CN101601147B - 压电陶瓷多层执行器的制造方法 - Google Patents

压电陶瓷多层执行器的制造方法 Download PDF

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Publication number
CN101601147B
CN101601147B CN200880003824.7A CN200880003824A CN101601147B CN 101601147 B CN101601147 B CN 101601147B CN 200880003824 A CN200880003824 A CN 200880003824A CN 101601147 B CN101601147 B CN 101601147B
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CN
China
Prior art keywords
multilayer
strip
multilayer strip
electrodes
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200880003824.7A
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English (en)
Chinese (zh)
Other versions
CN101601147A (zh
Inventor
A·伦克
C·舒
A·冈斯特
S·科尼利
A·曼托万
J·扎普夫
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Continental Automotive GmbH
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Siemens Corp
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Fuel-Injection Apparatus (AREA)
CN200880003824.7A 2007-01-31 2008-01-15 压电陶瓷多层执行器的制造方法 Expired - Fee Related CN101601147B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007004813.2A DE102007004813B4 (de) 2007-01-31 2007-01-31 Verfahren zur Herstellung eines piezokeramischen Vielschichtaktors
DE102007004813.2 2007-01-31
PCT/EP2008/050403 WO2008092740A2 (de) 2007-01-31 2008-01-15 Piezokeramischer vielschichtaktor und verfahren zu seiner herstellung

Publications (2)

Publication Number Publication Date
CN101601147A CN101601147A (zh) 2009-12-09
CN101601147B true CN101601147B (zh) 2011-08-03

Family

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Family Applications (1)

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CN200880003824.7A Expired - Fee Related CN101601147B (zh) 2007-01-31 2008-01-15 压电陶瓷多层执行器的制造方法

Country Status (7)

Country Link
US (1) US7905000B2 (enExample)
EP (1) EP2126995B1 (enExample)
JP (1) JP5167280B2 (enExample)
CN (1) CN101601147B (enExample)
AT (1) ATE540434T1 (enExample)
DE (1) DE102007004813B4 (enExample)
WO (1) WO2008092740A2 (enExample)

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DE102009028259A1 (de) * 2009-08-05 2011-02-10 Robert Bosch Gmbh Verfahren zur Herstellung von piezoelektrischen Werkstücken
DE102010022911B4 (de) 2010-06-07 2017-01-19 Continental Automotive Gmbh Verfahren zum Herstellen eines Piezoaktors und Piezoaktor
DE102010044739A1 (de) * 2010-09-08 2012-03-08 Epcos Ag Verfahren zum Herstellen von piezoelektrischen Aktoren aus einem Materialblock
DE102012101351A1 (de) * 2012-02-20 2013-08-22 Epcos Ag Vielschichtbauelement und Verfahren zum Herstellen eines Vielschichtbauelements
US10090454B2 (en) 2012-02-24 2018-10-02 Epcos Ag Method for producing an electric contact connection of a multilayer component
DE102012207598A1 (de) * 2012-05-08 2013-11-14 Continental Automotive Gmbh Verfahren zum elektrischen Kontaktieren eines elektronischen Bauelements als Stapel und elektronisches Bauelement mit einer Kontaktierungsstruktur
DE102012104830A1 (de) * 2012-06-04 2013-12-05 Epcos Ag Vielschichtbauelement und Verfahren zum Herstellen eines Vielschichtbauelements
DE102012105059A1 (de) 2012-06-12 2013-12-12 Epcos Ag Verfahren zur Herstellung eines Vielschichtbauelements und Vielschichtbauelement
DE102012105287B4 (de) 2012-06-18 2020-07-02 Tdk Electronics Ag Verfahren zur Herstellung eines elektrischen Bauelements und Elektrisches Bauelement
DE102012107341B4 (de) 2012-08-09 2020-07-09 Tdk Electronics Ag Verfahren zum Befüllen von mindestens einer Kavität eines Vielschichtbauelements mit einem Füllmaterial
DE102013111121B4 (de) * 2013-08-27 2020-03-26 Tdk Electronics Ag Verfahren zur Herstellung von keramischen Vielschichtbauelementen
DE102013017350B4 (de) 2013-10-17 2020-07-09 Tdk Electronics Ag Vielschichtbauelement und Verfahren zur Herstellung eines Vielschichtbauelements
DE102015214778A1 (de) * 2015-08-03 2017-02-09 Continental Automotive Gmbh Herstellungsverfahren zum Herstellen eines elektromechanischen Aktors und elektromechanischer Aktor
DE102015217334B3 (de) 2015-09-10 2016-12-01 Continental Automotive Gmbh Verfahren zum Herstellen eines als Stapel ausgebildeten Vielschichtaktors
DE102015218701A1 (de) * 2015-09-29 2016-12-01 Continental Automotive Gmbh Elektrokeramisches Bauelement, insbesondere Vielschichtpiezoaktor
US11437560B2 (en) * 2017-06-22 2022-09-06 Taiyo Yuden Co., Ltd. Multilayer piezoelectric element, piezoelectric vibration apparatus, and electronic device
CN109994597A (zh) * 2017-12-29 2019-07-09 苏州攀特电陶科技股份有限公司 多层压电陶瓷执行器及其制备方法
EP3654355A1 (de) 2018-11-14 2020-05-20 Siemens Aktiengesellschaft Elektroblech mit strukturierter oberfläche zur domänenverfeinerung
DE102019201650A1 (de) * 2019-02-08 2020-08-13 Pi Ceramic Gmbh Verfahren zur Herstellung eines piezoelektrischen Stapelaktors und piezoelektrischer Stapelaktor, vorzugsweise hergestellt nach dem Verfahren

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CN2480846Y (zh) * 2001-06-22 2002-03-06 中国科学院上海硅酸盐研究所 一种具有圆环状压电陶瓷多层膜结构的加速度传感器

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JPH01184968A (ja) 1988-01-20 1989-07-24 Hitachi Chem Co Ltd 積層型圧電素子の製造法
US4988909A (en) * 1989-01-20 1991-01-29 Mitsui Toatsu Chemicals, Inc. Piezoelectric element with giant electrostrictive effect and ceramic composition for preparing same
US5191688A (en) 1989-07-27 1993-03-09 Olympus Optical Co., Ltd. Method for producing a superior longitudinal vibrator
WO1992005593A1 (fr) * 1990-09-13 1992-04-02 Hitachi Metals, Ltd. Procede de fabrication d'elements possedant un effet d'electrostriction
JPH0529680A (ja) 1991-07-25 1993-02-05 Hitachi Metals Ltd 積層型変位素子およびその製造方法
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JP3149611B2 (ja) 1993-03-26 2001-03-26 株式会社村田製作所 積層セラミック電子部品の製造方法
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US5680685A (en) * 1995-06-07 1997-10-28 Microelectronic Packaging, Inc. Method of fabricating a multilayer ceramic capacitor
DE19615695C1 (de) * 1996-04-19 1997-07-03 Siemens Ag Verfahren zur Herstellung eines Piezoaktors monolithischer Vielschichtbauweise
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US5252883A (en) * 1991-01-30 1993-10-12 Nec Corporation Laminated type piezoelectric actuator
CN2480846Y (zh) * 2001-06-22 2002-03-06 中国科学院上海硅酸盐研究所 一种具有圆环状压电陶瓷多层膜结构的加速度传感器

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Also Published As

Publication number Publication date
JP2010517311A (ja) 2010-05-20
DE102007004813A1 (de) 2008-08-14
EP2126995B1 (de) 2012-01-04
JP5167280B2 (ja) 2013-03-21
EP2126995A2 (de) 2009-12-02
CN101601147A (zh) 2009-12-09
US20090320255A1 (en) 2009-12-31
WO2008092740A3 (de) 2008-09-18
WO2008092740A2 (de) 2008-08-07
DE102007004813B4 (de) 2016-01-14
US7905000B2 (en) 2011-03-15
ATE540434T1 (de) 2012-01-15

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Effective date of registration: 20160708

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Patentee after: Continental Automotive GmbH

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Patentee before: Siemens AG

CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20110803

Termination date: 20200115