CN101752173B - Vacuum processing apparatus, vacuum processing system and processing method - Google Patents
Vacuum processing apparatus, vacuum processing system and processing method Download PDFInfo
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- CN101752173B CN101752173B CN2009102542668A CN200910254266A CN101752173B CN 101752173 B CN101752173 B CN 101752173B CN 2009102542668 A CN2009102542668 A CN 2009102542668A CN 200910254266 A CN200910254266 A CN 200910254266A CN 101752173 B CN101752173 B CN 101752173B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
- H01J37/185—Means for transferring objects between different enclosures of different pressure or atmosphere
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Abstract
The present invention provides a vacuum processing apparatus, a vacuum processing system and a processing method, wherein the vacuum processing apparatus is capable of restraining the size of a vacuum processing container to the utmost even though an object to be processed is large, and the vacuum processing system is capable of conveying the objects to be processed to the vacuum processing apparatus without usage of large-sized conveying arms. When a substrage (S) is conveyed to a plasma processing device (100) from a first vacuum conveying device (200a), air is injected to the back face of the substrate to float the substrate through an air injection hole (207) of a conveying station (203), the substrate is held by holding components (203) of a pair of guiding devices (205), such that a movable support body (217) moves toward the plasma processing device on a track (215). The the holding components (213) is released, the substrate is floated stilly by the air injected through the air injection hole (103b) of a carrying station (103), and the substrate is transferred to the plasma processing device.
Description
Technical field
The present invention relates under vacuum state the handled objects such as glass substrate of for example flat-panel monitor (FPD) usefulness are carried out vacuum treatment installation, vacuum flush system and the processing method of Cement Composite Treated by Plasma etc. with this vacuum treatment installation.
Background technology
In the manufacture process of FPD that with LCD (LCD) is representative, under vacuum, handled objects such as glass substrate are carried out various processing such as etching, film forming.For utilizing plasma to carry out above-mentioned processing, use vacuum treatment installation with the container handling that can vacuumize.In addition, as mechanism to vacuum treatment installation conveyance handled object, use have vacuum lower support handled object can rotary extension the vacuum carrying device of carrying arm.
In recent years, be to improve the production efficiency of FPD, the requirement of the maximization of handled object is strengthened day by day, corresponding with it, vacuum treatment installation, vacuum carrying device also have the trend of maximization.At present, also exist the situation that the huge glass substrate of the monolateral 2m of surpassing is handled as handled object, can think definitely that the maximization of handled object also can obtain development further in the future.Therefore, the maximization of vacuum treatment installation and vacuum carrying device will inevitably arrive.
From the vacuum carrying device to the container handling at vacuum treatment installation contain put carrying of handled object put the action of platform handing-over handled object be through constitute can free oscilaltion lift-pin mechanism carry out.In the handing-over of the handled object that uses this lift-pin mechanism to carry out, at the delivery position place, need enough altitude margins between the platform with year putting, make the support unit (fork) of carrying arm can insert safely, withdraw from handled object.Particularly under the situation of the large-scale handled object of handing-over, need the driving stroke of the deflection setting lifter pin of consideration handled object, corresponding with it, also must make the height of container handling enough big.
In addition, corresponding with the maximization of handled object, if the vacuum carrying device is maximized, then require under the state of supporting handled object, to stretch, the carrying arm of spinning movement has rigidity and the driveability higher than prior art.The vacuum carrying device need be designed to the supporting large-scale handled object state under carrying arm can rotate, therefore, need have bigger container (conveyance container), need the bigger accordingly area that is provided with.But, different with the situation of conveyance handled object under the atmospheric pressure, under the situation of the conveyance container that carries out the vacuum conveyance,, on maximizing, there is boundary because need have the rigidity of opposing external pressure.If handled object continues to maximize in the future, can envision, the making of conveyance container, transport surpassing possible size.In addition, the maximization of carrying arm and conveyance container will inevitably cause the increase of material, processing cost.
As the method for not using carrying arm conveyance handled object; Have the method for example utilize roller to come the conveyance handled object, make handled object float the method for conveyance through the rear side jet gas to handled object, it is applied in the processing unit of series system (streamline mode (in line)).The latter's floats conveyance because carry out conveyance with handled object with the noncontact mode, so problems such as particulate are given birth in difficult labour, also is applicable to the conveyance of large substrate.
As relating to the technology of floating conveyance; Plasma processing apparatus (patent documentation 1) below proposing: this plasma processing unit has transport mechanism; This transport mechanism is through under near the pressure atmospheric pressure or the atmospheric pressure; Ejection is handled and is made substrate floating carry out conveyance with gas or conveyance with gas to substrate, Yi Bian make the substrate floating conveyance, Yi Bian carry out the formation of etch processes, ashing treatment or film.In the technology of this patent documentation 1, prerequisite is under near the pressure atmospheric pressure or the atmospheric pressure, to float conveyance, does not imagine the conveyance of floating under the vacuum state.In addition; Because its structure is to make substrate floating while moving processing such as side below the substrate being implemented etching, therefore is and substrate-placing is being carried the different special technique of structure of putting under the state on the platform the general plasma processing apparatus that the upper face side of substrate is implemented to handle.
As relating to other technology of floating conveyance; Semiconductor-fabricating device (patent documentation 2) below proposing: under the state of two vacuum tanks that are communicated with adjacency; From a gas squit hole ejection gas with the guide plate of another vacuum tank; The pallet that will be in a vacuum tank of float state through the gas of ejection utilizes carrying arm to move on the guide plate of another vacuum tank along the length direction of guide plate, thus the substrate that carries on pallet is carried out conveyance.Though the technology of this patent documentation 2 is the technology of under vacuum state, floating the conveyance substrate,, the mode that it is to use pallet and carries out conveyance under the state of mounted board above that is not only with the technology of substrate floating conveyance.In addition, through using pallet, though conveyance substrate stably has following shortcoming but then: the temperature control of the substrate difficulty that becomes during generation reason, etching and the film forming that pallet self becomes particulate easily handled.
Patent documentation 1: TOHKEMY 2004-207708 communique
Patent documentation 2:WO2005/074020 number
Summary of the invention
The present invention accomplishes in view of above-mentioned actual conditions, also can do one's utmost to suppress the vacuum treatment installation of the size of vacuum treatment container even its first purpose is to provide a kind of handled object to maximize.In addition, second purpose of the present invention is to provide a kind of and can use the vacuum flush system of large-scale carrying arm to vacuum treatment installation conveyance handled object.
For solving above-mentioned problem, the vacuum treatment installation that the present invention relates to is implemented predetermined process to handled object under vacuum state, and this vacuum treatment installation comprises:
Container handling with the peristome that handled object is moved into take out of;
Carrying of interior support handled object at said container handling put platform; With
Put the gas supply source of platform supply gas to said year,
Putting platform in said year comprises:
Have and carry the carrying of the face of putting of carrying put handled object and put the platform main body;
Be formed on a plurality of gas jetting holes of putting on the face in said year; With
Be communicated with, be formed on the gas inside stream of putting the platform main body in said year with said gas jetting hole,
Through with the regulation pressure from said gas jetting hole to the back side of handled object jet gas; Make handled object under the state of putting face in said year and floating, at said vacuum treatment installation and be arranged on the handing-over of carrying out handled object between the vacuum carrying device of outside of said container handling.
In addition, the vacuum flush system that the present invention relates to comprises:
Handled object is implemented the vacuum treatment installation of predetermined process at vacuum state; With
With said vacuum treatment installation in abutting connection with the vacuum carrying device that is provided with, under vacuum condition, handled object is carried out conveyance, wherein,
Said vacuum treatment installation comprises:
Container handling with the peristome that handled object is moved into take out of;
Carrying of interior support handled object at said container handling put platform; With
Put the gas supply source of platform supply gas to said year,
Putting platform in said year comprises:
Have and carry the carrying of the face of putting of carrying put handled object and put the platform main body;
Be formed on a plurality of gas jetting holes of putting on the face in said year; With
Be communicated with, be formed on the gas inside stream of putting the platform main body in said year with said gas jetting hole,
Through with the regulation pressure from said gas jetting hole to the back side of handled object jet gas; Make handled object under the state of putting face in said year and floating; At said vacuum treatment installation and be arranged on the handing-over of carrying out handled object between the vacuum carrying device of outside of said container handling
Said vacuum carrying device comprises:
Has the conveyance that is used for the conveyance handled object conveyance container with opening;
Be arranged on the conveyance platform in the said conveyance container;
Be separately positioned on the both sides of said conveyance platform, along a pair of guiding device of conveyance direction to the handled object channeling conduct; With
Use the gas supply source to floating of said conveyance platform supply gas,
Said conveyance platform comprises:
The platform main body;
Upper surface a plurality of that are formed on said main body are floated and are used gas jetting hole; With
Gas flow path is used in floating of being communicated with said gas jetting hole,
Through with the pressure of regulation from said float to spray to float to the back side of handled object with gas jetting hole use gas; Make under the state that handled object floats from the upper surface of said main body; Utilize said guiding device to the handled object channeling conduct, move into this handled object or take out of this handled object from said vacuum treatment installation to said vacuum treatment installation.
Processing method of the present invention is implemented to handle to handled object under vacuum condition, and this processing method is used vacuum flush system, and this vacuum flush system comprises: vacuum treatment installation and the vacuum carrying device that disposes in abutting connection with said vacuum treatment installation, wherein,
Said vacuum treatment installation comprises: the container handling with the peristome that handled object is moved into take out of; Carrying of interior support handled object at said container handling put platform; With to putting the gas supply source of platform supply gas in said year, and put platform in said year and comprise: have and carry the carrying of the face of putting of putting handled object and put the platform main body; Be formed on a plurality of gas jetting holes of putting on the face in said year; Be communicated with, be formed on the gas inside stream of putting the platform main body in said year with said gas jetting hole,
Said vacuum carrying device comprises: have the conveyance that is used for the conveyance handled object conveyance container with opening; Be arranged on the conveyance platform in the said conveyance container; Be separately positioned on the both sides of said conveyance platform, to a pair of guiding device of conveyance direction to the handled object channeling conduct; With use the gas supply source to floating of said conveyance platform supply gas, and said conveyance platform comprises: the platform main body; Upper surface a plurality of that are formed on said main body are floated and are used gas jetting hole; Use gas flow path with floating of being communicated with said gas jetting hole,
This processing method preferably includes:
In said vacuum carrying device; Through with the pressure of regulation from said float to spray to float to the back side of handled object with gas jetting hole use gas; Make under the state that handled object floats from the upper surface of said main body; Utilize said guiding device to the handled object channeling conduct, to the operation of the said handled object of said vacuum treatment installation conveyance;
Through with the pressure of regulation from said gas jetting hole to the back side of handled object jet gas, make handled object under the state of putting face in said year and floating, from the operation of said vacuum carrying device to said vacuum treatment installation handing-over handled object;
Carry at handled object and to put the operation of under the state of putting on the face in said year, implementing predetermined process; With
Through with the pressure of regulation from said gas jetting hole to the back side of handled object jet gas, make handled object under the state of putting face in said year and floating, to the operation of said vacuum carrying device handing-over handled object.
According to vacuum treatment installation of the present invention, through with the pressure of regulation from gas jetting hole to the back side of handled object jet gas, it is minimum that the bending deformation of handled object is got, thereby make the miniaturization that realizes container handling become possibility.In addition, under situation about joining under the state that handled object is floated, do not need lift-pin mechanism, thereby make the miniaturization of further realization container handling become and maybe and can suppress cost of manufacture.Particularly, because can suppress the height of container handling, make that the processing under narrow crack (narrow gap) also becomes easy.
In addition; As the heat carrier that carries the temperature of putting platform to the handled object transmission (for example will float with gas; Under the situation about back side refrigerating gas (back cooling gas)) using; Use gas supply mechanism owing to be also used as the feed mechanism of back side refrigerating gas with floating, so can obtain above-mentioned effect with simple apparatus structure.
In addition; According to vacuum flush system of the present invention; With the pressure of regulation from the floating with gas jetting hole of the conveyance platform of vacuum carrying device to the back side jet gas that is processed gas, handled object is in utilize under the float state guiding device to its channeling conduct and carry out conveyance, thus; Can not use the carrying arm of scalable rotation, in the handing-over of under float state, carrying out handled object between vacuum carrying device and the vacuum treatment installation.So, make the miniaturization of vacuum conveyance container become possibility, particularly can save the space is set, suppress cost of manufacture.
In addition; Particularly owing to adopt series system (streamline mode (in line)); Therefore FPD is for example reduced with the restriction of the length of the length direction of handled objects such as glass substrate, thereby make the possibility that is treated as that has than the substrate of so far the longer size of substrate size.
In addition; Float the conveyance mode because be; So can not produce the problem of breakage of the handled object that deflection caused of generation because of the stripping charge of the handled object that causes with carrying arm and fork contact or particulate, substrate, the raising of the productivity ratio that can realize bringing by series connection (streamline (in line)) conveyance mode.
Description of drawings
Fig. 1 is the horizontal sectional view of the brief configuration of the related vacuum flush system of expression an embodiment of the invention.
Fig. 2 is the side cross-sectional view of the vacuum flush system of Fig. 1.
Fig. 3 is the key diagram of the structure example of expression holding member.
Fig. 4 is the key diagram of other structure example of expression holding member.
Fig. 5 is the sectional view that is used to explain the major part of the vacuum flush system that floats servicing unit.
Fig. 6 is the horizontal sectional view of vacuum flush system that is used to explain other structure example of guiding device.
Fig. 7 is the side cross-sectional view of the vacuum flush system of Fig. 6.
Fig. 8 is the horizontal sectional view of major part that is used to explain the vacuum flush system of upper gas injection mechanism.
Fig. 9 is the side cross-sectional view that is used to explain the vacuum carrying device of upper gas injection mechanism.
Figure 10 is the expanded view of the major part of Fig. 9.
Figure 11 A is the figure of configuration example of holding section of the holding member of explanation guiding device.
Figure 11 B is the figure of other configuration example of holding section of the holding member of explanation guiding device.
Figure 12 A is that the figure that substrate is carried out the state of 4 supportings is floated in the experiment in explanation.
Figure 12 B is that the figure that substrate is carried out the state of 8 supportings is floated in the experiment in explanation.
Figure 13 A is the figure that the state (before floating) that utilizes the holding member supporting substrates is described.
Figure 13 B is the figure that dotted line among Figure 13 A is partly enlarged.
Figure 14 A is the figure that the gas flow that is injected in substrate back schematically is described.
Figure 14 B is the figure that the stable state that floats of substrate schematically is described.
Figure 15 schematically explains the not figure of the stable state that floats of substrate.
Symbol description:
1: vacuum flush system; 100: plasma processing apparatus; 101: container handling; 101a, 101b: peristome; 101c: exhaust outlet; 103: carry and put platform (lower electrode); 103b: gas jetting hole; 105: spray head (upper electrode); 107: gas flow path; 109: the gas pipe arrangement; 111: the gas supply source; 200a: the first vacuum carrying device; 200b: the second vacuum carrying device; 201: the conveyance container; 201a, 201b: opening is used in conveyance; 201c: exhaust outlet; 203: the conveyance platform; 205: guiding device; 207: float and use gas jetting hole; 209: float and use gas flow path; 210: float and use the gas pipe arrangement; 211: float and use the gas supply source; 213: holding member; 213a: maintaining part; 213b: arm; 215: track; 217: the movable support body; GV: the family of power and influence; F: carry the face of putting; S: substrate
Embodiment
Specify execution mode of the present invention with reference to the accompanying drawings.Fig. 1 is the horizontal sectional view of the brief configuration of the related vacuum flush system 1 of this execution mode of expression, and Fig. 2 is its side cross-sectional view.
Vacuum flush system 1 comprises: the LCD (LCD) to as handled object carries out the plasma processing apparatus 100 of plasma etch process with glass substrate (following only claim " substrate ") S; The first vacuum carrying device 200a and the second vacuum carrying device 200b with the both sides that are separately positioned on this plasma device 100.The first vacuum carrying device 200a, plasma processing apparatus 100 and the second vacuum carrying device 200b are in this order in the setting that links to each other of the conveyance direction of substrate S.In addition, the conveyance direction of substrate S is represented with the arrow among Fig. 2.
Container handling 101 forms more shallow box.Container handling 101 constitutes and can bear specified vacuum degree for example 1 * 10
-4The pressure vessel of Pa, the aluminium of for example being handled (anodized) by the surface by corrosion protection constitutes.Be formed with in two mutual relative sides of container handling 101 and be used to move into peristome 101a, the 101b that takes out of substrate S.In addition, be provided with exhaust outlet 101c in the many places, bottom of container handling 101 (being 4 places among Fig. 1), each exhaust outlet 101c is connected on the vacuum pump through not shown blast pipe.
Carry and to put platform 103 and comprise: have and carry the main body 103a that puts face F that carries that puts substrate S; Be formed on to carry and put a plurality of gas jetting hole 103b on the face F; Be communicated with, be formed on main body 103a gas inside stream 107 with gas jetting hole 103b.Gas jetting hole 103b double as is for spraying the heat carrier spray-hole performance function of transmitting the heat carrier that carries the temperature of putting platform 103 to substrate S.In Fig. 1, the spread geometry that carries the gas jetting hole 103b that puts face F is a double rectangle inside and outside overlooking down, but is not limited thereto.In addition, put on the face F, also can have not shown Electrostatic Absorption mechanism on the platform 103 carrying to put for substrate S being fixed on carry.
As shown in Figure 2, the internal diameter of each gas jetting hole 103b that is communicated with gas flow path 107 forms narrowlyer, thereby can make the injection at gas jetting hole 103b place press higher.Gas flow path 107 is connected with gas supply source 111 through gas pipe arrangement 109.In addition, on gas pipe arrangement 109, be equipped with valve, pump etc., but omit diagram.
From gas supply source 111 through gas jetting hole 103b with the pressure of regulation to the back side of substrate S jet gas; Thus; Can substrate S be put under the state that face F floats, in the handing-over of carrying out substrate S between the plasma device 100 and the first vacuum carrying device 200a or between the plasma device 100 and the second vacuum carrying device 200b from carrying.Like this, in this execution mode, because elevating mechanism not necessarily in the handing-over of substrate S, so can under the situation of not using elevating mechanism, suppress the height of container handling 101.So; Have the following advantages: can reduce material, the processing cost of container handling 101, and can implement to be applicable to upper electrode (spray head 105) easily and carry and put distance (space G) that carrying of platform 103 put between face F Cement Composite Treated by Plasma for narrow narrow crack (narrow gap).
In addition, through switch as from the high gas of the heat transmittings such as He of gas supply source 111 gas supplied with float the N of usefulness
2Deng non-active gas, can make gas pipe arrangement 109, gas flow path 107 and gas jetting hole 103b be also used as back side refrigerating gas supply passageway and substrate S float supply passageway with gas.
The first vacuum carrying device 200a comprises: with the conveyance container 201 of plasma processing apparatus 100 in abutting connection with setting; Be arranged on the conveyance platform 203 in the conveyance container 201; Guide a pair of guiding device 205,205 of substrate S with the both sides that are arranged on conveyance platform 203, in the conveyance direction.
As shown in Figure 2, form narrowlyer with floating each internal diameter that floats with gas jetting hole 207 that is communicated with gas flow path 209, thereby can make the injection of floating press higher with gas jetting hole 207 places.Float with gas flow path 209 and be connected on the gas supply source 211 through floating with gas pipe arrangement 210.In addition, on floating, be equipped with valve, pump etc., but omit diagram with gas pipe arrangement 210.In addition, for spread geometry, arrangement pitch and the number of floating that is formed on the platform main body 203a with gas jetting hole 207, as long as substrate S is floated, can be arbitrary shape, at interval, number.
As using gas, can use for example clean dry air, non-active gas etc. from floating with 211 the floating of supply of gas supply source.
Guiding device 205 comprises: the holding member 213 that keeps substrate S; The track 215 of moving direction that on the conveyance direction, be provided with, regulation holding member 213 with parallel lines; Supporting holding member 213, the movable support body 217 that on track 215, moves back and forth; With the drive source that movable support body 217 is moved back and forth (not shown).
In this execution mode, in the Width of substrate S (with the conveyance direction direction of pair of orthogonal mutually), a pair of holding member 213 is with relative each other position relation configuration.Promptly; Substrate S is clipped in the middle and at a pair of holding member 213 of both sides configurations; With can be parallel and mode that synchronously move back and forth along the conveyance direction constitute, two holding members 213 clip substrate S from both sides, the moving direction of the substrate S of constrained float state.Like this, it is carried out constrained, can reduce the error of the conveyance direction of substrate S, improve the conveyance positional precision through Width from substrate S.In addition; The method of constrained substrate S is not limited to from both sides; Also can only carry out constrained, but, preferably carry out constrained in both sides from improving the viewpoint of conveyance positional precision and conveyance reliability from sidepiece on one side or from front end or the rear end of substrate S.
Holding member 213 comprises: engage holding section (junction surface) 213a that keeps with the side of substrate S; With can the modes that this holding section 213a be inserted in the container handling 101 being extended the arm 213b that is provided with at transverse direction (horizontal direction).The base end side of arm 213b is fixed on the movable support body 217.As the structure of the holding section 213a of holding member 213, get final product so long as can retrain the structure of moving direction of the substrate S of float state.As the example of holding section 213a, can enumerate out clamping (clamp) mechanism (fixture) of clamping substrate S.For example, clamping device 221 as shown in Figure 3 comprises: a pair of up and down butt parts 223a, 223b; The distance that makes these butt parts 223a, 223b near or the rotating shaft 225 that separates; With the not shown drive divisions such as motor that are used to drive this rotating shaft 225.
In clamp system 221, for example utilize drive division to make rotating shaft 225 along direction shown in arrow rotation among Fig. 3, thus, the butt parts 223b of downside is risen, clamp thereby the edge part of substrate S is clamped between butt parts 223a, the 223b.In this case, through making rotating shaft 225 along opposite spin, butt parts 223b descends, and the distance expansion between the butt parts 223a, thereby the clamping of substrate S is removed.
In addition, as other example of holding section 213a, can adopt utilization is the Electrostatic Absorption mechanism of the electrostatic force absorption substrate S of representative with the Coulomb force.For example, electrostatic adsorption device 231 shown in Figure 4 comprises: the adsorption substrates 233 that is made up of dielectric; Be embedded in the first electrode 235a and the second electrode 235b in this adsorption substrates 233; With the DC power supply 237a, the 237b that are used for these first electrode 235a and the second electrode 235b are applied respectively direct voltage.In addition, DC power supply 237a is electrically connected through supply lines 239a, 239b respectively with the second electrode 235b with the first electrode 235a, DC power supply 237b.Between the edge part of the substrate S that floats and conveyance platform 203, be inserted with under the state of adsorption substrates 233, this electrostatic adsorption device 231 is through applying direct voltage and utilize the edge part of Coulomb force Electrostatic Absorption substrate S and it being fixed to the first electrode 235a and the second electrode 235b.Through stopping to apply voltage to the first electrode 235a, the second electrode 235b, can remove the fixing of substrate S from DC power supply 237a, 237b.In addition, in Fig. 4, enumerated bipolar system electrostatic adsorption device 231, but also can be the Electrostatic Absorption mechanism of acyclic type with pair of electrodes 235a, 235b.
The movable support body 217 of guiding device 205 has rotating mechanism 217a such as the linear guides (linear guide way) that is used on track 215, moving back and forth, roller, wheel, is used to drive from the power of not shown drive source.As the mechanism that movable support body 217 is moved, so long as the mechanism that movable support body 217 levels are moved back and forth gets final product, do not have special restriction, for example, except that mechanical mechanisms such as coaster, gear, cylinder, also can utilize linear motor etc.The guiding device 205,205 of the both sides that conveyance platform 203 is clipped in the middle forms, and two movable support bodies 217 can link and on track 215, move abreast.
In having the first vacuum carrying device 200a of above structure; Use gas from floating through floating to spray to float to the back side of substrate S with the pressure of regulation with gas jetting hole 207 with gas supply source 211; Thus; Can float under the state about several mm～several cm at the upper surface that makes substrate S from conveyance platform 203, utilize guiding device 205 guiding substrate S, it carried out conveyance to plasma processing apparatus 100.
The guiding device 205 of the first vacuum carrying device 200a and vacuum treatment installation 100 carry the location put the substrate S delivery position between the platform 103, can through utilize position testing agencies (not shown) such as linear scale for example detect holding section 213a (or movable support body 217) thus amount of movement accurately grasp.
The structure of the second vacuum carrying device 200b is that centre mirror picture symmetry is all identical outward with the first vacuum carrying device 200a divided by plasma processing apparatus 100, and therefore, the identical symbol of structure mark to identical omits explanation.
Between conveyance container 201 and container handling 101, be provided with family of power and influence GV as blocking mechanism that can switch.Family of power and influence GV interdicts the atmosphere gas of 201,201 in the conveyance container of container handling 101 and both sides institute adjacency under off status, opening the mobile possibility that becomes that makes 201,201 in container handling 101 and conveyance container be communicated with and make substrate S under the state.In addition, use opening 201a, also be equipped with family of power and influence GV, thereby make the vacuum flush system 1 and the blocking of the atmosphere gas of outside become possibility in the conveyance of each conveyance container 201.
As shown in Figure 5, in container handling 101 at peristome 101a and carry and to put 103 of platforms, also can be provided with the substrate S in the conveyance way back side jet gas float servicing unit 121.Floating servicing unit 121 comprises: the gas blowing plate 125 with a plurality of gas jetting holes 123; Supporting gas blowing plate 125 also utilizes not shown driving mechanism driven drive rod 127 up and down; With the gas supply source 129 that is connected on the gas jetting hole 123.Be formed with gas flow path 127a in the inside of drive rod 127, this gas flow path 127a is connected on the gas supply source 129 with gas pipe arrangement 131 through floating to assist.In addition, in Fig. 5, symbol 133 is to be used to guarantee that the drive rod 127 and the bubble-tight O shape of the opening portion of container handling 101 are encircled.In addition, auxiliary be equipped with valve, pump etc. on gas pipe arrangement 131 floating, illustrate but omit.
With the interval linearity of regulation gas jetting hole 123 is set at the Width of substrate S (with the direction of the conveyance direction quadrature of substrate S).As using gas, can use for example clean dry air, non-active gas etc. from floating of gas jetting hole 123 injections is auxiliary.
When conveyance substrate S, utilize above-mentioned driving mechanism, as illustrated in fig. 5 gas blowing plate 125 is risen to the position near substrate S, spray to float to the back side of substrate S with the pressure of stipulating from spray-hole 123 and use assist gas.Utilization is floated and auxiliary use gas, prevents that substrate S can improve the conveyance reliability because of deadweight generation deflection in the conveyance way.
When substrate S is implemented predetermined process, can utilize driving mechanism that the height of gas blowing plate 125 is dropped to for example to carry and put carrying of platform 103 and put below the face F, use as the buffer board that the processing gas flow in the container handling 101 is carried out rectification.Be also used as rectification through the gas blowing plate 125 that will float servicing unit 121 and use buffer board, can improve the reliability of floating conveyance and do not make apparatus structure complicated.
Like this, float servicing unit 121 in the substrate floating that carrying of the conveyance platform 203 of conveyance container 201 and container handling 101 put between the platform 103 zone more weak, prevent the generation of the deflection that the deadweight by substrate S causes with gas pressure.Utilize float-up device 121, even carrying of the conveyance platform 203 of conveyance container 201 and container handling 101 puts that 103 distances of platform are elongated also can to make the high conveyance of floating of reliability become possibility.
Flow process to processing substrate in the base plate processing system with said structure describes.
At first, utilize not shown transport mechanism to move into substrate S from the outside to the first vacuum carrying device 200a.Float to the ejection of the rear side of this substrate S with gas squit hole 207 from floating of conveyance platform 203 and to use gas, substrate S is floated above conveyance platform 203.In this state, will utilize the holding member 213 of a pair of guiding device 205 to keep with respect to the rear end of the substrate S of conveyance direction.In addition, the gas jetting hole 103b put platform 103 from carrying of plasma processing apparatus 100 floats the preparation of conveyance also with the pressure injection gas of regulation.Making the family of power and influence GV of 100 of the first vacuum carrying device 200a and plasma processing apparatus is open state, and making the family of power and influence GV between the plasma processing apparatus 100 and the second vacuum carrying device 200b is closed condition.
Then, on track 215, move, in the first vacuum carrying device 200a, in plasma processing apparatus 100, float conveyance substrate S to plasma processing apparatus 100 through making movable support body 217.At this moment, thereby also can float servicing unit 121 action and spray to float to the back side of substrate S and auxiliaryly use gas, prevent the deflection (with reference to Fig. 5) of substrate S through making.When movable support body 217 arrived the leading section (terminals of plasma processing apparatus 100 sides) of track 215, substrate S became the state that gets into (container handling 101 inside) in the vacuum treatment installation 100, therefore, removed the maintenance of holding member 213 at this location solution.
When removing the maintenance of holding member 213, owing to the gas that carries the gas jetting hole 103b that puts platform 103 from processing unit 100, substrate S becomes the static state that floats.Like this, accomplished the handing-over to the substrate S of vacuum treatment installation 100 from the first vacuum carrying device 200a.Then, reduce, put carrying of platform 103 and put on the face F thereby substrate S is descended make to put its year carrying through making to press gradually from the injection of the gas of gas jetting hole 103b.Utilize not shown electrostatic adsorption device fixing base S then.
Then, close the family of power and influence GV of 100 of the first vacuum carrying device 200a and plasma processing apparatus, carrying under the state of putting platform 103 predetermined process such as substrate S being carried out plasma etching carrying to put.In this is handled, can through from gas jetting hole 103b with the pressure of regulation for example 100～400Pa to the rear side sustainable supply gas of substrate S substrate S is carried out adjustment.In this is handled, not the N that floats usefulness to the rear side gas supplied of substrate S from gas squit hole 103b
2Deng non-active gas, preferably switch to the high gases of thermal conductivity such as He.
After finishing dealing with, temporarily stop from gas jetting hole 103b, remove the fixing of Electrostatic Absorption mechanism to the back side of substrate S supply gas.Then, the family of power and influence GV between the open plasma processing unit 100 and the second vacuum carrying device 200b.Then, rise, make substrate S put carrying of platform 103 and put face F and float from carrying through making to press gradually from the injection of the gas of gas jetting hole 103b.In addition, float with the pressure injection of regulation with gas jetting hole 207 from floating of the conveyance platform 203 of the second vacuum carrying device 200b and to use gas, carry out the preparation of floating conveyance.
Make substrate S put carrying of platform 103 and put under the state that face F floats from carrying; The movable support body 217 that makes the second vacuum carrying device 200b moves to the terminal of plasma processing apparatus 100 sides along track 215, the end that utilizes the holding section 213a of holding member 213 to keep substrate S front.Then; Movable support body 217 through making the second vacuum carrying device 200b moves to conveyance direction the place ahead on track 215, while guide the moving direction of substrate S to float conveyance substrate S from plasma processing apparatus 100 to the second vacuum carrying device 200b.At this moment, thereby also can float servicing unit 121 action and spray to float to the back side of substrate S and auxiliaryly use gas, prevent the deflection (with reference to Fig. 5) of substrate S through making.When movable support body 217 arrives the front end (terminal in conveyance direction downstream) of track 215, the major part of substrate S gets into the stage in the second vacuum carrying device 200b; Should substrate S be joined to other not shown transport mechanism, remove the maintenance of the holding section 213a of holding member 213 the substrate S of float state.
As stated, utilize not shown transport mechanism the substrate of conveyance to the second vacuum carrying device 200b to the outside conveyance of vacuum flush system 1.In addition, in the conveyance direction downstream of the second vacuum carrying device 200b, also further other vacuum treatment installation of alternate configurations, other vacuum carrying device carry out the processing of different content continuously.In addition, also can the substrate S that in plasma processing apparatus 100, accomplishes processing be floated conveyance and return the first vacuum carrying device 200a.Further, also can the first vacuum carrying device 200a and the second vacuum carrying device 200b be used as the loadlock may (load locking room) that can alternately switch atmospheric pressure state and vacuum state.
In addition, in Fig. 1 and Fig. 2, express utilization with the substrate S structure that each holding section 213a of a pair of holding member 213 of configuration keeps substrate S at two places that is clipped in the middle, but also can keep substrate S in more position.For example Fig. 6 and vacuum flush system 1a shown in Figure 7 constitute and use the holding member 213 with two holding section 213a, keep substrate S in 4 corners.In this case, use is carried out constrained to one of substrate S two distolateral corners at Width at set a pair of holding section 213a, the 213a of a pair of arm 213b midway.Simultaneously, can use at the set a pair of holding section 213a of the front end of a pair of arm 213b, 213a constrained is carried out at Width in two corners of the other end of substrate S.Like this, through keeping substrate S in 4 corners, the directional precision that can float conveyance improves, and the conveyance reliability is further improved.In addition, of the back, aspect making that substrate S is stable and floating, the number that is more preferably the holding section 213a that makes a holding member 213 is more than three.The structure of holding section 213a can adopt for example clamping device 221 same as described above, electrostatic adsorption device 231.In addition, in Fig. 6 and Fig. 7, the structure mark identical symbol identical with Fig. 1 and Fig. 2 omits explanation.
In addition, in floating conveyance, from the gas jetting hole 207 of conveyance platform 203 under the bigger situation of gas pressure that the rear side of substrate S is sprayed, the central portion of substrate S may swell, the substrate S distortion (protuberance) that raises up.If substrate S deforms, swells, the gas pressure that then sprays from gas jetting hole 207 becomes inhomogeneous in substrate S face, and the attitude of floating of substrate S becomes unstable, in the conveyance way, falls easily or generation and contacting of container etc.Be used to correct the distortion of such substrate S, the preferred construction example of protuberance with Fig. 8～10 expressions.Fig. 8 is the horizontal sectional view with first vacuum carrying device 200a of upper gas injection mechanism 241, and this upper gas injection mechanism 241 is relative with conveyance platform 203, thereby the upper surface jet gas of substrate S is corrected the distortion of substrate S.In addition, Fig. 9 is the side cross-sectional view with first vacuum carrying device 200a of upper gas injection mechanism 241, and Figure 10 is the expanded view of the major part of Fig. 9.
This upper gas injection mechanism 241, above substrate S to have the for example nozzle arm 243 of cruciform arrangement with conveyance platform 203 relative modes.In addition, the configuring shapes of nozzle arm 243 is not limited to cross.Four ends of nozzle arm 243 are separately fixed at the upper surface of the holding section 213a of holding member 213.The lower surface of nozzle arm 243 is provided with a plurality of gas jetting holes 245 (with reference to Figure 10).Each gas jetting hole 245 is communicated with the gas inside stream that is formed on nozzle arm 243 (omitting diagram), and this gas flow path is connected not shown rectification with on the gas supply source through not shown flexual pipe arrangement.
Use gas through correcting to the upper surface injection of substrate S, and can correct the protuberance of the central portion of substrate S, make the shape of relative conveyance platform 203 keeping parallelisms of substrate S from the gas jetting hole 245 of nozzle arm 243.That is, upper gas injection mechanism 241 is as mechanism's performance function that the shape of float state infrabasal plate S is corrected.Like this, through being equipped with upper gas injection mechanism 241, distortion, the protuberance of the substrate S of conveyance floated in inhibition, can improve the reliability of conveyance.In addition, upper gas injection mechanism 241 is fixed on the holding member 213 of guiding device 205 and can with the same moved further of substrate S, thus, can correct this distortion, protuberance with the location independent ground that floats the substrate S in the conveyance.
In addition, upper gas injection mechanism 241 relatively is set,, can finely tunes the levitation height position of substrate S through regulating from the pressure of the gas that sprays respectively up and down of substrate S with conveyance platform 203.That is, upper gas injection mechanism 241 can be as mechanism's performance function of the levitation height position of adjusting substrate S.
Then, the method to the holding member 213 supporting substrates S that utilize guiding device 205 describes.The holding member 213 of guiding device 205 is preferably can be with the structure of the right sides of uniform height supporting substrates S.For example, preferably in clipping the relative a pair of holding member 213 of substrate S, on the holding member 213 (arm 213b) of a side holding section 213a more than 3 places is set.Preferably be shown in the above holding section 213a in 4 places is set on the holding member 213 like Figure 11 A.In addition, as other structure example, shown in Figure 11 B, preferably through the holding section 213a of holding member 213 being formed the shape of overlength, the structure that the major part of the side of substrate S is supported.
Here, the experimental result whether attitude can produce difference because of the difference at the supporting position of holding member 213 of floating that substrate S is discussed is described.Figure 12 A representes to utilize near situation four jiaos of holding section 213a supporting substrates S of holding member 213 (below be called " 4 supportings "); Figure 12 B representes four jiaos except that substrate S, also amounting to situation about supporting at 8 places (below be called " 8 supportings ") towards each two place on the side of the left and right sides of direct of travel.In addition, the arrow of Figure 12 A and Figure 12 B is represented the conveyance direction of substrate.
At first, in the container handling 101 of plasma processing apparatus 100, shown in Figure 12 A, Figure 12 B difference, utilize the holding section 213a of holding member 213 that substrate S is carried out 4 supportings or 8 supportings.In this stage, shown in Figure 13 A because do not put the gas jetting hole 103b jet gas on the face F from being formed on to carry, so thereby the central portion generation deflection of substrate S put carrying of platform 103 and put face F and connect with carrying.In this experiment, as amplifying expression among Figure 13 B, to put carrying of platform 103 and put face F with respect to carrying, the height of the bearing position of the substrate S of holding section 213a (carry and put the clearance G 1 between face F and the bearing position) is set to 5mm.Making the pressure in the container handling 101 is 1 * 10
-2The vacuum state of Pa.The arrangement of gas jetting hole 103b is identical with Fig. 1, is rectangular arranged double inside and outside overlooking down, and each gas jetting hole 103b interval (spacing (pitch)) each other that is listed as adjacency is set as 30mm.In addition, use the substrate S that is of a size of minor face 550mm * length limit 650mm.
Then, the gas jetting hole 103b that puts platform 103 from carrying of plasma processing apparatus 100 sprays N to the back side of substrate S
2Gas.In the scope of 10～3000ml/min (sccm), change N
2The flow of gas is observed substrate S and is shown what kind of state movement.With stable float (A), float but unstable (B), do not float (C) three stages judgement estimated.In addition, " floating but shakiness " that B judges means, the central portion of substrate S alternately repeats upwards to be the state of convex protuberance and to be the recessed state of convex downwards, can not keep stable attitude.Table 1 writes down out under the situation of 4 supportings the result of determination under the situation with 8 supportings.
[table 1]
| Gas flow [mL/min] | 4 supportings | 8 supportings | Gas flow [mL/min] | 4 supportings | 8 supportings |
| 10 | C | C | 130 | B | A |
| 20 | C | C | 140 | B | A |
| 30 | C | C | 150 | B | A |
| 40 | C | C | 160 | B | A |
| 50 | C | C | 170 | B | A |
| 60 | C | A | 180 | B | A |
| 70 | C | A | 190 | B | A |
| 80 | C | A | 200 | B | A |
| 90 | C | A | 500 | B | A |
| 100 | C | A | 1000 | B | A |
| 110 | B | A | 2000 | B | A |
| 120 | B | A | 3000 | B | A |
As shown in table 1, under the situation of 4 supportings (with reference to Figure 12 A), gas flow be 100mL/min (sccm) when following substrate S can not float, 110mL/min (sccm) can float but can not keep when above and holds position.On the other hand, under the situation of 8 supportings (with reference to Figure 12 B), gas flow be 50mL/min (sccm) when following the too small substrate S of flow can not float, float but when 60mL/min (sccm) is above, can stablize.
Shown in above result, through 8 supportings, even gas jetting hole is not set carrying on whole that puts platform 103, also can utilize overlook down be inside and outside the gas jetting hole 103b that uses of the back side refrigerating gas arranged of double rectangular shape, substrate S is stablized floats.In addition, can be clear and definite, substrate S is stable to be floated in order to make, and preferably removes four jiaos of substrate S, also supports at side (direct of travel of relative substrate S).
8 supportings can be stablized the reason of floating down about the attitude of 4 supporting infrabasal plate S is unstable, if can rationally explain by following consideration.Under the situation of 8 supportings, substrate S is before floating, and central portion can be because of deadweight deflection downwards, about the limit become higher than central portion.So, become the shape (with reference to Figure 13 A) that is convex curvature downwards in the relative cross section of the Width of the direct of travel quadrature of substrate S.Under the situation of 8 supportings, utilize a plurality of holding section 213a to support, the side about making roughly is identical height equably, thus, the cross section of upper substrate S Width all is the shape that roughly is convex curvature equably downwards in any position.
On the other hand; Under the situation of 4 supportings; Though the front and back end of the conveyance direction of substrate S place becomes the shape that downwards be convex curvature identical with the situation of 8 supportings,, near the central authorities of conveyance direction (promptly; Near the center of substrate S), the side about becoming is the shape of deflection downwards also.That is, under the situation of 4 supportings, except that four jiaos of the substrate S that is supported, arbitrary place all becomes near the reclinate shape mid point.
Think that the gas of the rear side that is injected into substrate S can form air-flow along the back side of substrate S.Under the situation of 8 supportings; Because the limit about substrate S is roughly high than central portion equably; So, shown in figure 14, think the gas that sprays to the back side of substrate S can form towards with the direction gas stream Gf that side is escaped from the left and right sides of substrate S direct of travel quadrature.Its result is that shown in Figure 14 B, the attitude stabilization of substrate S becomes possibility for the Width cross section for being the shape of convex curvature downwards, making to stablize to float.
On the other hand; Under the situation of 4 supportings, be injected into substrate S rear side gas flow might not, but escape forwards, backwards; Consequently; Think and repeat to occur following state that promptly, gas hold-up is at substrate S and carry the state that the state put between the face F and gas are escaped from arbitrary limit quickly.Its result is that shown in figure 15, the central portion of substrate S alternately repeats upwards to be the state and the state (etat lacunaire) that protrudes of convex protuberance downwards, can not keep holding position.
As stated, substrate S is stable to be floated in order to make, and preferred the employing promotes the bearing method of formation from the gas stream Gf of back side side towards the left and right sides of substrate S.Therefore, preferably utilize a holding member 213 with at least 3 points (for example, near two angles and the center), preferred 4 points (for example, two angles and middle uniform two places thereof) come the one-sided limit of supporting substrates S.In addition, for obtaining identical effect, for example also can be shown in Figure 11 B, the holding section 213a of holding member 213 is formed the shape of longer size, the integral body of the side of substrate S is supported.The maintenance method of such substrate S not only is applicable to plasma processing apparatus 100, also can be useful in the situation of utilizing holding member 213 supporting substrates S among the first vacuum carrying device 200a and the second vacuum carrying device 200b.
In addition, be the formation of promotion, utilize the height and position (carry and put the clearance G 1 between face F and bearing position) of the side of holding section 213a supporting substrates S also very important from the gas stream Gf of back side central portion side of substrate S towards the left and right sides.Through making this clearance G 1 enough big,, its central portion (with carrying the nearest part of putting face F) is floated downwards even be under the state of convex deflection at substrate S.Just, if clearance G 1 is excessive, then gas can excessively be escaped, and substrate S is floated.So for example the levitation height at the central portion of substrate S is under the situation of 1mm～2mm, it is above and below the 10mm that clearance G 1 preferably is set to 4mm, and more preferably 5mm is above and below the 8mm.In addition, through clearance G 1 is set in above-mentioned scope, the attitude before substrate S floats becomes the shape of downward convex curvature, can keep this dimensionally stable and central portion is floated.
In addition, through the upper gas injection mechanism 241 shown in Fig. 8～10 is set, the central portion that can effectively suppress substrate S upwards is the convex protuberance, therefore, can more stably keep substrate S is convex curvature downwards in the cross section of Width the attitude of floating.
As described above; Against vacuum treatment system 1; In the first vacuum carrying device 200a or the second vacuum carrying device 200b; Spray to float to the back side of substrate S with the pressure of regulation with gas jetting hole 207 from floating of conveyance platform 203 and use gas, under the state that substrate S floats, utilize guiding device 205 conveyance to be carried out to it in its channeling conduct one side on one side.Like this, do not use the rotation of can stretching carrying arm and can and vacuum treatment installation 100 between under float state, carry out the handing-over of substrate S.So, make the miniaturization of vacuum conveyance container become possibility, can realize that particularly saving is provided with the space, suppresses cost of manufacture.
In addition, particularly owing to adopt series system (streamline mode (in line)), for for example FPD is with handled object S such as glass substrates, the restriction of length along its length reduces, make contrast so far longer size the overlength substrate be treated as possibility.
In addition; Float the conveyance mode because be; So can realize raising by the productivity ratio brought of series connection (streamline (in line)) conveyance mode, and can not produce because of with the conveyance of prior art in employed carrying arm and fork contact cause the stripping charge of substrate S or the problem of the generation of particulate, the breakage of substrate S etc.
More than recorded and narrated execution mode of the present invention, but the present invention is not limited to above-mentioned execution mode, can carries out all distortion.For example; In the above-described embodiment, enumerate the plasma processing apparatus 100 that carries out etch processes and describe as an example of vacuum treatment installation, but the time be not limited to etch processes; So long as under vacuum condition, substrate carried out the processing unit of predetermined processing; Can especially restrictedly not be applicable to the present invention, for example, film formation device, cineration device etc. also can be suitable for.
In addition, enumerate out LCD (LCD) in the above-mentioned execution mode with the example of glass substrate, but use substrate, for example electroluminescence (ElectroLuminescence for other FPD as handled object; EL) display, plasma display (PDP) etc. can be equally as handled objects.In addition, the present invention is not limited to FPD and uses substrate, can be applicable to that also for example solar battery panel is used substrate.
Moreover the present invention is not limited to series system, also can be applicable to the conveyance of the handled object in the vacuum flush system of cohort (cluster) mode with a plurality of processing unit.
Claims (18)
1. a vacuum treatment installation is implemented predetermined process to handled object under vacuum state, it is characterized in that, comprising:
Container handling with the peristome that handled object is moved into take out of;
Carrying of interior support handled object at said container handling put platform; With
Put the gas supply source of platform supply gas to said year,
Putting platform in said year comprises:
Have and carry the carrying of the face of putting of carrying put handled object and put the platform main body;
Be formed on a plurality of gas jetting holes of putting on the face in said year; With
Be communicated with, be formed on the gas inside stream of putting the platform main body in said year with said gas jetting hole,
Through with the regulation pressure from said gas jetting hole to the back side of handled object jet gas; Make handled object under the state of putting face in said year and floating; At said vacuum treatment installation and be arranged on the handing-over of carrying out handled object between the vacuum carrying device of outside of said container handling
Said gas squit hole is used as to be put the handled object transmission of putting on the face at said year and put the heat carrier squit hole of the temperature of platform in said year carrying.
2. vacuum flush system comprises:
Handled object is implemented the vacuum treatment installation of predetermined process at vacuum state; With
With said vacuum treatment installation in abutting connection with the vacuum carrying device that is provided with, under vacuum condition, handled object is carried out conveyance, this vacuum flush system is characterised in that:
Said vacuum treatment installation comprises:
Container handling with the peristome that handled object is moved into take out of;
Carrying of interior support handled object at said container handling put platform; With
Put the gas supply source of platform supply gas to said year,
Putting platform in said year comprises:
Have and carry the carrying of the face of putting of carrying put handled object and put the platform main body;
Be formed on a plurality of gas jetting holes of putting on the face in said year; With
Be communicated with, be formed on the gas inside stream of putting the platform main body in said year with said gas jetting hole,
Through with the regulation pressure from said gas jetting hole to the back side of handled object jet gas; Make handled object under the state of putting face in said year and floating; At said vacuum treatment installation and be arranged on the handing-over of carrying out handled object between the vacuum carrying device of outside of said container handling
Said vacuum carrying device comprises:
Has the conveyance that is used for the conveyance handled object conveyance container with opening;
Be arranged on the conveyance platform in the said conveyance container;
Be separately positioned on the both sides of said conveyance platform, along a pair of guiding device of conveyance direction to the handled object channeling conduct; With
Use the gas supply source to floating of said conveyance platform supply gas,
Said conveyance platform comprises:
The platform main body;
Upper surface a plurality of that are formed on said main body are floated and are used gas jetting hole; With
Gas flow path is used in floating of being communicated with said gas jetting hole,
Through with the pressure of regulation from said float to spray to float to the back side of handled object with gas jetting hole use gas; Make under the state that handled object floats from the upper surface of said main body; Utilize said guiding device to the handled object channeling conduct, move into this handled object or take out of this handled object from said vacuum treatment installation to said vacuum treatment installation.
3. vacuum flush system as claimed in claim 2 is characterized in that:
Said guiding device comprises the holding member that keeps the said conveyance platform in handled object one edge to move back and forth on one side, under the state that utilizes said holding member maintenance handled object, handled object is floated conveyance.
4. vacuum flush system as claimed in claim 3 is characterized in that:
Said holding member comprises the clamping device of clamping handled object.
5. vacuum flush system as claimed in claim 3 is characterized in that:
Said holding member comprises the electrostatic adsorption device that adsorbs handled object.
6. like each described vacuum flush system in the claim 3 to 5, it is characterized in that:
Said holding member supports handled object with the gas that sprays to the back side of the handled object that is in float state towards the mode that the direction with the direct of travel quadrature of handled object forms the gas stream that side is escaped from the left and right sides.
7. like each described vacuum flush system in the claim 3 to 5, it is characterized in that:
Said holding member becomes the mode that is bowed downward to the convex shape in the cross section with the Width of direct of travel quadrature and supports handled object to be at handled object under the state that floats.
8. like each described vacuum flush system in the claim 3 to 5, it is characterized in that:
Said holding member has a plurality of holding sections, supports more than utilizing three places of said holding section to a side of handled object.
9. like each described vacuum flush system in the claim 2 to 5, it is characterized in that:
Thereby said vacuum carrying device comprise with said conveyance platform dispose relatively, to gas blowing mechanism that the upper surface jet gas of handled object is corrected the distortion of handled object.
10. like each described vacuum flush system in the claim 2 to 5, it is characterized in that:
Being formed on said year of said vacuum treatment installation puts a plurality of said gas squit hole on the face and is used as and puts the handled object transmission of putting on the face at said year and put the heat carrier squit hole of the temperature of platform in said year carrying.
11., it is characterized in that like each described vacuum flush system in the claim 2 to 5:
In said container handling at said peristome and put the servicing unit that floats of the back side jet gas that has the handled object in conveyance way between the platform in said year.
12. vacuum flush system as claimed in claim 11 is characterized in that:
Saidly float servicing unit and comprise:
Have a plurality of gas jetting holes and gas blowing plate that can the oscilaltion displacement; With
To the gas supply source of gas jetting hole supply gas,
When the conveyance handled object, make said gas blowing plate rise near the position of handled object to come to the back side of handled object jet gas.
13. vacuum flush system as claimed in claim 12 is characterized in that:
Said gas blowing plate is as during handling handled object, the processing gas flow in the said container handling being carried out the buffer board of rectification and brought into play function.
14., it is characterized in that like each described vacuum flush system in the claim 2 to 5:
With said vacuum treatment installation is that center connection before and after it is provided with said vacuum carrying device.
15. a vacuum processing method is implemented to handle to handled object under vacuum condition, it is characterized in that:
This processing method is used vacuum flush system, and this vacuum flush system comprises: vacuum treatment installation and the vacuum carrying device that disposes in abutting connection with said vacuum treatment installation, wherein,
Said vacuum treatment installation comprises: the container handling with the peristome that handled object is moved into take out of; Carrying of interior support handled object at said container handling put platform; With to putting the gas supply source of platform supply gas in said year, and put platform in said year and comprise: have and carry the carrying of the face of putting of putting handled object and put the platform main body; Be formed on a plurality of gas jetting holes of putting on the face in said year; Be communicated with, be formed on the gas inside stream of putting the platform main body in said year with said gas jetting hole,
Said vacuum carrying device comprises: have the conveyance that is used for the conveyance handled object conveyance container with opening; Be arranged on the conveyance platform in the said conveyance container; Be separately positioned on the both sides of said conveyance platform, to a pair of guiding device of conveyance direction to the handled object channeling conduct; With use the gas supply source to floating of said conveyance platform supply gas, and said conveyance platform comprises: the platform main body; Upper surface a plurality of that are formed on said main body are floated and are used gas jetting hole; Use gas flow path with floating of being communicated with said gas jetting hole,
This processing method comprises:
In said vacuum carrying device; Through with the pressure of regulation from said float to spray to float to the back side of handled object with gas jetting hole use gas; Make under the state that handled object floats from the upper surface of said main body; Utilize said guiding device to the handled object channeling conduct, to the operation of the said handled object of said vacuum treatment installation conveyance;
Through with the pressure of regulation from said gas jetting hole to the back side of handled object jet gas, make handled object under the state of putting face in said year and floating, from the operation of said vacuum carrying device to said vacuum treatment installation handing-over handled object;
Carry at handled object and to put the operation of under the state of putting on the face in said year, implementing predetermined process; With
Through with the pressure of regulation from said gas jetting hole to the back side of handled object jet gas, make handled object under the state of putting face in said year and floating, to the operation of said vacuum carrying device handing-over handled object.
16. vacuum processing method as claimed in claim 15 is characterized in that:
Said guiding device, the mode that forms the gas stream that side is escaped from the left and right sides towards the direction with the direct of travel quadrature of handled object with the gas that sprays to the back side of the handled object that is in float state support handled object and to its channeling conduct.
17. vacuum processing method as claimed in claim 15 is characterized in that:
Said guiding device is to become in the cross section with the Width of direct of travel quadrature under the state that floats at handled object that the mode that is bowed downward to the convex shape supports handled object and to its channeling conduct.
18. vacuum processing method as claimed in claim 15 is characterized in that:
Said guiding device supports in many places side of handled object.
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| JP2009167514A JP5399153B2 (en) | 2008-12-12 | 2009-07-16 | Vacuum processing apparatus, vacuum processing system and processing method |
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| CN108010865A (en) * | 2016-10-28 | 2018-05-08 | 盟立自动化股份有限公司 | Wet-type etching device |
| CN107170667B (en) * | 2017-05-25 | 2020-07-28 | 昆山国显光电有限公司 | Substrate wet processing process method and substrate wet processing process device |
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| JP4389424B2 (en) * | 2001-12-25 | 2009-12-24 | 東京エレクトロン株式会社 | To-be-processed object conveyance mechanism and processing system |
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| CN101752173A (en) | 2010-06-23 |
| KR101140489B1 (en) | 2012-04-30 |
| KR20100068209A (en) | 2010-06-22 |
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