CN101601126A - 用于球焊的金合金线 - Google Patents

用于球焊的金合金线 Download PDF

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Publication number
CN101601126A
CN101601126A CNA2008800001948A CN200880000194A CN101601126A CN 101601126 A CN101601126 A CN 101601126A CN A2008800001948 A CNA2008800001948 A CN A2008800001948A CN 200880000194 A CN200880000194 A CN 200880000194A CN 101601126 A CN101601126 A CN 101601126A
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quality
bonding
calcium
ball
europium
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CN101601126B (zh
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高田满生
手岛聪
桑原岳
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Tanaka Denshi Kogyo KK
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Tanaka Denshi Kogyo KK
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
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    • B23K35/3013—Au as the principal constituent
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Abstract

提供了用于球焊的金合金线，金合金包含：10－50ppm质量的镁(Mg)；5－20ppm质量的铕(Eu)；2－9ppm质量的钙(Ca)；和剩余部分，该剩余部分是具有最小99.998质量％纯度的金(Au)。在该用于球焊的金合金线中，钙(Ca)的添加量最大是铕(Eu)的添加量的一半。

Description

用于球焊的金合金线
技术领域
本发明涉及用于球焊的金合金线，并且涉及在线伸长率为4％时具有优异的拉伸试验断裂载荷的金合金线(在下文，记作线强度)；所述金合金线具有以下优点：形成熔融球时在熔融球的整个表面上具有较少的由氧化物产生的污染和缩孔；通过熔化形成的球具有优异的形状稳定性(在下文，记作熔融球的成形性)；在将熔化形成的球进行球焊时，压接球形状具有优异的圆度(在下文，记作压接球形状的圆度)；并且对于将线键合，具有优异的针脚式键合性，所述将线键合是通过用毛细管将其压着框架、基材等进行(在下文，记作针脚式键合性)。
背景技术
在将IC芯片上的电极与外部引线连接时，通过线进行互连的引线键合方法是已知的。在这些方法中，就将IC芯片上的铝电极与引线进行键合的方法而言，热超声键合和超声键合起主要作用。
在本文中，通常通过球焊键合方法进行热超声键合。通过转载专利文献1中图1所示的图，对按照球焊键合方法的键合方法进行了描述。
如图1A中所示，将线2插入毛细管1内，将线2的顶端布置成面对电炬3，并且在该状态下，在线2和电炬3之间发生放电，从而加热且熔化线2的顶端，由此形成球4。
随后，如图1B中所示，使毛细管1下降，以将所述球4按压并键合到IC芯片6的铝电极5上。此时，通过毛细管1给予超声振动(尽管未示出)，并且用加热部件加热IC芯片6。因此，球4被热压接，从而变为压接球4’。
然后，如图1C中所示，毛细管1在沿预定轨迹拉伸的同时，移动到外部引线8上并在其上下降。此时，通过毛细管1给予超声振动(虽然未示出)，并且用加热部件加热外部引线8。从而热压线2的边侧。通过热压进行的键合称作针脚式键合。
随后，如图1D中所示，升高夹持器7，并同时夹住线2，从而将线2截断。因此，完成线连接。
在用于球焊的一般金合金线中，线强度、熔融球成形性、压接球形状的圆度和针脚式键合性需要经受住实际应用。用于球焊的一般金合金线的伸长率设为2-6％。然而，当考虑到环成形性时，伸长率理想地是最小3％，并且特别理想地是4％。
对用于键合楔形物的金合金线，在专利文献1中，开发了这样的金合金线，在该金合金线中，向高纯度金添加1-100ppm质量的钙(Ca)，即金合金线的金纯度为最小99.9质量％，抗张强度为最小33.0kg/mm2，并且伸长率为1-3％。该金合金线具有优异的高温键合强度，适合于IC芯片的高密度线连接，并且还可通过楔焊而被良好地键合。
然而，当该金合金线用作球焊线时，压接球形状的圆度劣化，且因此不能够进行稳定的球焊。另外，在伸长率低时，环的形状不易于拉制。因此，环成形性劣化。其结果是，应用限于楔焊。这限制了金合金线用于半导体器件的范围。
另一方面，在专利文献2中，实施例13公开由如下构成的焊线：29ppm质量的镁(Mg)；10ppm质量的钙(Ca)；8ppm质量的铕(Eu)；和剩余部分，该剩余部分是纯度为99.999％的高纯度金。该焊线的特征在于，在半导体组装时不易于产生线断裂，并且半导体器件的组装成品率不降低。
然而，虽然该焊线具有优异的线强度，但如稍后所述的对比例2中所显而易见的，压接球形状的圆度差，并且不能认为针脚式键合性是令人满意的。
专利文献1：日本专利No.3657087
专利文献2：JP-A-H10-004114
发明内容
本发明要解决的问题
鉴于上述情况，本发明的目的是提供这样的金合金线，该金合金线与现有技术类似地具有优异的熔融球成形性、针脚式键合性和线强度，但其另外具有优异的压接球形状圆度并且可与半导体器件的高密度线连接相容。
解决问题的方法
通过对具有优异线强度的金合金线进行大量研究，本发明人最近发现，当微量的添加钙(Ca)最大是铕(Eu)的量的一半时，包括Ca-Mg-Eu预定范围内的微量添加元素系统的金合金，或者包括Ca-Mg-Eu-Sn的微量添加元素系统的金合金，表现出优异的线强度、熔融球成形性、压接球的圆度和针脚式键合性的效果，且因此实现了本发明。
具体地，根据本发明，提供了用于球焊的金合金线，金合金包含：10-50ppm质量的镁(Mg)；5-20ppm质量的铕(Eu)；2-9ppm质量的钙(Ca)；和剩余部分，该剩余部分是具有最小99.998质量％纯度的金(Au)，其中钙(Ca)的添加量最大是铕(Eu)的添加量的一半。
根据本发明，提供了用于球焊的金合金线，金合金包含：10-50ppm质量的镁(Mg)；1-30ppm质量的锡(Sn)；5-20ppm质量的铕(Eu)；2-9ppm质量的钙(Ca)；和剩余部分，该剩余部分是具有最小99.998质量％纯度的金(Au)，其中添加钙(Ca)的量最大是铕(Eu)的量的一半。
根据本发明，提供了用于球焊的金合金线，金合金包含：10-50ppm质量的镁(Mg)；5-20ppm质量的铕(Eu)；2-9ppm质量的钙(Ca)；和剩余部分，该剩余部分是具有最小99.998质量％纯度的金(Au)，其中添加钙(Ca)的量最大是铕(Eu)的量的一半，并且添加的微量铕(Eu)和钙(Ca)的总量最大是25ppm质量。
根据本发明，提供了用于球焊的金合金线，金合金包含：10-50ppm质量的镁(Mg)；1-30ppm质量的锡(Sn)；5-20ppm质量的铕(Bu)；2-9ppm质量的钙(Ca)；和剩余部分，该剩余部分是具有最小99.998质量％纯度的金(Au)，其中添加钙(Ca)的量最大是铕(Eu)的量的一半，并且添加的微量铕(Eu)和钙(Ca)的总量最大是25ppm质量。
在优选模式中，添加15-40ppm质量的微量添加的镁(Mg)。
本发明的效果
根据依照本发明的用于球焊的金合金线，包括Ca-Mg-Eu预定范围内的微量添加元素系统的金合金，或者包括Ca-Mg-Eu-Sn的微量添加元素系统的金合金，表现出优异的线强度、针脚式键合性、压接球形状的圆度和熔融球成形性的效果，并且有效改善半导体器件的生产率。特别地，在安装QFP或QFN封装等中(其中由于难以将元件固定在针脚式键合部分中而认为针脚式键合是困难的)，稳定的键合是可能的，且因此有效改善半导体器件的生产率。
附图说明
图1A、1B、1C和1D是按球焊方法分别说明键合方法的示意图。
图2A和2B分别显示了根据球焊方法和针脚式键合方法的键合部分的形状和尺寸。
图3是用于说明焊线的键合强度测量的示意图。
图4是显示用本发明的球焊所用金合金线进行球焊的实例的照片。
图5是显示用本发明的球焊所用金合金线进行针脚式键合的实例的照片。
参考数字的说明
1毛细管
2线
3电炬
4球
4′压接球
5Al电极
6IC芯片
7夹持器
8外部引线
D线直径
L1压接球直径
L2断裂(collapse)宽度
具体实施方式
在本发明中，添加微量元素的类型很少并且其构成范围窄且受限制。本发明的添加微量元素配比平衡的破坏可不利地影响线强度、针脚式键合性、压接球形状的圆度或熔融球成形性。因此，金(Au)的纯度理想地尽可能高。在本发明的合金系统中，当除金以外的添加微量元素和杂质元素的总和小于100ppm质量时，焊线可显示为具有最小99.99质量％纯度的高纯度金的焊线，且因此其在商业上是有利的。
(针脚式键合性和线强度)
焊线的针脚式键合性归类为固相键合。已知的是，有利地影响固相键合的现象是用于形成附着部分的变形性和在该附着部分的强键合力。
用于形成附着部分的变形性表示其易于进行弹性变形、塑性变形、蠕变、通过扩散变形等。该现象还适用于针脚式键合。对于焊线，认为线强度越低，用于形成附着部分的变形越容易。因此，在线强度和针脚式键合性之间存在负相关关系。
另一方面，在附着部分的键合力归因于多种现象例如化学键合力、凝集、表面粗糙度和表面状态等。然而，用于球焊的一般金合金线比其它金属焊线固有地具有更强的键合力。其原因是包含金的组合物的99质量％至99.99质量％以上的纯度，该组合物在环境中几乎不被氧化。因此认为，当存在较小的由添加元素或焊线表面上存在的该附件元素的氧化物引起的不利影响时，可在附着部分获得较强的键合力。
当使用具有最小99.999质量％纯度的高纯度金来制备球焊金线而根本不添加添加元素时，该线是软的，且因此用于形成附着部分的变形是容易的，并且不存在由添加元素或线表面上存在的添加元素氧化物引起的不利影响。其结果是，认为所得焊线具有最优异的针脚式键合性。然而，焊线需要同时具备多种功能，例如，如果焊线不具有一定的线强度，则产生实际问题如在树脂模(resin mold)时较差的线流动(wire flow)、和较差的环成形性。其结果是，为改善线强度，存在使用微量添加元素的需要。甚至在与纯金相比时，关于对附着部分处的键合强度的影响，用于本发明的所有添加微量元素是不可能抑制针脚式键合性的那些。
以预定配比使用本发明的添加微量元素还提供了改善线强度的效果。线表面上存在的添加元素的氧化物大概是由退火处理引起的，所述退火处理是在最终拉制加工后于熔点的约30％-60％的温度下进行的。在惰性气氛中进行退火处理或者在退火处理后化学洗涤线表面，可减小线表面上存在的氧化物。然而，在费用方面存在制造上的问题。本发明的方法更实用。
(熔融球成形性)
熔融球是通过在气氛中产生火花以熔化焊线的顶端所获得的球。在一些添加元素中，确认当添加量大时，在球的整个表面上或在球和线之间的界面(称作颈状部)部分生长添加元素的氧化物。在一些情形中，可在球的底部上产生缩孔。对于焊线性能，熔融球成形性是重要的，并且要求将氧化物和缩孔减至尽可能少。当以预定配比使用本发明的微量添加元素时，可获得能够经受住实际应用的令人满意的熔融球成形性。
(压接球形状的圆度)
因为半导体器件的高密度封装，IC芯片上铝电极的间隔和面积变得较为狭小。当在其间隔和面积狭小的铝电极上进行键合时，为防止相邻压接球的接触，对压接球形状的圆度的改进变得绝对必要。关于压接球形状的圆度，添加元素配比的影响是很大的，并且当配比平衡失败时，压接熔融球时的变形变得不均匀，且因此压接球形状的圆度不能得以维持。另外，类似于针脚式键合性，压接球形状的圆度趋于与线强度具有负相关性。当以预定配比使用本发明的微量添加元素时，可同时获得能够经受住实际应用的压接球形状圆度和线强度。
[Mg]
在本发明的合金系统中，镁(Mg)是在压接球形状的圆度方面最有效的元素。
在本发明的合金系统中，镁(Mg)是在线强度方面不非常有效的添加元素。
在本发明的合金系统中，需要最小10ppm质量的镁(Mg)。其原因是，在量小于此时，在压接球形状的圆度方面没有作用。在本发明的合金系统中，为稳定压接球形状的圆度，镁(Mg)的添加量优选为最小15ppm质量。另一方面，在本发明的合金系统中，当镁(Mg)的添加量变得过大即超过50ppm质量时，熔融球成形性受到不利影响。在本发明的合金系统中，为获得良好的熔融球成形性，镁(Mg)的添加量优选为最大40ppm质量。
[Eu]
在本发明的合金系统中，铕(Eu)也是在焊线线强度方面有效的元素，但不如稍后所述的钙(Ca)那样有效。
在本发明的合金系统中，铕(Eu)是在压接球形状的圆度方面有效的元素，但不如镁(Mg)那样有效。
在本发明的合金系统中，需要最小5ppm质量的铕(Eu)。其原因是，在量小于此时，在线强度方面没有作用。另一方面，在本发明的合金系统中，当铕(Eu)的添加量超过20ppm质量时，熔融球成形性受到不利影响。
[Ca]
在本发明的合金系统中，钙(Ca)是在焊线的线强度方面最有效的元素。然而，钙(Ca)还是不利地影响压接球形状的圆度的元素。因此，在本发明的合金系统中，钙(Ca)的有效组成范围限于非常窄的范围即2-9ppm质量。仅在该范围中，钙(Ca)可在本发明的合金系统中表现出作用。
其原因是，在本发明的合金系统中，当钙(Ca)的添加量小于2ppm质量时，在线强度方面没有作用，而当超过9ppm质量时，压接球形状的圆度受到不利影响。
[Eu+Ca]
在本发明的合金系统中，铕(Eu)据推测与钙(Ca)相互作用。即，铕(Eu)和(Ca)均是在线强度方面的有效添加元素，并且当这些附加微量元素一起添加时，线强度得到进一步改善。然而，总添加量理想地为最大25ppm质量。其原因是，当超过25ppm质量时，针脚式键合性和压接球形状的圆度受到不利影响。
另外，钙(Ca)的添加量需要最大是铕(Eu)的添加量的一半。其原因是，虽然钙(Ca)在线强度方面是最有效的元素，但不利地影响压接球形状的圆度。
[Sn]
在本发明的合金系统中，锡(Sn)是改善压接球形状的圆度的元素，但不如镁(Mg)那样有效。
在本发明的合金系统中，锡(Sn)在焊线的线强度方面不是非常有效的元素。
在本发明的合金系统中，为了使锡(Sn)表现出作用，需要镁(Mg)的存在。
在本发明的合金系统中，为了使锡(Sn)表现出作用，需要最小1ppm质量的锡(Sn)。其原因是，在量小于此时，锡(Sn)的作用被镁(Mg)所致的压接球形状的圆度改善效果消除，且因此锡(Sn)的额外作用没有显现。在本发明的合金系统中，当(Sn)变得过量即超过30ppm质量时，熔融球成形性受到不利影响。
(1)线强度
使用类似于常规方法的测量方法，评估基于本发明的金合金的线强度，所述线的伸长率调至4％。伸长率按如下进行评估：在室温下将标定点距离设为100mm；由拉力试验机以10mm/分钟的拉伸速度拉紧金合金线；并将金合金线断裂时获得的伸长量代入到下面的表达式中：
[表达式1]
Figure A20088000019400121
测定程序如下：通过最终热加工将具有25μm直径的线调至4.0％的伸长率；利用5根所测量的线的平均值作为测量值；并且具有高值的样品确定为良好。
更具体地，具有最小11.5g(112.7mN)的线强度的样品确定为“优”；具有小于11.5g(112.7mN)至最小10.0g(98mN)的线强度的样品确定为“良”；具有小于10.0g(98mN)至最小8.5g(83.3mN)的线强度的样品确定为“中”；以及具有小于8.5g(83.3mN)的线强度的样品确定为“差”
(2)熔融球成形性
可通过一般的扫描电子显微镜、光学显微镜观测容易地确认熔融球成形性。
在本发明中，测定程序如下：测量10个样品；其中通过扫描电子显微镜观测确认完全由氧化物引起的污染或缩孔最少为6个的样品确定为“差”；其中确认5至2处的样品确定为“中”；其中确认最多1处的样品确定为“良”。
(3)针脚式键合性
在针脚式键合性中，在通过毛细管给焊线施加载荷或超声波的同时，使焊线受压变形，并且将焊线键合在用Ag、Au、Pd等镀覆的框架或基材上。关于针脚式键合性，类似于常规金合金，本发明的金合金可维持高的针脚式键合性。
本发明的测量方法如下：使用用银(Ag)镀覆的由42合金制成的引线框；如图3中所示，在对测量位置进行限定使得压接球的中心位置设为0％和引线末端键合位置设为100％的同时，在接近90％引线末端键合位置进行测量。
该测量方法如下：使用刚键合后获得的样品；用夹具固定IC芯片侧部和引线末端；将线向上拉；并且在这种状态下测量剥离强度。在该测定中，使用30个所测样品的平均值作为测量值，并且具有高值的样品确定为良好。
更具体地，具有最小7.0g(68.6mN)的剥离强度的样品确定为“优”；具有小于7.0g(68.6mN)至最小5.0g(49.0mN)的剥离强度的样品确定为“良”；具有小于5.0g(49.0mN)至最小3.0g(29.4mN)的剥离强度的样品确定为“中”；以及具有小于3.0g(29.4mN)的剥离强度的样品确定为“差”。
(4)压接球形状的圆度
在下文描述了压接球形状的圆度的评估。在压接球直径达到约63μm的条件下对硅芯片上的铝电极(铝厚度：约7×10-8m)进行球焊，随后在用银(Ag)镀覆的由42合金制成的引线和电极之间进行针脚式键合，并且通过球焊方法在其之间进行连接。此时，跨距为3×10-3m，线的数目为200，以及在连接线中，任意使用50个压接球来评估压接球形状的圆度。测量超声施加方向、沿平行方向的压接直径和沿垂直方向的压接直径，并且由总共50个压接球进行评估的具有低标准偏差的样品确定为良好。
更具体地，具有小于0.7μm标准偏差的样品确定为“优”；具有最小0.7μm至小于1.0μm标准偏差的样品确定为“良”；具有最小1.0μm至小于1.5μm标准偏差的样品确定为“中”；以及具有最小1.5μm标准偏差的样品确定为“差”。
(5)金合金线的制造方法
描述了根据本发明的金合金线的优选制造方法。
将预定量的元素添加到高纯度金中，并在真空熔化炉中将所得混合物进行熔化用以铸造。使用槽轧(groove roll)轧机对铸锭进行轧制加工，并且使用拉线机将铸锭进行冷加工和中间退火。然后对所得坯锭施加最终拉制加工以获得具有25μm直径的细线，且然后进行最终退火以将伸长率调至4％。
对于根据本发明的合成组成，存在这样的温度范围，在该温度范围中，当最终退火温度升高时，4％的伸长率得以维持并且抗张强度逐渐降低。甚至以相同的组成，抗张强度取决于最终拉制加工率的大小而不同。因此，对最终拉制加工率和最终退火温度进行控制，以调节伸长率和抗张强度。这样，4％的伸长率得以维持。
效果
在具有最小99.999质量％纯度的金线中，线强度低并且还可观测到线强度随时间降低。因此，在用作焊线的金合金线中，添加预定量的添加元素，以将线强度提高到大于纯度为最小99.999质量％的金线的强度。商购的大部分焊线添加有铍(Be)、钙(Ca)和若干稀土元素。这些添加元素具有线强度改善效果。
另一方面，关于焊线所需的针脚式键合性，当线强度变得较强时，用于上文所述附着部分形成的变形变得困难，并且在为提高线强度而添加的添加元素增加时，附着部分的键合力降低，且因此针脚式键合性劣化。在本发明中，根据添加元素的类型，规定了若干添加元素，这些元素改善线强度，但对附着部分的键合力具有小的不利影响和劣化针脚式键合性的较小可能性，其结果是，发现钙(Ca)和铕(Eu)是最合适的添加元素。
然而，对于一般的焊线，除线强度和针脚式键合性外，还要求压接球形状的圆度。然而，已知，通常当线强度增加时，压接球形状的圆度变得难以保证。因此，为确保压接球形状的圆度，本发明的合金系统使用仅稍微影响线强度的镁(Mg)。相对于在线强度和针脚式键合性方面具有优越性的钙(Ca)，确定的是，甚至对于使用镁(Mg)的合金系统，当使用镁(Mg)而不考虑添加量或者与改善线强度的另外添加元素的相互作用时，压接球形状的圆度不能得到改善。
因此，考虑到添加量以及与改善线强度的另外添加元素的相互作用，对本发明的金合金系统中的钙(Ca)进行配合。其结果是，通过着眼于钙(Ca)和铕(Eu)之间的配比，在维持改善压接球形状的圆度的同时，实现了针脚式键合性和线强度二者的改善。
更具体地，在本发明的合金系统中，与铕(Eu)相比，钙(Ca)在焊线的线强度方面具有较强作用。因此，为了使钙(Ca)对焊线的线强度的影响是次要的并且使铕(Eu)对焊线的线强度的影响是主要的，钙(Ca)的添加量设为最大是铕(Eu)的添加量的一半。
实施例
在下文，参考表1对实施例和对比例进行描述。
向具有99.999质量％纯度的高纯度金以微量添加预定量的添加元素，在真空熔化炉中对所得混合物进行熔化并然后进行铸造。由此，获得具有表1的左栏所列出的组成的金合金坯锭。使用槽轧轧机对所述坯锭进行轧制加工，并且使用拉线机将坯锭进行冷加工和中间退火。然后对所得坯锭施加最终拉制加工以获得具有25μm直径的细线，并且其后进行最终退火以将伸长率调至4％。
通过使用球焊装置(UTC1000型，SHINKAWA LTD制造)将金合金线键合至按压在IC芯片的铝电极上的球，并且在该状态下，对镀银引线末端实施针脚式键合。在图4中显示了球压接的一个实例的照片，并且在图5中显示了针脚式键合实例的照片。
此时在IC芯片侧部上的键合条件为：30g的载荷；12毫秒的键合时间；和300mW的超声波功率。另一方面，引线末端侧上的键合条件为：40g的载荷；10毫秒的键合时间；和400mW的超声波功率。共同键合条件即键合温度为200℃。所使用的毛细管由SPT Japan K.K.制造的SBNS-33CD-AZM-1/16-XL。
随后，通过使用刚键合后的样品，在铝电极上方测得压接球形状的圆度，并且由接近引线末端的线剥离强度测得针脚式键合性。在表1的右栏显示了各自的测量结果。
[表1]实施例和对比例的金合金组成和性能表
Figure A20088000019400161
由测量结果可理解如下：
(1)关于实施例1至12，当用扫描电子显微镜进行观测时，没有发现那样多的完全由氧化物引起的污染或收缩孔，并且熔融球成形性经受住实际应用，且因此是令人满意的。与此相反，在其中镁(Mg)的添加量超过上限值的对比例4和其中锡(Sn)的添加量超过上限值的对比例5中，扫描电子显微镜观测可检测到许多完全由氧化物引起的污染或收缩孔，且因此熔融球成形性没有经受住实际应用，因而是不令人满意的。
(2)在所有实施例1至12中，压接球形状的圆度经受住了实际应用，且因此是令人满意的。与此相反，在其中钙(Ca)的添加量超过上限值的对比例1和对比例2中(在对比例1中，铕(Eu)和钙(Ca)的总添加量也超过25ppm质量的上限值)，压接球形状的圆度在熔融球被压接时没有经受住实际应用，且因此是不令人满意的。另外，同样在其中钙(Ca)的添加量没有达到最大为铕(Eu)的添加量的一半的对比例3中(在对比例3中，铕(Eu)和钙(Ca)的总添加量也超过25ppm质量的上限值)，压接球的圆度没有经受住实际应用，且因此是不令人满意的。
(3)在所有实施例1至12中，针脚式键合性是稳定化的，其结果是，样品均经受住实际应用，且因此是令人满意的。与此相反，在其中钙(Ca)和铕(Eu)的添加量没有满足下限值的对比例4中，针脚式键合性是稳定化的，但线强度不足，且因此对比例4没有经受住实际应用，因而是不令人满意的。在其中钙(Ca)的添加量超过上限值的对比例1和对比例3中，线强度是令人满意的，但针脚式键合性不足，且因此这些对比例没有经受住实际应用，因而是不令人满意的。
工业实用性
根据本发明的用于球焊的金合金线，包括Ca-Mg-Eu预定范围的微量添加元素系统的Au合金，或者包括Ca-Mg-Eu-Sn的微量添加元素系统的金合金，表现出优异的压接球形状圆度效果，在改善熔融球成形性、针脚式键合性、线强度和半导体器件的可靠性方面是有效的，这类似于常规情形，并且具有非常大的工业应用价值。

Claims (5)

1.用于球焊的金合金线，金合金包含：
10-50ppm质量的镁(Mg)；
5-20ppm质量的铕(Eu)；
2-9ppm质量的钙(Ca)；和
剩余部分，该剩余部分是具有最小99.998质量％纯度的金(Au)，其中
钙(Ca)的添加量最大是铕(Eu)的添加量的一半。
2.用于球焊的金合金线，金合金包含：
10-50ppm质量的镁(Mg)；
1-30ppm质量的锡(Sn)；
5-20ppm质量的铕(Eu)；
2-9ppm质量的钙(Ca)；和
剩余部分，该剩余部分是具有最小99.998质量％纯度的金(Au)，其中
钙(Ca)的添加量最大是铕(Eu)的添加量的一半。
3.用于球焊的金合金线，金合金包含：
10-50ppm质量的镁(Mg)；
5-20ppm质量的铕(Eu)；
2-9ppm质量的钙(Ca)；和
剩余部分，该剩余部分是具有最小99.998质量％纯度的金(Au)，其中
钙(Ca)的重量最大是铕(Eu)的重量的一半，并且铕(Eu)和钙(Ca)的总添加量最大是25ppm质量。
4.用于球焊的金合金线，金合金包含：
10-50ppm质量的镁(Mg)；
1-30ppm质量的锡(Sn)；
5-20ppm质量的铕(Eu)；
2-9ppm质量的钙(Ca)；和
剩余部分，该剩余部分是具有最小99.998质量％纯度的金(Au)，其中
钙(Ca)的添加量最大是铕(Eu)的添加量的一半，并且铕(Eu)和钙(Ca)的总添加量最大是25ppm质量。
5.根据权利要求1至4中任一项的用于球焊的金合金线，其中镁(Mg)是15-40ppm质量。
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