pressure in the container handling 101 is 1 * 10
-2The vacuum state of Pa.The arrangement of gas jetting hole 103b is identical with Fig. 1, is to overlook down inside and outside double rectangular arranged, and each gas jetting hole 103b interval (spacing (pitch)) each other that is listed as adjacency is set as 30mm.In addition, use the substrate S that is of a size of minor face 550mm * length limit 650mm.
Then, the gas jetting hole 103b from the mounting table 103 of plasma processing apparatus 100 sprays N to the back side of substrate S
2Gas.In the scope of 10～3000ml/min (sccm), change N
2The flow of gas is observed substrate S and is shown what kind of state movement.With stable float (A), float but unstable (B), do not float (C) three stages judgement estimated.In addition, " floating but shakiness " that B judges means, the central portion of substrate S alternately repeats upwards to be the state of convex protuberance and to be the recessed state of convex downwards, can not keep stable attitude.Table 1 writes down out under the situation of 4 supportings the result of determination under the situation with 8 supportings.
[table 1]
| Gas flow [mL/min] | 4 supportings | 8 supportings | Gas flow [mL/min] | 4 supportings | 8 supportings |
| ??10 | ?C | ?C | ??130 | ?B | ?A |
| ??20 | ?C | ?C | ??140 | ?B | ?A |
| ??30 | ?C | ?C | ??150 | ?B | ?A |
| ??40 | ?C | ?C | ??160 | ?B | ?A |
| ??50 | ?C | ?C | ??170 | ?B | ?A |
| ??60 | ?C | ?A | ??180 | ?B | ?A |
| ??70 | ?C | ?A | ??190 | ?B | ?A |
| ??80 | ?C | ?A | ??200 | ?B | ?A |
| ??90 | ?C | ?A | ??500 | ?B | ?A |
| ??100 | ?C | ?A | ??1000 | ?B | ?A |
| ??110 | ?B | ?A | ??2000 | ?B | ?A |
| Gas flow [mL/min] | 4 supportings | 8 supportings | Gas flow [mL/min] | 4 supportings | 8 supportings |
| ??120 | ?B | ?A | ??3000 | ?B | ?A |
As shown in table 1, under the situation of 4 supportings (with reference to Figure 12 A), gas flow be 100mL/min (sccm) when following substrate S can not float, 110mL/min (sccm) can float but can not keep when above and holds position.On the other hand, under the situation of 8 supportings (with reference to Figure 12 B), gas flow be 50mL/min (sccm) when following the too small substrate S of flow can not float, float but when 60mL/min (sccm) is above, can stablize.
Shown in above result, by 8 supportings,, also can utilize and overlook down the gas jetting hole 103b that uses for the back side refrigerating gas of inside and outside double rectangular shape arrangement even on whole of mounting table 103, gas jetting hole is not set, substrate S is stablized float.In addition, can be clear and definite, substrate S is stable to be floated in order to make, and preferably removes four jiaos of substrate S, also supports at side (direct of travel of relative substrate S).
8 supportings can be stablized the reason of floating down about the attitude of 4 supporting infrabasal plate S is unstable, if can rationally illustrate by following consideration.Under the situation of 8 supportings, substrate S is before floating, and central portion can be because of deadweight deflection downwards, about the limit become than central portion height.So, become the shape (with reference to Figure 13 A) that is convex curvature downwards in the relative cross section of the Width of the direct of travel quadrature of substrate S.Under the situation of 8 supportings, utilize a plurality of holding section 213a to support, the side about making roughly is identical height equably, thus, all is the shape that roughly is convex curvature equably downwards in the cross section of any position upper substrate S Width.
On the other hand, under the situation of 4 supportings, though place, the front and back end of the conveyance direction of substrate S becomes the shape that downwards be convex curvature identical with the situation of 8 supportings, but, the conveyance direction central authorities near (promptly, near the center of substrate S), the side about becoming is the shape of deflection downwards also.That is, under the situation of 4 supportings, except that four jiaos of the substrate S that is supported, arbitrary place all becomes near the reclinate shape mid point.
Think that the gas of the rear side that is injected into substrate S can form air-flow along the back side of substrate S.Under the situation of 8 supportings, because the limit about substrate S is roughly equably than central portion height, so, as shown in figure 14, think that the gas that sprays to the back side of substrate S can form towards the gas stream Gf that escapes from left and right sides side with the direction of substrate S direct of travel quadrature.Its result is that as shown in Figure 14B, the attitude stabilization of substrate S becomes possibility for the Width cross section for being the shape of convex curvature downwards, making to stablize to float.
On the other hand, under the situation of 4 supportings, the gas flow that is injected into the rear side of substrate S might not, but escape forwards, backwards, consequently, think the following state that repeats, that is, and state and the gas state of from arbitrary limit quickly escaping of gas hold-up between substrate S and mounting surface F.Its result is that as shown in figure 15, the central portion of substrate S alternately repeats upwards to be the state of convex protuberance and the state (etat lacunaire) that protrudes downwards, can not keep holding position.
As mentioned above, substrate S is stable to be floated in order to make, and preferred the employing promotes to form from the back side of substrate S towards the bearing method of the gas stream Gf of left and right sides side.Therefore, preferably utilize a holding member 213 with at least 3 points (for example, near two angles and the center), preferred 4 points (for example, two angles and middle uniform two places thereof) come the one-sided limit of supporting substrates S.In addition, for obtaining identical effect, for example also can be shown in Figure 11 B, the holding section 213a of holding member 213 is formed the shape of longer size, the integral body of the side of substrate S is supported.The maintenance method of such substrate S not only is applicable to plasma processing apparatus 100, also can be useful in the situation of utilizing holding member 213 supporting substrates S among the first vacuum carrying device 200a and the second vacuum carrying device 200b.
In addition, utilize the height and position (clearance G 1 between mounting surface F and bearing position) of the side of holding section 213a supporting substrates S also very important for promoting from the formation of the back side central portion of substrate S towards the gas stream Gf of left and right sides side.By making this clearance G 1 enough big,, its central portion (with the nearest part of mounting surface F) is floated downwards even be at substrate S under the state of convex deflection.Just, if clearance G 1 is excessive, then gas can excessively be escaped, and substrate S is floated.So for example the levitation height at the central portion of substrate S is under the situation of 1mm～2mm, it is above and below the 10mm that clearance G 1 preferably is set to 4mm, and more preferably 5mm is above and below the 8mm.In addition, by clearance G 1 is set in above-mentioned scope, the attitude before substrate S floats becomes the shape of downward convex curvature, can keep this dimensionally stable and central portion is floated.
In addition, by the upper gas injection mechanism 241 shown in Fig. 8～10 is set, the central portion that can effectively suppress substrate S upwards is the convex protuberance, therefore, can more stably keep substrate S is convex curvature downwards in the cross section of Width the attitude of floating.
As described above, against vacuum treatment system 1, in the first vacuum carrying device 200a or the second vacuum carrying device 200b, spray to float to the back side of substrate S with the pressure of regulation with gas jetting hole 207 from floating of conveyance platform 203 and use gas, under the state that substrate S floats, utilize guiding device 205 conveyance to be carried out to it in its channeling conduct one side on one side.Like this, do not use the rotation of can stretching carrying arm and can and vacuum treatment installation 100 between under float state, carry out the handing-over of substrate S.So, make the miniaturization of vacuum conveyance container become possibility, can realize that particularly saving is provided with the space, suppresses cost of manufacture.
In addition, particularly owing to adopt series system (streamline mode (in line)), with handled object S such as glass substrates, the restriction of length along its length reduces for FPD for example, make contrast so far longer size the overlength substrate be treated as possibility.
In addition, float the conveyance mode because be, so can realize raising by the productivity ratio brought of series connection (streamline (in line)) conveyance mode, and can not produce because of with the conveyance of prior art in employed carrying arm and fork contact cause the stripping charge of substrate S or the problem of the generation of particulate, the breakage of substrate S etc.
More than recorded and narrated embodiments of the present invention, but the present invention is not limited to above-mentioned execution mode, can carries out all distortion.For example, in the above-described embodiment, enumerating the plasma processing apparatus 100 that carries out etch processes describes as an example of vacuum treatment installation, but the time be not limited to etch processes, so long as under vacuum condition, substrate is carried out the processing unit of predetermined processing, can be applicable to the present invention, for example, film formation device, cineration device etc. also can be suitable for with being not particularly limited.
In addition, list LCD (LCD) example of glass substrate in the above-mentioned execution mode as handled object, but for other FPD substrate, for example electroluminescence (ElectroLuminescence; EL) display, plasma display (PDP) etc. can be equally as handled objects.In addition, the present invention is not limited to the FPD substrate, also can be applicable to for example solar battery panel substrate.
Moreover the present invention is not limited to series system, also can be applicable to the conveyance of the handled object in the vacuum flush system of cohort (cluster) mode with a plurality of processing unit.
Claims (19)
1. a vacuum treatment installation is implemented predetermined process to handled object under vacuum state, it is characterized in that, comprising:
Container handling with the peristome that handled object is moved into take out of;
Mounting table at the interior support handled object of described container handling; With
To the gas supply source of described mounting table supply gas,
Described mounting table comprises:
Mounting table main body with mounting surface of mounting handled object;
Be formed on a plurality of gas jetting holes on the described mounting surface; With
Be communicated with, be formed on the gas inside stream of described mounting table main body with described gas jetting hole,
By with the regulation pressure from described gas jetting hole to the back side of handled object gas jet, make under the state that handled object floats from described mounting surface, at described vacuum treatment installation and be arranged on the handing-over of carrying out handled object between the vacuum carrying device of outside of described container handling.
2. vacuum treatment installation as claimed in claim 1 is characterized in that:
Described gas squit hole is used as being positioned in the heat carrier squit hole that handled object on the described mounting surface transmits the temperature of described mounting table.
3. vacuum flush system comprises:
Handled object is implemented the vacuum treatment installation of predetermined process at vacuum state; With
With described vacuum treatment installation in abutting connection with the vacuum carrying device that is provided with, under vacuum condition, handled object is carried out conveyance, this vacuum flush system is characterised in that:
Described vacuum treatment installation comprises:
Container handling with the peristome that handled object is moved into take out of;
Mounting table at the interior support handled object of described container handling; With
To the gas supply source of described mounting table supply gas,
Described mounting table comprises:
Mounting table main body with mounting surface of mounting handled object;
Be formed on a plurality of gas jetting holes on the described mounting surface; With
Be communicated with, be formed on the gas inside stream of described mounting table main body with described gas jetting hole,
By with the regulation pressure from described gas jetting hole to the back side of handled object gas jet, make under the state that handled object floats from described mounting surface, at described vacuum treatment installation and be arranged on the handing-over of carrying out handled object between the vacuum carrying device of outside of described container handling
Described vacuum carrying device comprises:
Has the conveyance that is used for the conveyance handled object conveyance container of opening;
Be arranged on the conveyance platform in the described conveyance container;
Be separately positioned on the both sides of described conveyance platform, along a pair of guiding device of conveyance direction to the handled object channeling conduct; With
To floating of described conveyance platform supply gas gas supply source,
Described conveyance platform comprises:
The platform main body;
Upper surface a plurality of that are formed on described main body are floated and are used gas jetting hole; With
Gas flow path is used in floating of being communicated with described gas jetting hole,
By with the pressure of regulation from described float to float to the injection of the back side of handled object with gas jetting hole use gas, make under the state that handled object floats from the upper surface of described main body, utilize described guiding device to the handled object channeling conduct, move into this handled object or take out of this handled object from described vacuum treatment installation to described vacuum treatment installation.
4. vacuum flush system as claimed in claim 3 is characterized in that:
Described guiding device comprises the holding member that keeps the described conveyance platform in handled object one edge to move back and forth on one side, under the state that utilizes described holding member maintenance handled object handled object is floated conveyance.
5. vacuum flush system as claimed in claim 4 is characterized in that:
Described holding member comprises the clamping device of clamping handled object.
6. vacuum flush system as claimed in claim 4 is characterized in that:
Described holding member comprises the electrostatic adsorption device that adsorbs handled object.
7. as each described vacuum flush system in the claim 4 to 6, it is characterized in that:
Described holding member supports handled object with the gas that sprays to the back side of the handled object that is in float state towards the mode that the direction with the direct of travel quadrature of handled object forms the gas stream of escaping from left and right sides side.
8. as each described vacuum flush system in the claim 4 to 6, it is characterized in that:
Described holding member becomes the mode that is bowed downward to the convex shape in the cross section with the Width of direct of travel quadrature and supports handled object to be at handled object under the state that floats.
9. as each described vacuum flush system in the claim 4 to 6, it is characterized in that:
Described holding member has a plurality of holding sections, supports more than utilizing three places of described holding section to a side of handled object.
10. as each described vacuum flush system in the claim 3 to 6, it is characterized in that:
Thereby described vacuum carrying device comprise dispose relatively with described conveyance platform, to gas blowing mechanism that the upper surface gas jet of handled object is corrected the distortion of handled object.
11., it is characterized in that as each described vacuum flush system in the claim 3 to 6:
Being formed on a plurality of described gas squit hole on the described mounting surface of described vacuum treatment installation is used as being positioned in the heat carrier squit hole that handled object on the described mounting surface transmits the temperature of described mounting table.
12., it is characterized in that as each described vacuum flush system in the claim 3 to 6:
In described container handling at the servicing unit that floats of the back side gas jet that has the handled object in conveyance way between described peristome and the described mounting table.
13. vacuum flush system as claimed in claim 12 is characterized in that:
Describedly float servicing unit and comprise:
Have a plurality of gas jetting holes and gas blowing plate that can the oscilaltion displacement; With
To the gas supply source of gas jetting hole supply gas,
When the conveyance handled object, make described gas blowing plate rise near the position of handled object to come to the back side of handled object gas jet.
14. vacuum flush system as claimed in claim 13 is characterized in that:
Described gas blowing plate is as during handling handled object the processing gas flow in the described container handling being carried out the buffer board of rectification and brought into play function.
15., it is characterized in that as each described vacuum flush system in the claim 3 to 6:
With described vacuum treatment installation is that center connection before and after it is provided with described vacuum carrying device.
16. a processing method is implemented to handle to handled object under vacuum condition, it is characterized in that:
This processing method is used vacuum flush system, and this vacuum flush system comprises: vacuum treatment installation and the vacuum carrying device that disposes in abutting connection with described vacuum treatment installation, wherein,
Described vacuum treatment installation comprises: the container handling with the peristome that handled object is moved into take out of; Mounting table at the interior support handled object of described container handling; With the gas supply source to described mounting table supply gas, and described mounting table comprises: the mounting table main body with mounting surface of mounting handled object; Be formed on a plurality of gas jetting holes on the described mounting surface; Be communicated with, be formed on the gas inside stream of described mounting table main body with described gas jetting hole,
Described vacuum carrying device comprises: have the conveyance container that opening is used in the conveyance that is used for the conveyance handled object; Be arranged on the conveyance platform in the described conveyance container; Be separately positioned on the both sides of described conveyance platform, to a pair of guiding device of conveyance direction to the handled object channeling conduct; With use the gas supply source to floating of described conveyance platform supply gas, and described conveyance platform comprises: the platform main body; Upper surface a plurality of that are formed on described main body are floated and are used gas jetting hole; Use gas flow path with floating of being communicated with described gas jetting hole,
This processing method comprises:
In described vacuum carrying device, by with the pressure of regulation from described float to float to the injection of the back side of handled object with gas jetting hole use gas, make under the state that handled object floats from the upper surface of described main body, utilize described guiding device to the handled object channeling conduct, to the operation of the described handled object of described vacuum treatment installation conveyance;
By with the pressure of regulation from described gas jetting hole to the back side of handled object gas jet, make under the state that handled object floats from described mounting surface, from the operation of described vacuum carrying device to described vacuum treatment installation handing-over handled object;
Be positioned in the operation of implementing predetermined process under the state on the described mounting surface at handled object; With
By with the pressure of regulation from described gas jetting hole to the back side of handled object gas jet, make under the state that handled object floats from described mounting surface, to the operation of described vacuum carrying device handing-over handled object.
17. processing method as claimed in claim 16 is characterized in that:
Described guiding device, the mode that forms the gas stream of escaping from left and right sides side towards the direction with the direct of travel quadrature of handled object with the gas that sprays to the back side of the handled object that is in float state support handled object and to its channeling conduct.
18. processing method as claimed in claim 16 is characterized in that:
Described guiding device is to become in the cross section with the Width of direct of travel quadrature under the state that floats at handled object that the mode that is bowed downward to the convex shape supports handled object and to its channeling conduct.
19. processing method as claimed in claim 16 is characterized in that:
Described guiding device supports in many places side of handled object.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-316497 | 2008-12-12 | ||
| JP2008316497 | 2008-12-12 | ||
| JP2009-167514 | 2009-07-16 | ||
| JP2009167514A JP5399153B2 (en) | 2008-12-12 | 2009-07-16 | Vacuum processing apparatus, vacuum processing system and processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101752173A true CN101752173A (en) | 2010-06-23 |
| CN101752173B CN101752173B (en) | 2012-12-12 |
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| CN2009102542668A Expired - Fee Related CN101752173B (en) | 2008-12-12 | 2009-12-14 | Vacuum processing apparatus, vacuum processing system and processing method |
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| KR (1) | KR101140489B1 (en) |
| CN (1) | CN101752173B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037113A (en) * | 2013-03-04 | 2014-09-10 | 中微半导体设备(上海)有限公司 | Air supply apparatus for plasma processing cavity, and de-clamping method |
| CN107170667A (en) * | 2017-05-25 | 2017-09-15 | 昆山国显光电有限公司 | Substrate wet processing process and substrate wet processing process unit |
| CN108010865A (en) * | 2016-10-28 | 2018-05-08 | 盟立自动化股份有限公司 | Wet-type etching device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3151582B2 (en) * | 1993-04-28 | 2001-04-03 | 東京エレクトロン株式会社 | Vacuum processing equipment |
| JP4389424B2 (en) * | 2001-12-25 | 2009-12-24 | 東京エレクトロン株式会社 | To-be-processed object conveyance mechanism and processing system |
| JP4272230B2 (en) * | 2006-12-22 | 2009-06-03 | 東京エレクトロン株式会社 | Vacuum dryer |
-
2009
- 2009-12-10 KR KR1020090122623A patent/KR101140489B1/en not_active IP Right Cessation
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037113A (en) * | 2013-03-04 | 2014-09-10 | 中微半导体设备(上海)有限公司 | Air supply apparatus for plasma processing cavity, and de-clamping method |
| CN104037113B (en) * | 2013-03-04 | 2018-05-08 | 中微半导体设备(上海)有限公司 | The feeder and de-clamping method of plasma process chamber |
| CN108010865A (en) * | 2016-10-28 | 2018-05-08 | 盟立自动化股份有限公司 | Wet-type etching device |
| CN107170667A (en) * | 2017-05-25 | 2017-09-15 | 昆山国显光电有限公司 | Substrate wet processing process and substrate wet processing process unit |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101140489B1 (en) | 2012-04-30 |
| CN101752173B (en) | 2012-12-12 |
| KR20100068209A (en) | 2010-06-22 |
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