TWI371812B - Gold alloy wire for ball bonding - Google Patents

Gold alloy wire for ball bonding

Info

Publication number
TWI371812B
TWI371812B TW097134412A TW97134412A TWI371812B TW I371812 B TWI371812 B TW I371812B TW 097134412 A TW097134412 A TW 097134412A TW 97134412 A TW97134412 A TW 97134412A TW I371812 B TWI371812 B TW I371812B
Authority
TW
Taiwan
Prior art keywords
alloy wire
gold alloy
ball bonding
bonding
ball
Prior art date
Application number
TW097134412A
Other languages
English (en)
Other versions
TW200933772A (en
Inventor
Mitsuo Takada
Satoshi Teshima
Takeshi Kuwahara
Original Assignee
Tanaka Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Electronics Ind filed Critical Tanaka Electronics Ind
Publication of TW200933772A publication Critical patent/TW200933772A/zh
Application granted granted Critical
Publication of TWI371812B publication Critical patent/TWI371812B/zh

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Classifications

    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
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    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
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    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
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    • H01L2924/20—Parameters
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    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T428/12—All metal or with adjacent metals

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  • Engineering & Computer Science (AREA)
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  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
TW097134412A 2007-10-24 2008-09-08 Gold alloy wire for ball bonding TWI371812B (en)

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JP2007276104A JP4134261B1 (ja) 2007-10-24 2007-10-24 ボールボンディング用金合金線

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JP (1) JP4134261B1 (zh)
KR (1) KR101047827B1 (zh)
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US5945065A (en) * 1996-07-31 1999-08-31 Tanaka Denshi Kogyo Method for wedge bonding using a gold alloy wire
JP3669811B2 (ja) * 1997-04-25 2005-07-13 田中電子工業株式会社 半導体素子ボンディング用金合金線
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EP2204846A1 (en) 2010-07-07
KR101047827B1 (ko) 2011-07-08
MY155023A (en) 2015-08-28
CN101601126A (zh) 2009-12-09
JP4134261B1 (ja) 2008-08-20
US8147750B2 (en) 2012-04-03
CN101601126B (zh) 2012-06-20
US20100226816A1 (en) 2010-09-09
EP2204846A4 (en) 2014-01-15
TW200933772A (en) 2009-08-01
WO2009054164A1 (ja) 2009-04-30
JP2009105250A (ja) 2009-05-14

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