CN101652847B - 电学互连结构及其形成方法 - Google Patents

电学互连结构及其形成方法 Download PDF

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Publication number
CN101652847B
CN101652847B CN200880011580.7A CN200880011580A CN101652847B CN 101652847 B CN101652847 B CN 101652847B CN 200880011580 A CN200880011580 A CN 200880011580A CN 101652847 B CN101652847 B CN 101652847B
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solder
metal core
solderless
substrate
conductive pad
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CN200880011580.7A
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Chinese (zh)
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CN101652847A (zh
Inventor
S·L·布奇瓦尔特
B·K·福尔曼
P·A·格鲁伯
罗载雄
史达元
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Ultratech Corp
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International Business Machines Corp
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    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/942—Dispositions of bond pads relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN200880011580.7A 2007-04-11 2008-03-26 电学互连结构及其形成方法 Expired - Fee Related CN101652847B (zh)

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US11/733,840 US7786001B2 (en) 2007-04-11 2007-04-11 Electrical interconnect structure and method
US11/733,840 2007-04-11
PCT/EP2008/053527 WO2008125440A1 (en) 2007-04-11 2008-03-26 Electrical interconnect structure and method of forming the same

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US7786001B2 (en) 2010-08-31
US20100230474A1 (en) 2010-09-16
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EP2156465A1 (en) 2010-02-24
CN101652847A (zh) 2010-02-17
JP5186550B2 (ja) 2013-04-17
US8476773B2 (en) 2013-07-02
ATE528796T1 (de) 2011-10-15
US8242010B2 (en) 2012-08-14
TW200849470A (en) 2008-12-16
TWI459505B (zh) 2014-11-01
US20100230475A1 (en) 2010-09-16
US20100230143A1 (en) 2010-09-16
EP2156465B1 (en) 2011-10-12
WO2008125440A1 (en) 2008-10-23
JP2010525558A (ja) 2010-07-22
US8541299B2 (en) 2013-09-24

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