CN101689499B - 气化器和成膜装置 - Google Patents

气化器和成膜装置 Download PDF

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Publication number
CN101689499B
CN101689499B CN2008800225671A CN200880022567A CN101689499B CN 101689499 B CN101689499 B CN 101689499B CN 2008800225671 A CN2008800225671 A CN 2008800225671A CN 200880022567 A CN200880022567 A CN 200880022567A CN 101689499 B CN101689499 B CN 101689499B
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CN
China
Prior art keywords
mentioned
gasifier
charging stock
liquid charging
aeration parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008800225671A
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English (en)
Chinese (zh)
Other versions
CN101689499A (zh
Inventor
田中澄
二村宗久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN101689499A publication Critical patent/CN101689499A/zh
Application granted granted Critical
Publication of CN101689499B publication Critical patent/CN101689499B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
CN2008800225671A 2007-09-28 2008-08-20 气化器和成膜装置 Expired - Fee Related CN101689499B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP254625/2007 2007-09-28
JP2007254625A JP5179823B2 (ja) 2007-09-28 2007-09-28 気化器及び成膜装置
PCT/JP2008/064779 WO2009041189A1 (ja) 2007-09-28 2008-08-20 気化器及び成膜装置

Publications (2)

Publication Number Publication Date
CN101689499A CN101689499A (zh) 2010-03-31
CN101689499B true CN101689499B (zh) 2011-11-30

Family

ID=40511083

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008800225671A Expired - Fee Related CN101689499B (zh) 2007-09-28 2008-08-20 气化器和成膜装置

Country Status (5)

Country Link
JP (1) JP5179823B2 (ja)
KR (1) KR101244096B1 (ja)
CN (1) CN101689499B (ja)
TW (1) TW200932368A (ja)
WO (1) WO2009041189A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5595795B2 (ja) * 2009-06-12 2014-09-24 東京エレクトロン株式会社 プラズマ処理装置用の消耗部品の再利用方法
KR101084997B1 (ko) * 2011-06-30 2011-11-18 (주)그랜드 텍 캐리어 기체에 의한 화합물 기화용 버블러
JP5426616B2 (ja) * 2011-07-15 2014-02-26 株式会社リンテック 気化器及び該気化器を備えた液体原料気化供給装置
KR101721681B1 (ko) * 2016-03-24 2017-03-30 (주)티티에스 기화기
US11274367B2 (en) 2018-07-24 2022-03-15 Lintec Co., Ltd. Vaporizer
JP6694093B2 (ja) * 2018-07-24 2020-05-13 株式会社リンテック 気化器
JP7201372B2 (ja) * 2018-09-11 2023-01-10 株式会社アルバック アクリル気化器
US20230349041A1 (en) 2020-07-27 2023-11-02 Jiangsu Favored Nanotechnology Co., Ltd. Raw material gasification device, film coating device, film coating apparatus and feeding method therefor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1967776A (zh) * 2005-11-15 2007-05-23 东京毅力科创株式会社 半导体处理系统和气化器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06300197A (ja) * 1993-04-14 1994-10-28 Canon Inc 液体原料気化供給装置
JP3004165B2 (ja) * 1994-03-25 2000-01-31 東京エレクトロン株式会社 処理装置
KR20000000946A (ko) * 1998-06-05 2000-01-15 주재현 기화기 및 이를 사용한 화학 기상 증착장치
JP2005057193A (ja) 2003-08-07 2005-03-03 Shimadzu Corp 気化器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1967776A (zh) * 2005-11-15 2007-05-23 东京毅力科创株式会社 半导体处理系统和气化器

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平6-300197A 1994.10.28

Also Published As

Publication number Publication date
CN101689499A (zh) 2010-03-31
JP2009088157A (ja) 2009-04-23
WO2009041189A1 (ja) 2009-04-02
JP5179823B2 (ja) 2013-04-10
KR101244096B1 (ko) 2013-03-18
TW200932368A (en) 2009-08-01
KR20100057760A (ko) 2010-06-01

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Granted publication date: 20111130

Termination date: 20160820