CN101589125B - 粘合剂组合物以及带粘合剂的光学膜 - Google Patents

粘合剂组合物以及带粘合剂的光学膜 Download PDF

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CN101589125B
CN101589125B CN2008800028404A CN200880002840A CN101589125B CN 101589125 B CN101589125 B CN 101589125B CN 2008800028404 A CN2008800028404 A CN 2008800028404A CN 200880002840 A CN200880002840 A CN 200880002840A CN 101589125 B CN101589125 B CN 101589125B
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methyl
blooming
organopolysiloxane
binder compsn
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CN101589125A (zh
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板垣明成
竹厚流
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Shin Etsu Chemical Co Ltd
Sumitomo Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
Sumitomo Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
    • C08G18/625—Polymers of alpha-beta ethylenically unsaturated carboxylic acids; hydrolyzed polymers of esters of these acids
    • C08G18/6254—Polymers of alpha-beta ethylenically unsaturated carboxylic acids and of esters of these acids containing hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/28—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen sulfur-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polarising Elements (AREA)
  • Adhesive Tapes (AREA)
CN2008800028404A 2007-01-22 2008-01-18 粘合剂组合物以及带粘合剂的光学膜 Active CN101589125B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007010990 2007-01-22
JP010990/2007 2007-01-22
PCT/JP2008/050587 WO2008090813A1 (ja) 2007-01-22 2008-01-18 粘着剤組成物及び粘着剤付き光学フィルム

Publications (2)

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CN101589125A CN101589125A (zh) 2009-11-25
CN101589125B true CN101589125B (zh) 2012-08-22

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JP (1) JP5251518B2 (ko)
KR (1) KR101528540B1 (ko)
CN (1) CN101589125B (ko)
TW (1) TWI415915B (ko)
WO (1) WO2008090813A1 (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5349019B2 (ja) * 2007-12-27 2013-11-20 日本合成化学工業株式会社 光学部材用粘着剤組成物、光学部材用粘着剤及び粘着剤層付き光学部材
US9243168B2 (en) * 2009-12-14 2016-01-26 Cheil Industries, Inc. Adhesive composition and optical member using the same
JP5889035B2 (ja) 2012-02-22 2016-03-22 リンテック株式会社 粘着シート
JP5951323B2 (ja) * 2012-04-04 2016-07-13 日東電工株式会社 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着剤層付光学フィルムおよび画像表示装置
JP5765303B2 (ja) * 2012-08-20 2015-08-19 信越化学工業株式会社 光学用感圧接着剤組成物
JP5988889B2 (ja) * 2013-02-15 2016-09-07 リンテック株式会社 粘着性組成物、粘着剤および粘着シート
JP2016014827A (ja) * 2014-07-03 2016-01-28 チェイル インダストリーズ インコーポレイテッド 光学フィルム（ｆｉｌｍ）用粘着剤、光学フィルム、及び表示装置
US9725552B2 (en) 2014-10-14 2017-08-08 Industrial Technology Research Institute HMF-based phenol formaldehyde resin
JP6721341B2 (ja) * 2016-01-13 2020-07-15 住友化学株式会社 粘着剤組成物
CN109563387B (zh) * 2016-08-17 2021-03-02 三菱化学株式会社 丙烯酸类粘合剂组合物、和使用其而成的粘合剂、偏光板用粘合剂、以及图像显示装置
JP6502999B2 (ja) * 2017-04-17 2019-04-17 リンテック株式会社 粘着性組成物、粘着剤および粘着シート
WO2019031486A1 (ja) * 2017-08-07 2019-02-14 日東電工株式会社 粘着剤層、粘着剤層付光学フィルム、光学積層体、および画像表示装置
CN114958221B (zh) * 2021-02-26 2024-01-16 太仓斯迪克新材料科技有限公司 用于显示屏的柔性保护贴膜
CN114958235B (zh) * 2021-02-26 2023-12-19 太仓斯迪克新材料科技有限公司 柔性光学胶膜的制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1043331A (zh) * 1988-09-16 1990-06-27 罗姆和哈斯公司 使用改性胶乳聚合物层压胶粘剂组合物制造柔性电子电路

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3498158B2 (ja) * 1994-06-01 2004-02-16 綜研化学株式会社 液晶素子用感圧接着剤組成物および液晶素子
JP3389338B2 (ja) * 1994-07-06 2003-03-24 信越化学工業株式会社 加水分解性官能基含有オルガノポリシロキサンの製造方法及び硬化性樹脂組成物
JP3487940B2 (ja) * 1995-01-24 2004-01-19 日本合成化学工業株式会社 粘着剤組成物
JP2006290994A (ja) * 2005-04-08 2006-10-26 Daio Paper Corp 粘着シート
JP2008174672A (ja) * 2007-01-22 2008-07-31 Shin Etsu Chem Co Ltd 有機官能基及び炭素原子数が異なる複数種のアルコキシ基を含有するオルガノポリシロキサン

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1043331A (zh) * 1988-09-16 1990-06-27 罗姆和哈斯公司 使用改性胶乳聚合物层压胶粘剂组合物制造柔性电子电路

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开2006-290994A 2006.10.26
JP特开平8-199130A 1996.08.06

Also Published As

Publication number Publication date
KR101528540B1 (ko) 2015-06-12
CN101589125A (zh) 2009-11-25
JP5251518B2 (ja) 2013-07-31
TWI415915B (zh) 2013-11-21
TW200902661A (en) 2009-01-16
JPWO2008090813A1 (ja) 2010-05-20
WO2008090813A1 (ja) 2008-07-31
KR20090122198A (ko) 2009-11-26

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