WO2009041189A1 - 気化器及び成膜装置 - Google Patents
気化器及び成膜装置 Download PDFInfo
- Publication number
- WO2009041189A1 WO2009041189A1 PCT/JP2008/064779 JP2008064779W WO2009041189A1 WO 2009041189 A1 WO2009041189 A1 WO 2009041189A1 JP 2008064779 W JP2008064779 W JP 2008064779W WO 2009041189 A1 WO2009041189 A1 WO 2009041189A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ventilating member
- liquid material
- inlet
- ventilating
- vaporizer
- Prior art date
Links
- 239000006200 vaporizer Substances 0.000 title abstract 2
- 239000011344 liquid material Substances 0.000 abstract 4
- 230000005611 electricity Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800225671A CN101689499B (zh) | 2007-09-28 | 2008-08-20 | 气化器和成膜装置 |
KR1020097027029A KR101244096B1 (ko) | 2007-09-28 | 2008-08-20 | 기화기 및 성막 장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-254625 | 2007-09-28 | ||
JP2007254625A JP5179823B2 (ja) | 2007-09-28 | 2007-09-28 | 気化器及び成膜装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009041189A1 true WO2009041189A1 (ja) | 2009-04-02 |
Family
ID=40511083
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/064779 WO2009041189A1 (ja) | 2007-09-28 | 2008-08-20 | 気化器及び成膜装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5179823B2 (ja) |
KR (1) | KR101244096B1 (ja) |
CN (1) | CN101689499B (ja) |
TW (1) | TW200932368A (ja) |
WO (1) | WO2009041189A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101920256A (zh) * | 2009-06-12 | 2010-12-22 | 东京毅力科创株式会社 | 等离子体处理装置用的消耗部件的再利用方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101084997B1 (ko) * | 2011-06-30 | 2011-11-18 | (주)그랜드 텍 | 캐리어 기체에 의한 화합물 기화용 버블러 |
JP5426616B2 (ja) * | 2011-07-15 | 2014-02-26 | 株式会社リンテック | 気化器及び該気化器を備えた液体原料気化供給装置 |
KR101721681B1 (ko) * | 2016-03-24 | 2017-03-30 | (주)티티에스 | 기화기 |
JP6694093B2 (ja) * | 2018-07-24 | 2020-05-13 | 株式会社リンテック | 気化器 |
US11274367B2 (en) | 2018-07-24 | 2022-03-15 | Lintec Co., Ltd. | Vaporizer |
JP7201372B2 (ja) * | 2018-09-11 | 2023-01-10 | 株式会社アルバック | アクリル気化器 |
JP2023534066A (ja) * | 2020-07-27 | 2023-08-07 | 江蘇菲沃泰納米科技股▲フン▼有限公司 | 原料気化装置、コーティング装置、コーティング機器及びその材料投入方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06300197A (ja) * | 1993-04-14 | 1994-10-28 | Canon Inc | 液体原料気化供給装置 |
JPH07263361A (ja) * | 1994-03-25 | 1995-10-13 | Tokyo Electron Ltd | 処理装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000000946A (ko) * | 1998-06-05 | 2000-01-15 | 주재현 | 기화기 및 이를 사용한 화학 기상 증착장치 |
JP2005057193A (ja) | 2003-08-07 | 2005-03-03 | Shimadzu Corp | 気化器 |
JP4263206B2 (ja) * | 2005-11-15 | 2009-05-13 | 東京エレクトロン株式会社 | 熱処理方法、熱処理装置及び気化装置 |
-
2007
- 2007-09-28 JP JP2007254625A patent/JP5179823B2/ja not_active Expired - Fee Related
-
2008
- 2008-08-20 CN CN2008800225671A patent/CN101689499B/zh not_active Expired - Fee Related
- 2008-08-20 WO PCT/JP2008/064779 patent/WO2009041189A1/ja active Application Filing
- 2008-08-20 KR KR1020097027029A patent/KR101244096B1/ko not_active IP Right Cessation
- 2008-09-26 TW TW097137042A patent/TW200932368A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06300197A (ja) * | 1993-04-14 | 1994-10-28 | Canon Inc | 液体原料気化供給装置 |
JPH07263361A (ja) * | 1994-03-25 | 1995-10-13 | Tokyo Electron Ltd | 処理装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101920256A (zh) * | 2009-06-12 | 2010-12-22 | 东京毅力科创株式会社 | 等离子体处理装置用的消耗部件的再利用方法 |
Also Published As
Publication number | Publication date |
---|---|
TW200932368A (en) | 2009-08-01 |
KR101244096B1 (ko) | 2013-03-18 |
CN101689499A (zh) | 2010-03-31 |
KR20100057760A (ko) | 2010-06-01 |
CN101689499B (zh) | 2011-11-30 |
JP2009088157A (ja) | 2009-04-23 |
JP5179823B2 (ja) | 2013-04-10 |
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